WO2008090690A1 - Latent curing agent - Google Patents

Latent curing agent Download PDF

Info

Publication number
WO2008090690A1
WO2008090690A1 PCT/JP2007/074228 JP2007074228W WO2008090690A1 WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1 JP 2007074228 W JP2007074228 W JP 2007074228W WO 2008090690 A1 WO2008090690 A1 WO 2008090690A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum
curing agent
latent curing
thermocurable
agent
Prior art date
Application number
PCT/JP2007/074228
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiko Komuro
Tadasu Kawashima
Masahiko Ito
Daisuke Masuko
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to JP2008554984A priority Critical patent/JP5130501B2/en
Priority to TW096150211A priority patent/TW200833730A/en
Publication of WO2008090690A1 publication Critical patent/WO2008090690A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is a thermocurable composition which comprises an aluminum-chelate latent curing agent that can cationically polymerize and cure a thermocurable compound at a relatively low temperature and within a short period, which ensures satisfactory levels of latency and storage stability, and which shows a sharp exothermic peak in DSC. Specifically disclosed is a thermocurable composition comprising: an aluminum-chelate latent curing agent which is produced by reacting an aluminum-chelating agent with a silsesquioxane-type oxetane derivative in the presence of a water-insoluble or slightly water-soluble cellulose ether to bring the aluminum-chelating agent into a latent state; a trialkoxysilyl-containing coupling agent; and a thermocurable compound, wherein each alkoxy group in the trialkoxysilyl-containing coupling agent has 2 or more carbon atoms.
PCT/JP2007/074228 2007-01-24 2007-12-17 Latent curing agent WO2008090690A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008554984A JP5130501B2 (en) 2007-01-24 2007-12-17 Latent curing agent
TW096150211A TW200833730A (en) 2007-01-24 2007-12-26 Latent curing agent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014089 2007-01-24
JP2007-014089 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090690A1 true WO2008090690A1 (en) 2008-07-31

Family

ID=39644268

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074228 WO2008090690A1 (en) 2007-01-24 2007-12-17 Latent curing agent

Country Status (3)

Country Link
JP (1) JP5130501B2 (en)
TW (1) TW200833730A (en)
WO (1) WO2008090690A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114075323A (en) * 2020-08-18 2022-02-22 旭化成株式会社 Masterbatch type thermosetting resin composition and thermosetting resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132133A1 (en) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation Latent curing agent

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267757B2 (en) * 2006-02-07 2013-08-21 デクセリアルズ株式会社 Latent curing agent

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006132133A1 (en) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation Latent curing agent

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114075323A (en) * 2020-08-18 2022-02-22 旭化成株式会社 Masterbatch type thermosetting resin composition and thermosetting resin composition

Also Published As

Publication number Publication date
JPWO2008090690A1 (en) 2010-05-13
TW200833730A (en) 2008-08-16
JP5130501B2 (en) 2013-01-30

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