HK1155032A1 - Metal base circuit board - Google Patents

Metal base circuit board

Info

Publication number
HK1155032A1
HK1155032A1 HK11109132.7A HK11109132A HK1155032A1 HK 1155032 A1 HK1155032 A1 HK 1155032A1 HK 11109132 A HK11109132 A HK 11109132A HK 1155032 A1 HK1155032 A1 HK 1155032A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
metal base
base circuit
metal
board
Prior art date
Application number
HK11109132.7A
Other languages
English (en)
Inventor
Taiki Nishi
Takeshi Miyakawa
Kiyokazu Yamazaki
Takashi Saiki
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of HK1155032A1 publication Critical patent/HK1155032A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
HK11109132.7A 2008-05-29 2011-08-30 Metal base circuit board HK1155032A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008140303 2008-05-29
PCT/JP2009/059363 WO2009145109A1 (ja) 2008-05-29 2009-05-21 金属ベース回路基板

Publications (1)

Publication Number Publication Date
HK1155032A1 true HK1155032A1 (en) 2012-05-04

Family

ID=41376987

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11109132.7A HK1155032A1 (en) 2008-05-29 2011-08-30 Metal base circuit board

Country Status (10)

Country Link
US (1) US8426740B2 (xx)
EP (1) EP2293656B1 (xx)
JP (1) JP5517927B2 (xx)
KR (1) KR101517649B1 (xx)
CN (1) CN102047772B (xx)
CA (1) CA2726173C (xx)
HK (1) HK1155032A1 (xx)
MY (1) MY154125A (xx)
TW (1) TWI441574B (xx)
WO (1) WO2009145109A1 (xx)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110261847A1 (en) * 2010-04-27 2011-10-27 Chou Hsi-Yan Light emitting devices
JP5545983B2 (ja) * 2010-05-10 2014-07-09 電気化学工業株式会社 基板の製造方法及び回路基板の製造方法
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
JP5938849B2 (ja) * 2011-03-31 2016-06-22 住友ベークライト株式会社 絶縁層形成用組成物、絶縁層形成用フィルムおよび基板
JP2012243846A (ja) * 2011-05-17 2012-12-10 Sumitomo Chemical Co Ltd 金属ベース回路基板および発光素子
KR101818752B1 (ko) * 2011-05-18 2018-01-15 엘지이노텍 주식회사 발광소자 어레이
JP2013026284A (ja) * 2011-07-15 2013-02-04 Toyo Aluminium Kk 実装基板用放熱積層材の製造方法
CN102913803B (zh) * 2011-08-03 2015-10-07 展晶科技(深圳)有限公司 发光二极管灯条
JP2013045788A (ja) * 2011-08-22 2013-03-04 Toyo Aluminium Kk 発光素子用実装基板
JP5906621B2 (ja) * 2011-09-08 2016-04-20 日立化成株式会社 電子部品の製造方法及び固定治具
JP5198638B2 (ja) * 2011-09-21 2013-05-15 株式会社東芝 発光素子モジュール基板の製造方法
EP2745046B1 (en) * 2011-09-23 2015-11-25 Koninklijke Philips N.V. Lighting device with a circuit board mounting
JP2013149947A (ja) * 2011-12-19 2013-08-01 Shinko Electric Ind Co Ltd 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
JP5848976B2 (ja) 2012-01-25 2016-01-27 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP2013153068A (ja) 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
JP6096413B2 (ja) * 2012-01-25 2017-03-15 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP6012990B2 (ja) * 2012-03-19 2016-10-25 日本軽金属株式会社 放熱器一体型基板の製造方法
CN102686019A (zh) * 2012-05-22 2012-09-19 深圳市华星光电技术有限公司 电路板、led灯条及led灯条的制造方法
CN103313509B (zh) * 2013-04-24 2016-08-17 上舜电子科技（中国）有限公司 一种金属基导电线路板及其制作方法
CN105594005B (zh) * 2013-10-03 2018-07-03 夏普株式会社 发光装置以及发光装置的制造方法
TWI550801B (zh) * 2013-11-13 2016-09-21 南茂科技股份有限公司 封裝結構及其製造方法
WO2015092579A1 (en) * 2013-12-18 2015-06-25 Koninklijke Philips N.V. Reflective solder mask layer for led phosphor package
WO2015104928A1 (ja) * 2014-01-10 2015-07-16 シャープ株式会社 発光装置用基板、発光装置および発光装置用基板の製造方法
TW201533484A (zh) * 2014-02-21 2015-09-01 Hon Hai Prec Ind Co Ltd 光通訊模組及其組裝方法
CN104865651A (zh) * 2014-02-24 2015-08-26 鸿富锦精密工业（深圳）有限公司 光通信模块及其组装方法
KR102235500B1 (ko) * 2014-09-12 2021-04-05 엘지이노텍 주식회사 무기충전재, 이를 포함하는 에폭시 수지 조성물, 그리고 이를 이용한 절연층을 포함하는 발광소자
CN106574075B (zh) * 2014-06-19 2019-11-19 Lg伊诺特有限公司 无机填料、包含其的环氧树脂组合物和包含使用所述组合物的绝缘层的发光元件
KR102150607B1 (ko) * 2014-09-12 2020-09-01 엘지이노텍 주식회사 무기충전재, 이를 포함하는 에폭시 수지 조성물, 그리고 이를 이용한 절연층을 포함하는 발광소자
CN104576908A (zh) * 2014-12-23 2015-04-29 苏州汉克山姆照明科技有限公司 一种led封装基板
JP2016162971A (ja) 2015-03-04 2016-09-05 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
CN104993041B (zh) * 2015-06-04 2019-06-11 陈建伟 一种led倒装芯片固晶导电粘接结构及其安装方法
TWI610163B (zh) * 2016-01-05 2018-01-01 利用分群以利於快速開關機之方法
US11882651B2 (en) 2019-05-23 2024-01-23 Signify Holding B.V. Stable PCB for solid state light source application

