HK1118303A1 - Latent hardener for epoxy resin and epoxy resin composition - Google Patents

Latent hardener for epoxy resin and epoxy resin composition

Info

Publication number
HK1118303A1
HK1118303A1 HK08109321.3A HK08109321A HK1118303A1 HK 1118303 A1 HK1118303 A1 HK 1118303A1 HK 08109321 A HK08109321 A HK 08109321A HK 1118303 A1 HK1118303 A1 HK 1118303A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
latent hardener
resin composition
composition
hardener
Prior art date
Application number
HK08109321.3A
Other languages
English (en)
Inventor
Hisanao Yamamoto
Kazuhiro Daikai
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of HK1118303A1 publication Critical patent/HK1118303A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
    • C08G18/643—Reaction products of epoxy resins with at least equivalent amounts of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/771—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/7806—Nitrogen containing -N-C=0 groups
    • C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
    • C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Polyurethanes Or Polyureas (AREA)
HK08109321.3A 2005-02-23 2008-08-20 Latent hardener for epoxy resin and epoxy resin composition HK1118303A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005046615 2005-02-23
PCT/JP2006/303311 WO2006090794A1 (fr) 2005-02-23 2006-02-23 Durcisseur latent pour resine epoxy et composition de resine epoxy

Publications (1)

Publication Number Publication Date
HK1118303A1 true HK1118303A1 (en) 2009-02-06

Family

ID=36927432

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08109321.3A HK1118303A1 (en) 2005-02-23 2008-08-20 Latent hardener for epoxy resin and epoxy resin composition

Country Status (9)

Country Link
US (1) US20080251757A1 (fr)
EP (1) EP1852452A1 (fr)
JP (1) JP4753934B2 (fr)
KR (1) KR100938523B1 (fr)
CN (1) CN101128502B (fr)
CA (1) CA2601950C (fr)
HK (1) HK1118303A1 (fr)
TW (1) TW200640978A (fr)
WO (1) WO2006090794A1 (fr)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2625794A1 (fr) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy
EP1980580A1 (fr) * 2006-02-03 2008-10-15 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite
WO2008090719A1 (fr) 2007-01-24 2008-07-31 Sony Chemical & Information Device Corporation Agent de durcissage latent
KR100920612B1 (ko) * 2007-11-08 2009-10-08 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름
KR20100120685A (ko) * 2008-02-11 2010-11-16 엠이엠씨 일렉트로닉 머티리얼즈, 인크. 잉곳을 웨이퍼로 와이어소우 슬라이싱하는데 사용되는 탄소 나노튜브 강화 와이어소우 빔
KR101329887B1 (ko) * 2008-02-28 2013-11-18 세키스이가가쿠 고교가부시키가이샤 경화성 에폭시 조성물, 이방성 도전 재료 및 접속 구조체
WO2009117345A2 (fr) 2008-03-17 2009-09-24 Henkel Corporation Compositions adhésives pouvant être utilisées dans des applications de report de puces
JP2009269976A (ja) * 2008-05-02 2009-11-19 Taiyo Ink Mfg Ltd 導電性樹脂組成物
TWI449723B (zh) * 2009-02-27 2014-08-21 Asahi Kasei E Materials Corp A hardening agent for a microcapsule type epoxy resin, a hardener composition for a masterbatch type epoxy resin, a single-liquid epoxy resin composition, and a processed product
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
WO2010144236A1 (fr) * 2009-06-12 2010-12-16 Trillion Science, Inc. Durcisseur latent pour des compositions d'époxy
JP2012529555A (ja) * 2009-06-12 2012-11-22 トリリオン サイエンス インク エポキシ組成物用潜在性硬化剤
US8044154B2 (en) * 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
JP5509709B2 (ja) * 2009-07-24 2014-06-04 日清紡ケミカル株式会社 燃料電池セパレータ
JP2011032387A (ja) * 2009-08-03 2011-02-17 Toppan Forms Co Ltd 硬化性組成物
JP5565931B2 (ja) * 2009-10-01 2014-08-06 株式会社Ａｄｅｋａ シリコンウエハ接着性樹脂組成物
US8698320B2 (en) 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
KR20130061132A (ko) 2010-04-16 2013-06-10 발스파 소싱 인코포레이티드 패키징 용품을 위한 코팅 조성물 및 코팅 방법
KR101161360B1 (ko) * 2010-07-13 2012-06-29 엘에스전선 주식회사 공간전하 저감 효과를 갖는 직류용 전력 케이블
BR112013020026B1 (pt) 2011-02-07 2021-03-02 Swimc Llc artigo, composição de revestimento, e, método
US8974899B1 (en) * 2011-05-24 2015-03-10 The United States Of America As Represented By The Secretary Of The Air Force Pseudomorphic glass for space solar cells
JP2013001875A (ja) * 2011-06-20 2013-01-07 Asahi Kasei E-Materials Corp マスターバッチ型硬化剤組成物、それを用いる一液性エポキシ樹脂組成物及び成形品、並びにマスターバッチ型硬化剤組成物の製造方法
JP5869911B2 (ja) * 2012-02-23 2016-02-24 株式会社タムラ製作所 熱硬化性樹脂組成物
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
WO2014025411A1 (fr) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Système de revêtement de récipient
ES2849526T3 (es) 2012-08-09 2021-08-19 Swimc Llc Composiciones para contenedores y otros artículos y métodos de utilización de los mismos
EP2997083A1 (fr) * 2013-05-16 2016-03-23 LORD Corporation Revêtement aqueux conducteur
EP3131965B1 (fr) 2014-04-14 2024-06-12 Swimc Llc Procédés de préparation de compositions pour contenants et autres articles et procédés d'utilisation desdites compositions
KR101706818B1 (ko) * 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
CN104403501B (zh) * 2014-11-26 2017-11-07 王忠强 一种电网运行管理中红外监测用涂覆材料及其制备方法
KR101741652B1 (ko) 2015-05-08 2017-06-01 주식회사 케이씨씨 분체 도료용 잠재성 경화제 및 이를 포함하는 에폭시 분체 도료 조성물
WO2017057019A1 (fr) * 2015-09-30 2017-04-06 ナミックス株式会社 Composition de résine époxyde
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
EP3170847A1 (fr) 2015-11-20 2017-05-24 OMG Borchers GmbH Accélérateurs encapsulés pour revêtements
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN105646843B (zh) * 2016-04-05 2018-08-10 广州市固研电子材料有限公司 改性脂环胺型环氧树脂潜伏性固化剂和促进剂及其制备方法
KR101991797B1 (ko) 2016-10-17 2019-06-25 한국생산기술연구원 폴리티올 공중합체 경화제 및 코어쉘 잠재성 경화 촉매를 포함하는 일액형 에폭시 접착제 조성물
US11104760B2 (en) 2017-03-17 2021-08-31 Asahi Kasei Kabushiki Kaisha Thermosetting resin composition
CN109321183A (zh) * 2018-09-19 2019-02-12 长春永固科技有限公司 一种高导热环氧树脂电子粘接剂及其制备方法
KR102155323B1 (ko) 2018-11-23 2020-09-11 한국과학기술연구원 잠재성 경화제 복합체, 이를 포함하는 일액형 에폭시 수지 및 이의 제조방법
JP7455950B2 (ja) 2019-07-12 2024-03-26 サムヤン コーポレイション 無水糖アルコール－アルキレングリコール組成物、無水糖アルコールベースウレタン変性ポリオール組成物、及びエポキシ樹脂組成物のためのそれらの使用
KR102306945B1 (ko) 2019-08-14 2021-10-01 한국과학기술연구원 건식표면중합 공정을 이용한 잠재성 경화제 복합체, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법
KR102236549B1 (ko) 2019-11-26 2021-04-07 한국과학기술연구원 건식 표면 처리 공정을 통해 보존 안정성이 향상된 잠재성 경화제, 이를 포함하는 일액형 에폭시 접착제 및 이의 제조방법
JP2022073653A (ja) * 2020-11-02 2022-05-17 日本ペイント・オートモーティブコーティングス株式会社 カチオン電着塗料組成物
KR102434730B1 (ko) * 2020-11-20 2022-08-23 한국생산기술연구원 저흡습성 에폭시 조성물
US12110425B2 (en) 2021-08-17 2024-10-08 Uniseal, Inc. Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
CN115232585B (zh) * 2022-06-24 2023-11-24 同济大学 一种耐湿热水解的单组分环氧树脂组合物及其制备方法和应用
CN115637021B (zh) * 2022-10-17 2024-05-14 华中科技大学 一种改性二氧化硅协同分散的环氧树脂复合材料及其制备与应用
EP4372773A1 (fr) * 2022-11-21 2024-05-22 ABB Schweiz AG Procédé de production d'un transformateur

