HK1097007A1 - Improved gold alloy electrolytes - Google Patents

Improved gold alloy electrolytes

Info

Publication number
HK1097007A1
HK1097007A1 HK07103921.1A HK07103921A HK1097007A1 HK 1097007 A1 HK1097007 A1 HK 1097007A1 HK 07103921 A HK07103921 A HK 07103921A HK 1097007 A1 HK1097007 A1 HK 1097007A1
Authority
HK
Hong Kong
Prior art keywords
gold alloy
improved gold
alloy electrolytes
electrolytes
improved
Prior art date
Application number
HK07103921.1A
Other languages
English (en)
Inventor
Andre Egli
Wing Kwong Wong
W M Raymund Kwok
Jochen Heber
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of HK1097007A1 publication Critical patent/HK1097007A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
HK07103921.1A 2005-06-02 2007-04-16 Improved gold alloy electrolytes HK1097007A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68677405P 2005-06-02 2005-06-02

Publications (1)

Publication Number Publication Date
HK1097007A1 true HK1097007A1 (en) 2007-06-15

Family

ID=36930153

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07103921.1A HK1097007A1 (en) 2005-06-02 2007-04-16 Improved gold alloy electrolytes

Country Status (6)

Country Link
US (1) US7465385B2 (fr)
EP (1) EP1728898B1 (fr)
JP (1) JP4832962B2 (fr)
CN (1) CN100557086C (fr)
HK (1) HK1097007A1 (fr)
SG (1) SG127854A1 (fr)

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US20090104463A1 (en) * 2006-06-02 2009-04-23 Rohm And Haas Electronic Materials Llc Gold alloy electrolytes
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CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
EP1983077B1 (fr) 2007-04-19 2016-12-28 Enthone, Inc. Électrolyte et procédé pour le dépôt électrolytique d'alliages or-cuivre
JP5317433B2 (ja) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
JP5642928B2 (ja) * 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
JP2011122192A (ja) * 2009-12-09 2011-06-23 Ne Chemcat Corp 電解硬質金めっき液及びこれを用いるめっき方法
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EP2505691B1 (fr) 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
PL2730682T3 (pl) * 2012-11-13 2018-12-31 Coventya Sas Alkaliczny, bezcyjankowy roztwór do galwanizacji stopami złota, sposób galwanizacji i podłoże zawierające błyszczący, wolny od korozji osad stopu złota
US10889907B2 (en) * 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
EP2990507A1 (fr) * 2014-08-25 2016-03-02 ATOTECH Deutschland GmbH Composition, utilisation de la composition et procédé pour le dépôt galvanique de couches contenant de l'or
JP6210148B2 (ja) 2015-12-28 2017-10-11 三菱マテリアル株式会社 ＳｎＡｇ合金めっき液
CN105755518B (zh) * 2016-05-23 2017-12-08 重庆理工大学 一种镁合金阳极氧化电解液及其用于镁合金阳极氧化的方法
US11674235B2 (en) * 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
EP3892759B1 (fr) * 2020-04-06 2023-07-26 Linxens Holding Bande pour circuits électriques avec plaquettes de contact rose-doré et procédé de fabrication d'une telle bande
SE2250388A1 (en) * 2022-03-29 2023-09-30 Seolfor Ab Compositions, methods, and preparations of cyanide-free gold solutions, suitable for electroplating of gold deposits and alloys thereof

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Also Published As

Publication number Publication date
JP2006348383A (ja) 2006-12-28
US7465385B2 (en) 2008-12-16
CN100557086C (zh) 2009-11-04
CN1896334A (zh) 2007-01-17
EP1728898A2 (fr) 2006-12-06
SG127854A1 (en) 2006-12-29
EP1728898A3 (fr) 2012-04-18
JP4832962B2 (ja) 2011-12-07
EP1728898B1 (fr) 2017-02-22
US20060283714A1 (en) 2006-12-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140531