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165393A (ja) 1986-01-16 1987-07-21 三洋電機株式会社 混成集積回路基板
JP2996507B2 (ja) * 1990-11-02 2000-01-11 電気化学工業株式会社 金属板ベース回路基板
JPH098422A (ja) * 1995-06-16 1997-01-10 Hitachi Chem Co Ltd 金属ベース多層配線板
JP3209132B2 (ja) * 1997-02-27 2001-09-17 日立化成工業株式会社 金属ベース基板
JP2000353826A (ja) * 1999-06-09 2000-12-19 Sanyo Electric Co Ltd 混成集積回路装置および光照射装置
US6548832B1 (en) 1999-06-09 2003-04-15 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US6413620B1 (en) * 1999-06-30 2002-07-02 Kyocera Corporation Ceramic wiring substrate and method of producing the same
CN1327516C (zh) * 2001-05-30 2007-07-18 株式会社萌利克 半导体器件
JP4079604B2 (ja) 2001-05-30 2008-04-23 株式会社ルネサステクノロジ 半導体装置の製造方法
US7038142B2 (en) * 2002-01-24 2006-05-02 Fujitsu Limited Circuit board and method for fabricating the same, and electronic device
JP2003347742A (ja) * 2002-05-27 2003-12-05 Hitachi Ltd 多層回路基板とその製造法及び多層回路用基板並びに電子装置
DE10308095B3 (de) * 2003-02-24 2004-10-14 Infineon Technologies Ag Elektronisches Bauteil mit mindestens einem Halbleiterchip auf einem Schaltungsträger und Verfahren zur Herstellung desselben
US8092900B2 (en) * 2004-08-05 2012-01-10 Kaneka Corporation Solution, component for plating, insulating sheet, laminate, and printed circuit board
JP2006165043A (ja) * 2004-12-02 2006-06-22 Toyota Industries Corp 回路基板及び半導体装置
JP4634856B2 (ja) * 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
JP2007012856A (ja) 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Ｌｅｄ装置及びｌｅｄ装置用筐体
JP4619214B2 (ja) * 2005-07-04 2011-01-26 日東電工株式会社 配線回路基板
WO2007037190A1 (ja) * 2005-09-27 2007-04-05 Matsushita Electric Industrial Co., Ltd. 放熱配線基板とその製造方法と放熱配線基板を用いた電気機器
JP5183045B2 (ja) 2006-07-20 2013-04-17 三洋電機株式会社 回路装置
JP2008060372A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 回路装置およびその製造方法、配線基板およびその製造方法

Also Published As

Publication number Publication date
KR20110019754A (ko) 2011-02-28
CA2726173A1 (en) 2009-12-03
EP2293656A4 (en) 2011-11-02
CN102047772A (zh) 2011-05-04
EP2293656A1 (en) 2011-03-09
KR101517649B1 (ko) 2015-05-04
EP2293656B1 (en) 2012-12-12
JPWO2009145109A1 (ja) 2011-10-13
TW201004501A (en) 2010-01-16
CN102047772B (zh) 2012-12-26
MY154125A (en) 2015-05-15
US8426740B2 (en) 2013-04-23
JP5517927B2 (ja) 2014-06-11
TWI441574B (zh) 2014-06-11
CA2726173C (en) 2016-02-23
WO2009145109A1 (ja) 2009-12-03
US20110132644A1 (en) 2011-06-09

Similar Documents

Publication Publication Date Title
HK1155032A1 (en) Metal base circuit board
EP2160082A4 (en) PCB WITH METAL BASE
HK1212106A1 (en) Connection arrangement on circuit boards
TWI370515B (en) Circuit component
TWI371830B (en) Circuit board process
GB2453083B (en) Printed circuit boards
TWI315658B (en) Warp-proof circuit board structure
GB2481771B (en) Printed circuit board cooling assembly
GB2468572B (en) Circuit board retainer
HK1158431A1 (en) Circuit board component and circuit board
EP2187435A4 (en) ELECTRONIC COMPONENT
TWI372008B (en) Printed circuit board
EP2416355A4 (en) MAP OF PRINTED CIRCUITS
IL210815A0 (en) Retainer for printed circuit boards
EP2329696A4 (en) SWITCHBOARD
TWI341648B (en) Osciuating circuit
GB0815096D0 (en) Printed circuit boards
TWI366955B (en) Circuit board connection structure
GB0808869D0 (en) Printed circuit board including anti-countefeiting means
EP2461368A4 (en) TERMINAL PLATE CIRCUIT
PL2163998T3 (pl) Obwód pomocniczy
EP2263316A4 (en) CONFIGURATION OF ELECTRONIC COMPONENT
TWI367058B (en) Circuit board
TWI351237B (en) Circuit board structure
EP2249630A4 (en) CIRCUIT BOARD