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3417683A1 (de) * 1984-05-12 1985-11-14 Bayer Ag, 5090 Leverkusen Neue cycloaliphatische triisocyanate, ein verfahren zu ihrer herstellung und ihre verwendung bei der herstellung von polyurethankunststoffen
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP2688694B2 (ja) * 1989-01-20 1997-12-10 旭化成工業株式会社 コンデンサー封止用一液性エポキシ樹脂組成物
JPH03103423A (ja) * 1989-09-18 1991-04-30 Asahi Chem Ind Co Ltd 構造用接着剤用一液性エポキシ樹脂組成物
JPH06157876A (ja) * 1992-11-30 1994-06-07 Ajinomoto Co Inc 導電性一液型エポキシ樹脂組成物
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP4037228B2 (ja) * 2002-09-27 2008-01-23 住友ベークライト株式会社 一液型エポキシ樹脂組成物
JP4405741B2 (ja) * 2003-03-10 2010-01-27 旭化成イーマテリアルズ株式会社 マスターバッチ型硬化剤および一液性エポキシ樹脂組成物
KR100902204B1 (ko) * 2003-10-10 2009-06-11 아사히 가세이 케미칼즈 가부시키가이샤 잠재성 경화제 및 조성물

Also Published As

Publication number Publication date
CN101128502A (zh) 2008-02-20
JP4753934B2 (ja) 2011-08-24
KR100938523B1 (ko) 2010-01-25
WO2006090794A1 (fr) 2006-08-31
KR20070104621A (ko) 2007-10-26
TWI318632B (fr) 2009-12-21
TW200640978A (en) 2006-12-01
CN101128502B (zh) 2010-12-01
US20080251757A1 (en) 2008-10-16
CA2601950C (fr) 2010-07-13
CA2601950A1 (fr) 2006-08-31
JPWO2006090794A1 (ja) 2008-07-24
EP1852452A1 (fr) 2007-11-07

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