TW200704666A - Latent curing agent - Google Patents

Latent curing agent

Info

Publication number
TW200704666A
TW200704666A TW095119944A TW95119944A TW200704666A TW 200704666 A TW200704666 A TW 200704666A TW 095119944 A TW095119944 A TW 095119944A TW 95119944 A TW95119944 A TW 95119944A TW 200704666 A TW200704666 A TW 200704666A
Authority
TW
Taiwan
Prior art keywords
curing agent
latent curing
aluminum chelate
water
based latent
Prior art date
Application number
TW095119944A
Other languages
Chinese (zh)
Other versions
TWI365199B (en
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chemicals&Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals&Information Device Corp filed Critical Sony Chemicals&Information Device Corp
Publication of TW200704666A publication Critical patent/TW200704666A/en
Application granted granted Critical
Publication of TWI365199B publication Critical patent/TWI365199B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/08—Cellulose derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

Disclosed is an aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin at a comparatively low temperature in a short time. Also disclosed is a method for producing such an aluminum chelate-based latent curing agent by which method curing conditions of the aluminum chelate-based latent curing agent can be controlled comparatively easily. Specifically disclosed is an aluminum chelate-based latent curing agent obtained by reacting an aluminum chelating agent with a silsesquioxane-type oxethane derivative in the presence of a water-insoluble or poorly water-soluble cellulose ether. This latent curing agent has a coating layer composed of the water-insoluble or poorly water-soluble cellulose ether. The surface of this latent curing agent is preferably treated with an isocyanate compound.
TW095119944A 2005-06-06 2006-06-06 Latent curing agent TW200704666A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005165093 2005-06-06
JP2006026912A JP5057011B2 (en) 2005-06-06 2006-02-03 Latent curing agent

Publications (2)

Publication Number Publication Date
TW200704666A true TW200704666A (en) 2007-02-01
TWI365199B TWI365199B (en) 2012-06-01

Family

ID=37498333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119944A TW200704666A (en) 2005-06-06 2006-06-06 Latent curing agent

Country Status (6)

Country Link
JP (1) JP5057011B2 (en)
KR (1) KR101255397B1 (en)
CN (1) CN101189274B (en)
HK (1) HK1118849A1 (en)
TW (1) TW200704666A (en)
WO (1) WO2006132133A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5057011B2 (en) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent
JP5267757B2 (en) * 2006-02-07 2013-08-21 デクセリアルズ株式会社 Latent curing agent
JP5130501B2 (en) * 2007-01-24 2013-01-30 デクセリアルズ株式会社 Latent curing agent
JP5298431B2 (en) * 2007-01-24 2013-09-25 デクセリアルズ株式会社 Latent curing agent
CN101595152B (en) 2007-01-24 2012-06-27 索尼化学&信息部件株式会社 Latent curing agent
JP5045895B2 (en) * 2007-04-04 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent for epoxy resin and method for producing the same
JP5045896B2 (en) * 2007-04-05 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent for epoxy resin and method for producing the same
JP5707662B2 (en) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 Thermosetting epoxy resin composition
JP5382846B2 (en) * 2008-06-10 2014-01-08 日本化薬株式会社 Photosensitive compound, composition containing the same and cured product thereof
JP5321082B2 (en) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 Aluminum chelate-based latent curing agent and method for producing the same
CN101906231B (en) * 2009-06-02 2012-07-04 财团法人工业技术研究院 Polyvinyl alcohol membrane composition and polarizer containing same
JP5365811B2 (en) * 2010-06-28 2013-12-11 デクセリアルズ株式会社 Aluminum chelate latent curing agent
JP7221075B2 (en) * 2019-02-15 2023-02-13 デクセリアルズ株式会社 Latent curing agent, method for producing the same, and cationic curable composition
JP2022034224A (en) * 2020-08-18 2022-03-03 旭化成株式会社 Master batch-type thermosetting resin composition and thermosetting resin composition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817537B2 (en) * 1979-06-25 1983-04-07 株式会社東芝 Epoxy resin composition
JPS58187427A (en) * 1982-04-28 1983-11-01 Toshiba Corp Epoxy resin composition
JPH05313173A (en) * 1992-05-11 1993-11-26 Toshiba Corp Liquid crystal cell
JP3454437B2 (en) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション One-part epoxy resin adhesive composition with low viscosity and no solvent
JP2000239472A (en) * 1998-12-24 2000-09-05 Kansai Paint Co Ltd Curable resin composition
JP2002212537A (en) * 2001-01-24 2002-07-31 Sony Chem Corp Adhesive and electric device
JP3802373B2 (en) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 Latent curing agent, method for producing latent curing agent, and adhesive
JP3565797B2 (en) * 2001-06-06 2004-09-15 ソニーケミカル株式会社 Latent curing agent, method for producing latent curing agent, and adhesive
JP3875859B2 (en) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 Curing agent particles, method for producing curing agent particles, and adhesive
JP4148685B2 (en) * 2002-02-18 2008-09-10 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent, method for producing latent curing agent, and adhesive
JP4381255B2 (en) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent
JP4582770B2 (en) * 2004-06-29 2010-11-17 スタンレー電気株式会社 Sealing resin for light emitting diode and light emitting diode using the same
JP5057011B2 (en) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent

Also Published As

Publication number Publication date
CN101189274A (en) 2008-05-28
JP2007016202A (en) 2007-01-25
CN101189274B (en) 2011-05-25
KR101255397B1 (en) 2013-04-17
TWI365199B (en) 2012-06-01
HK1118849A1 (en) 2009-02-20
WO2006132133A1 (en) 2006-12-14
JP5057011B2 (en) 2012-10-24
KR20080012939A (en) 2008-02-12

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