HK1139818A1 - Connector, manufacture method for connector and anisotropic conductive film to be used therein - Google Patents
Connector, manufacture method for connector and anisotropic conductive film to be used thereinInfo
- Publication number
- HK1139818A1 HK1139818A1 HK10105570.5A HK10105570A HK1139818A1 HK 1139818 A1 HK1139818 A1 HK 1139818A1 HK 10105570 A HK10105570 A HK 10105570A HK 1139818 A1 HK1139818 A1 HK 1139818A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- connector
- conductive film
- manufacture method
- anisotropic conductive
- anisotropic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008109171A JP4814277B2 (ja) | 2008-04-18 | 2008-04-18 | 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜 |
PCT/JP2009/056268 WO2009128336A1 (ja) | 2008-04-18 | 2009-03-27 | 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1139818A1 true HK1139818A1 (en) | 2010-09-24 |
Family
ID=41199035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10105570.5A HK1139818A1 (en) | 2008-04-18 | 2010-06-07 | Connector, manufacture method for connector and anisotropic conductive film to be used therein |
Country Status (7)
Country | Link |
---|---|
US (2) | US20100085720A1 (xx) |
JP (1) | JP4814277B2 (xx) |
KR (1) | KR101082238B1 (xx) |
CN (1) | CN101690426B (xx) |
HK (1) | HK1139818A1 (xx) |
TW (1) | TWI391763B (xx) |
WO (1) | WO2009128336A1 (xx) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4762377B2 (ja) | 2009-11-13 | 2011-08-31 | 三井・デュポンポリケミカル株式会社 | アモルファスシリコン太陽電池モジュール |
KR101219139B1 (ko) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
DE102011075009B4 (de) * | 2011-04-29 | 2019-11-14 | Continental Automotive Gmbh | Auf einem Träger angeordnete Kontaktfläche zur Verbindung mit einer auf einem weiteren Träger angeordneten Gegenkontaktfläche |
US9526285B2 (en) * | 2012-12-18 | 2016-12-27 | Intel Corporation | Flexible computing fabric |
JP5652580B1 (ja) * | 2013-05-29 | 2015-01-14 | 日本軽金属株式会社 | 導電部材 |
JP2015179831A (ja) * | 2014-02-27 | 2015-10-08 | デクセリアルズ株式会社 | 接続体、接続体の製造方法及び検査方法 |
TWI781710B (zh) * | 2014-10-28 | 2022-10-21 | 日商迪睿合股份有限公司 | 異向性導電膜、其製造方法及連接構造體 |
JP6181038B2 (ja) * | 2014-12-26 | 2017-08-16 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
AU2019200594B2 (en) | 2018-02-08 | 2020-05-28 | Covidien Lp | System and method for local three dimensional volume reconstruction using a standard fluoroscope |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04342971A (ja) * | 1991-05-21 | 1992-11-30 | Sumitomo Metal Ind Ltd | 電気的接続部材の製造方法 |
EP0501358B1 (en) * | 1991-02-25 | 1997-01-15 | Canon Kabushiki Kaisha | Connecting method and apparatus for electric circuit components |
JP3035021B2 (ja) * | 1991-08-29 | 2000-04-17 | 株式会社リコー | 液晶表示素子およびその製造方法 |
JPH06283226A (ja) * | 1993-07-16 | 1994-10-07 | Hitachi Chem Co Ltd | 回路の接続構造体 |
US5592365A (en) * | 1993-12-21 | 1997-01-07 | Sharp Kabushiki Kaisha | Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch |
US20010046021A1 (en) * | 1997-08-28 | 2001-11-29 | Takeshi Kozuka | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
JPH11163501A (ja) * | 1997-12-02 | 1999-06-18 | Rohm Co Ltd | 電子部品の実装方法、およびその方法によって製造された電子回路装置 |
JP3624729B2 (ja) * | 1998-04-06 | 2005-03-02 | セイコーエプソン株式会社 | Icチップ、ic構造体、液晶装置及び電子機器 |
