HK1115997A1 - Latent curing agent - Google Patents

Latent curing agent

Info

Publication number
HK1115997A1
HK1115997A1 HK08106381.6A HK08106381A HK1115997A1 HK 1115997 A1 HK1115997 A1 HK 1115997A1 HK 08106381 A HK08106381 A HK 08106381A HK 1115997 A1 HK1115997 A1 HK 1115997A1
Authority
HK
Hong Kong
Prior art keywords
curing agent
latent curing
latent
agent
curing
Prior art date
Application number
HK08106381.6A
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1115997A1 publication Critical patent/HK1115997A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/682—Alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/02—Cellulose; Modified cellulose
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/59—Stability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polyurethanes Or Polyureas (AREA)
HK08106381.6A 2006-02-07 2008-06-10 Latent curing agent HK1115997A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006030038A JP5267757B2 (en) 2006-02-07 2006-02-07 Latent curing agent
PCT/JP2006/322713 WO2007091358A1 (en) 2006-02-07 2006-11-15 Latent curing agent

Publications (1)

Publication Number Publication Date
HK1115997A1 true HK1115997A1 (en) 2008-12-12

Family

ID=38344965

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08106381.6A HK1115997A1 (en) 2006-02-07 2008-06-10 Latent curing agent

Country Status (6)

Country Link
JP (1) JP5267757B2 (en)
KR (1) KR101342766B1 (en)
CN (1) CN101115782B (en)
HK (1) HK1115997A1 (en)
TW (1) TWI404741B (en)
WO (1) WO2007091358A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008090690A1 (en) * 2007-01-24 2008-07-31 Sony Chemical & Information Device Corporation Latent curing agent
CN101595152B (en) * 2007-01-24 2012-06-27 索尼化学&信息部件株式会社 Latent curing agent
JP5298431B2 (en) * 2007-01-24 2013-09-25 デクセリアルズ株式会社 Latent curing agent
JP5707662B2 (en) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 Thermosetting epoxy resin composition
JP5417715B2 (en) 2008-02-20 2014-02-19 デクセリアルズ株式会社 Microencapsulated silane coupling agent
JP5382846B2 (en) * 2008-06-10 2014-01-08 日本化薬株式会社 Photosensitive compound, composition containing the same and cured product thereof
JP5321082B2 (en) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 Aluminum chelate-based latent curing agent and method for producing the same
KR101940166B1 (en) 2016-04-14 2019-01-18 삼성에스디아이 주식회사 Composition for forming poroun heat-resistance layer, separator comprising the porous heat-resistance layer, and electrochemical battery using the separator
JP6948114B2 (en) 2016-06-15 2021-10-13 デクセリアルズ株式会社 Thermosetting epoxy resin composition and its manufacturing method
JP6670688B2 (en) * 2016-06-15 2020-03-25 デクセリアルズ株式会社 Latent curing agent, method for producing the same, and thermosetting epoxy resin composition
DE112019000385T5 (en) * 2018-01-12 2020-09-17 Ajinomoto Co., Inc. Coated Particle
JP2022034224A (en) * 2020-08-18 2022-03-03 旭化成株式会社 Master batch-type thermosetting resin composition and thermosetting resin composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078899B2 (en) * 1987-03-12 1995-02-01 田岡化学工業株式会社 Curable composition
JPH05313173A (en) * 1992-05-11 1993-11-26 Toshiba Corp Liquid crystal cell
JP3875859B2 (en) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 Curing agent particles, method for producing curing agent particles, and adhesive
JP4148685B2 (en) * 2002-02-18 2008-09-10 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent, method for producing latent curing agent, and adhesive
CN100376648C (en) * 2002-12-05 2008-03-26 索尼化学株式会社 Potential hardening agent, producing process and binder thereof
CN1285660C (en) * 2002-12-05 2006-11-22 索尼化学株式会社 Potential hardening agent, producing process and binder thereof
JP2004339366A (en) * 2003-05-15 2004-12-02 Kawaken Fine Chem Co Ltd Resin curing agent and curable resin composition
JP4381255B2 (en) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent
JP5057011B2 (en) * 2005-06-06 2012-10-24 ソニーケミカル＆インフォメーションデバイス株式会社 Latent curing agent

Also Published As

Publication number Publication date
CN101115782B (en) 2012-02-08
CN101115782A (en) 2008-01-30
TWI404741B (en) 2013-08-11
JP2007211056A (en) 2007-08-23
TW200738774A (en) 2007-10-16
KR20080092832A (en) 2008-10-16
KR101342766B1 (en) 2013-12-19
WO2007091358A1 (en) 2007-08-16
JP5267757B2 (en) 2013-08-21

Similar Documents

Publication Publication Date Title
EP2031451A4 (en) Toner
EP2031453A4 (en) Toner
HK1115997A1 (en) Latent curing agent
EP2063322A4 (en) Toner
EP1995638A4 (en) Toner
EP2056163A4 (en) Positive photosensitive resin composition
EP2060405A4 (en) Photosensitive resin composition
HK1118849A1 (en) Latent curing agent
EP2221326A4 (en) Photosensitive resin composition
GB0603781D0 (en) Application verification
EP2204699A4 (en) Toner
EP2196861A4 (en) Toner
GB0709295D0 (en) New Zealander
IL202487A0 (en) Contrast agents
EP2136252A4 (en) Toner
HK1139857A1 (en) Wrinkling-preventing and-modifying agent
EP2236594A4 (en) Biofilm-removing agent
IL192799A0 (en) Substituted 4-phenylpiperidines
EP2221057A4 (en) Sense-improving agent
EP2062892A4 (en) Hypertension-ameliorating agent
EP2030629A4 (en) Lipid-metabolism-improving agent
EP2214719A4 (en) Metallofullerene contrast agents
EP2168955A4 (en) Sleep-improving agent
ZA200903382B (en) Substituted 4-imidazoles
EP2060263A4 (en) Lipid-metabolism-ameliorating agent