WO2009060576A1 - Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same - Google Patents

Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same Download PDF

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Publication number
WO2009060576A1
WO2009060576A1 PCT/JP2008/003113 JP2008003113W WO2009060576A1 WO 2009060576 A1 WO2009060576 A1 WO 2009060576A1 JP 2008003113 W JP2008003113 W JP 2008003113W WO 2009060576 A1 WO2009060576 A1 WO 2009060576A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing agent
latent curing
powder
powder epoxy
Prior art date
Application number
PCT/JP2008/003113
Other languages
French (fr)
Japanese (ja)
Inventor
Daisuke Sato
Kazutaka Baba
Yusuke Fujita
Atsushi Ohyagi
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007290542A external-priority patent/JP5430059B2/en
Priority claimed from JP2007296347A external-priority patent/JP5450951B2/en
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to KR1020107009773A priority Critical patent/KR101495383B1/en
Priority to CN200880113506.6A priority patent/CN101842407B/en
Publication of WO2009060576A1 publication Critical patent/WO2009060576A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • C08G59/4028Isocyanates; Thioisocyanates

Abstract

Disclosed is a method for producing a latent curing agent for epoxy resins, which is characterized by comprising specific steps (A)-(F). Also disclosed are a latent curing agent for powder epoxy resins, and a curable epoxy resin composition having excellent storage stability and excellent thermal curability.
PCT/JP2008/003113 2007-11-08 2008-10-30 Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same WO2009060576A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107009773A KR101495383B1 (en) 2007-11-08 2008-10-30 Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same
CN200880113506.6A CN101842407B (en) 2007-11-08 2008-10-30 Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007290542A JP5430059B2 (en) 2007-11-08 2007-11-08 Method for producing latent curing agent for powdery epoxy resin, latent curing agent for powdery epoxy resin obtained by the method, and composition for curable epoxy resin using the same
JP2007-290542 2007-11-08
JP2007-296347 2007-11-15
JP2007296347A JP5450951B2 (en) 2007-11-15 2007-11-15 Method for producing latent curing agent for powdery epoxy resin, latent curing agent for powdery epoxy resin obtained by the method, and curable epoxy resin composition containing the latent curing agent

Publications (1)

Publication Number Publication Date
WO2009060576A1 true WO2009060576A1 (en) 2009-05-14

Family

ID=40625485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003113 WO2009060576A1 (en) 2007-11-08 2008-10-30 Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same

Country Status (4)

Country Link
KR (1) KR101495383B1 (en)
CN (1) CN101842407B (en)
TW (1) TWI480305B (en)
WO (1) WO2009060576A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081192A1 (en) * 2010-12-17 2012-06-21 株式会社Adeka Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
DE102016212508A1 (en) 2016-07-08 2018-01-11 Tesa Se Curable adhesive and reactive adhesive tapes based thereon
WO2019101916A1 (en) * 2017-11-24 2019-05-31 Tesa Se Curable composition based on fatty-acid modified epoxy resins and curing agents

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200277489A1 (en) * 2017-09-15 2020-09-03 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
CN111349311A (en) * 2018-12-22 2020-06-30 浙江林境环保包装有限公司 Powdery epoxy resin composition, prepreg and composite material board thereof
CN113897118A (en) * 2021-11-02 2022-01-07 烟台金桥优尼科新材料科技有限公司 Environment-friendly ultrahigh-solid-content epoxy coating orange paint and preparation method and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05310888A (en) * 1992-01-24 1993-11-22 W R Grace & Co Improved latent curing agent for epoxy resin and preparation thereof
JPH05331264A (en) * 1992-01-22 1993-12-14 W R Grace & Co Spherical latent curing agent for epoxy resin and its production
JP2001031738A (en) * 1999-07-23 2001-02-06 Asahi Denka Kogyo Kk Curable epoxy resin composition
JP2007204669A (en) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp Curing agent for epoxy resin, having specific small particle diameter particle size distribution and epoxy resin composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK0459745T3 (en) * 1990-05-28 1998-03-30 Nat Starch Chem Invest Curing agent for epoxy resin
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
CN1242022A (en) * 1996-12-31 2000-01-19 国际壳牌研究有限公司 Waterborne curing agent composition comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures
CN1294142A (en) * 1999-10-28 2001-05-09 机械工业部广州电器科学研究所 Composite solidifying agent of epoxy resin and its preparing process
CN1513893A (en) * 2003-03-18 2004-07-21 上海回天化工新材料有限公司 Epoxy resin lalent solidifying agent
CN1233684C (en) * 2004-06-25 2005-12-28 哈尔滨工业大学 Method for preparation of moderate temperature cured latent epoxy resin curing agent
CN101016369A (en) * 2007-03-02 2007-08-15 浙江大学 Microcapsule incubated epoxide curing agent and preparing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331264A (en) * 1992-01-22 1993-12-14 W R Grace & Co Spherical latent curing agent for epoxy resin and its production
JPH05310888A (en) * 1992-01-24 1993-11-22 W R Grace & Co Improved latent curing agent for epoxy resin and preparation thereof
JP2001031738A (en) * 1999-07-23 2001-02-06 Asahi Denka Kogyo Kk Curable epoxy resin composition
JP2007204669A (en) * 2006-02-03 2007-08-16 Asahi Kasei Chemicals Corp Curing agent for epoxy resin, having specific small particle diameter particle size distribution and epoxy resin composition

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081192A1 (en) * 2010-12-17 2012-06-21 株式会社Adeka Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
JP2012126859A (en) * 2010-12-17 2012-07-05 Adeka Corp Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
TWI506052B (en) * 2010-12-17 2015-11-01 Adeka Corp Master-batch type latent curing agent for epoxy resin, and epoxy resin composition using the same
US9464161B2 (en) 2010-12-17 2016-10-11 Adeka Corporation Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
DE102016212508A1 (en) 2016-07-08 2018-01-11 Tesa Se Curable adhesive and reactive adhesive tapes based thereon
WO2018007123A1 (en) 2016-07-08 2018-01-11 Tesa Se Curable adhesive compound and reactive adhesive tapes based thereon
US11008455B2 (en) 2016-07-08 2021-05-18 Tesa Se Curable adhesive compound and reactive adhesive tapes based thereon
WO2019101916A1 (en) * 2017-11-24 2019-05-31 Tesa Se Curable composition based on fatty-acid modified epoxy resins and curing agents

Also Published As

Publication number Publication date
KR101495383B1 (en) 2015-02-24
KR20100087146A (en) 2010-08-03
CN101842407A (en) 2010-09-22
TW200927783A (en) 2009-07-01
CN101842407B (en) 2014-04-23
TWI480305B (en) 2015-04-11

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