HK1118849A1 - Latent curing agent - Google Patents

Latent curing agent

Info

Publication number
HK1118849A1
HK1118849A1 HK08110834.1A HK08110834A HK1118849A1 HK 1118849 A1 HK1118849 A1 HK 1118849A1 HK 08110834 A HK08110834 A HK 08110834A HK 1118849 A1 HK1118849 A1 HK 1118849A1
Authority
HK
Hong Kong
Prior art keywords
curing agent
latent curing
latent
agent
curing
Prior art date
Application number
HK08110834.1A
Other languages
English (en)
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1118849A1 publication Critical patent/HK1118849A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/08—Cellulose derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polyurethanes Or Polyureas (AREA)
HK08110834.1A 2005-06-06 2008-09-29 Latent curing agent HK1118849A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005165093 2005-06-06
JP2006026912A JP5057011B2 (ja) 2005-06-06 2006-02-03 潜在性硬化剤
PCT/JP2006/311054 WO2006132133A1 (ja) 2005-06-06 2006-06-02 潜在性硬化剤

Publications (1)

Publication Number Publication Date
HK1118849A1 true HK1118849A1 (en) 2009-02-20

Family

ID=37498333

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08110834.1A HK1118849A1 (en) 2005-06-06 2008-09-29 Latent curing agent

Country Status (6)

Country Link
JP (1) JP5057011B2 (xx)
KR (1) KR101255397B1 (xx)
CN (1) CN101189274B (xx)
HK (1) HK1118849A1 (xx)
TW (1) TW200704666A (xx)
WO (1) WO2006132133A1 (xx)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5057011B2 (ja) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5267757B2 (ja) * 2006-02-07 2013-08-21 デクセリアルズ株式会社 潜在性硬化剤
JP5130501B2 (ja) * 2007-01-24 2013-01-30 デクセリアルズ株式会社 潜在性硬化剤
US8147720B2 (en) 2007-01-24 2012-04-03 Sony Corporation Latent curing agent
JP5298431B2 (ja) * 2007-01-24 2013-09-25 デクセリアルズ株式会社 潜在性硬化剤
JP5045895B2 (ja) * 2007-04-04 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
JP5045896B2 (ja) * 2007-04-05 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
JP5707662B2 (ja) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物
JP5382846B2 (ja) * 2008-06-10 2014-01-08 日本化薬株式会社 感光性化合物、それを含む組成物及びその硬化物
JP5321082B2 (ja) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
CN101906231B (zh) * 2009-06-02 2012-07-04 财团法人工业技术研究院 聚乙烯醇膜组合物及包含其的偏光板
JP5365811B2 (ja) * 2010-06-28 2013-12-11 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤
JP7221075B2 (ja) 2019-02-15 2023-02-13 デクセリアルズ株式会社 潜在性硬化剤及びその製造方法、並びにカチオン硬化性組成物
JP2022034224A (ja) * 2020-08-18 2022-03-03 旭化成株式会社 マスターバッチ型熱硬化性樹脂組成物、及び熱硬化性樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817537B2 (ja) * 1979-06-25 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
JPS58187427A (ja) * 1982-04-28 1983-11-01 Toshiba Corp エポキシ樹脂系組成物
JPH05313173A (ja) * 1992-05-11 1993-11-26 Toshiba Corp 液晶セル
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JP2000239472A (ja) * 1998-12-24 2000-09-05 Kansai Paint Co Ltd 硬化性樹脂組成物
JP2002212537A (ja) * 2001-01-24 2002-07-31 Sony Chem Corp 接着剤及び電気装置
JP3802373B2 (ja) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3565797B2 (ja) * 2001-06-06 2004-09-15 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP4148685B2 (ja) * 2002-02-18 2008-09-10 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP4582770B2 (ja) * 2004-06-29 2010-11-17 スタンレー電気株式会社 発光ダイオード用封止樹脂及びそれを使用した発光ダイオード
JP5057011B2 (ja) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤

Also Published As

Publication number Publication date
JP5057011B2 (ja) 2012-10-24
WO2006132133A1 (ja) 2006-12-14
JP2007016202A (ja) 2007-01-25
CN101189274B (zh) 2011-05-25
TW200704666A (en) 2007-02-01
TWI365199B (xx) 2012-06-01
CN101189274A (zh) 2008-05-28
KR101255397B1 (ko) 2013-04-17
KR20080012939A (ko) 2008-02-12

Similar Documents

Publication Publication Date Title
HK1118849A1 (en) Latent curing agent
EP1862855A4 (en) LIGHT-SENSITIVE RESIN COMPOSITION
HK1119441A1 (en) Toner
EP1944655A4 (en) TONER
GB2429950B (en) Copying
PL2175273T3 (pl) Środek nadający kokumi
TWI370956B (en) Dense opc
EP1950617A4 (en) RESIN FOR A TONER AND TONER
GB0513552D0 (en) Bandage
EP1923406A4 (en) RESIN COMPOSITION
HK1115997A1 (en) Latent curing agent
SG122900A1 (en) Photosensitive resin composition
EP1950309A4 (en) ALBUMIN DENATURING AGENCY
EP1857493A4 (en) RUBBER COMPOSITION
GB0521796D0 (en) Gtgvr software application
SG124382A1 (en) Photosensitive resin composition
EP1923742A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
EP1962142A4 (en) TONER
IL179238A0 (en) Improved prebiotic
PL1811990T3 (pl) Środki przeciw demodekozie
EP1710279A4 (en) CURING COMPOSITION
SG124383A1 (en) Photosensitive resin composition
EP1927347A4 (en) MEANS TO REDUCE BITTERNESS
EP1889660A4 (en) OZONE-GROWING AGENT
EP1937192A4 (en) orthosis