TW570203U (en) * | 1998-08-03 | 2004-01-01 | Rohm Co Ltd | Liquid crystal display element |
JP2000294894A (ja) * | 1998-12-21 | 2000-10-20 | Seiko Epson Corp | 回路基板およびその製造方法ならびに回路基板を用いた表示装置および電子機器 |
US6284086B1 (en) * | 1999-08-05 | 2001-09-04 | Three - Five Systems, Inc. | Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive |
JP3633422B2 (ja) * | 2000-02-22 | 2005-03-30 | ソニーケミカル株式会社 | 接続材料 |
KR100456064B1 (ko) * | 2001-07-06 | 2004-11-08 | 한국과학기술원 | 극미세 피치 cog 기술용 이방성 전도성 필름 |
JP2003051661A (ja) * | 2001-08-03 | 2003-02-21 | Sekisui Chem Co Ltd | 導電接続構造体の製造方法 |
JP2003092317A (ja) * | 2001-09-19 | 2003-03-28 | Jsr Corp | シート状コネクターおよびプローブ装置 |
JP3886401B2 (ja) * | 2002-03-25 | 2007-02-28 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続構造体の製造方法 |
JP3722137B2 (ja) * | 2002-08-21 | 2005-11-30 | セイコーエプソン株式会社 | 半導体装置の実装方法、半導体装置の実装構造、電気光学装置、電気光学装置の製造方法及び電子機器 |
TWI285947B (en) * | 2002-10-11 | 2007-08-21 | Ind Tech Res Inst | Packaging structure by using micro-capsule adhesive material and its packaging method |
EP1612891B1 (en) * | 2003-03-31 | 2011-11-30 | Sumitomo Electric Industries, Ltd. | Anisotropic electrically conductive film and method of producing the same |
JP2004342764A (ja) * | 2003-05-14 | 2004-12-02 | Sekisui Chem Co Ltd | 導電接続フィルム及び導電接続構造体 |
KR20050079399A (ko) * | 2004-02-05 | 2005-08-10 | 삼성전자주식회사 | 이방성도전필름 및 범프와, 이를 갖는 반도체 칩의 실장구조체 |
JP4385794B2 (ja) * | 2004-02-26 | 2009-12-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接続方法 |
WO2005122657A1 (ja) * | 2004-06-11 | 2005-12-22 | Ibiden Co., Ltd. | フレックスリジッド配線板とその製造方法 |
JP4692544B2 (ja) * | 2005-04-14 | 2011-06-01 | パナソニック株式会社 | 電子回路装置およびその製造方法 |
JP2007048589A (ja) * | 2005-08-10 | 2007-02-22 | Japan Aviation Electronics Industry Ltd | 電気接続用シート及びその製造方法 |
JP2007165816A (ja) * | 2005-11-15 | 2007-06-28 | Mitsui Mining & Smelting Co Ltd | プリント配線基板、その製造方法およびその使用方法 |
KR100747336B1 (ko) * | 2006-01-20 | 2007-08-07 | 엘에스전선 주식회사 | 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법 |
US20100321908A1 (en) * | 2007-02-22 | 2010-12-23 | Motoji Shiota | Electronic circuit device, production method thereof, and display device |
EP1978559A3 (en) * | 2007-04-06 | 2013-08-28 | Hitachi, Ltd. | Semiconductor device |
-
2008
- 2008-04-18 JP JP2008109171A patent/JP4814277B2/ja active Active
-
2009
- 2009-03-27 WO PCT/JP2009/056268 patent/WO2009128336A1/ja active Application Filing
- 2009-03-27 CN CN2009800004870A patent/CN101690426B/zh active Active
- 2009-03-27 KR KR1020097026365A patent/KR101082238B1/ko active IP Right Grant
- 2009-04-17 TW TW098112864A patent/TWI391763B/zh active
- 2009-12-09 US US12/633,993 patent/US20100085720A1/en not_active Abandoned
-
2010
- 2010-06-07 HK HK10105570.5A patent/HK1139818A1/xx unknown
-
2012
- 2012-02-29 US US13/408,418 patent/US20120153008A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2009260131A (ja) | 2009-11-05 |
US20100085720A1 (en) | 2010-04-08 |
CN101690426A (zh) | 2010-03-31 |
TW200949396A (en) | 2009-12-01 |
JP4814277B2 (ja) | 2011-11-16 |
US20120153008A1 (en) | 2012-06-21 |
KR20100009591A (ko) | 2010-01-27 |
KR101082238B1 (ko) | 2011-11-09 |
TWI391763B (zh) | 2013-04-01 |
WO2009128336A1 (ja) | 2009-10-22 |
CN101690426B (zh) | 2012-01-04 |
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