HK1086851A1 - Curable resin composition, curable film and cured film - Google Patents
Curable resin composition, curable film and cured filmInfo
- Publication number
- HK1086851A1 HK1086851A1 HK06109116.4A HK06109116A HK1086851A1 HK 1086851 A1 HK1086851 A1 HK 1086851A1 HK 06109116 A HK06109116 A HK 06109116A HK 1086851 A1 HK1086851 A1 HK 1086851A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- film
- curable
- resin composition
- curable resin
- cured film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Organic Insulating Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Insulated Conductors (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004239068 | 2004-08-19 | ||
JP2005194942A JP4867217B2 (ja) | 2004-08-19 | 2005-07-04 | 硬化性樹脂組成物および硬化性フィルムおよびフィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1086851A1 true HK1086851A1 (en) | 2006-09-29 |
Family
ID=35219581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06109116.4A HK1086851A1 (en) | 2004-08-19 | 2006-08-16 | Curable resin composition, curable film and cured film |
Country Status (8)
Country | Link |
---|---|
US (1) | US7541408B2 (fr) |
EP (1) | EP1632534B1 (fr) |
JP (1) | JP4867217B2 (fr) |
KR (2) | KR101311909B1 (fr) |
CN (1) | CN1737050B (fr) |
DE (1) | DE602005008523D1 (fr) |
HK (1) | HK1086851A1 (fr) |
TW (1) | TWI332516B (fr) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1832617B1 (fr) | 2006-03-10 | 2018-09-19 | Mitsubishi Gas Chemical Company, Inc. | Oligomère d'éther de phénylène polyfonctionnel, son dérivé, composition de résine les contenant et leur utilisation |
JP4757070B2 (ja) * | 2006-03-27 | 2011-08-24 | 富士通株式会社 | 半田付け用フラックス及び半導体素子の接合方法 |
JP4892295B2 (ja) * | 2006-08-08 | 2012-03-07 | ナミックス株式会社 | 帯電防止性絶縁材フィルム及びその製造方法 |
WO2008018483A1 (fr) * | 2006-08-08 | 2008-02-14 | Namics Corporation | Composition de résine thermodurcissable et film non durci en étant composé |
JP5435685B2 (ja) * | 2007-02-28 | 2014-03-05 | ナミックス株式会社 | 封止用樹脂フィルム |
JP5080847B2 (ja) * | 2007-04-17 | 2012-11-21 | ナミックス株式会社 | 積層フィルム及びこれを用いた半導体装置の製造方法 |
JP5649773B2 (ja) * | 2007-05-31 | 2015-01-07 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物 |
JP5115135B2 (ja) * | 2007-10-15 | 2013-01-09 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物および硬化物 |
JP5541122B2 (ja) | 2010-11-30 | 2014-07-09 | 山一電機株式会社 | フレキシブル配線板 |
JP5812467B2 (ja) * | 2011-04-29 | 2015-11-11 | 株式会社伏見製薬所 | 不飽和カルボニル基で変性したオリゴ(フェニレンオキシ)基含有環状ホスファゼン化合物およびその製造方法 |
US8598281B2 (en) | 2011-09-01 | 2013-12-03 | Sabic Innovative Plastics Ip B.V. | Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same |
CN102807658B (zh) * | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
JP6106405B2 (ja) * | 2012-10-31 | 2017-03-29 | ナミックス株式会社 | 半導体装置 |
JP6230363B2 (ja) * | 2013-10-08 | 2017-11-15 | ナミックス株式会社 | フィルム用樹脂組成物、絶縁フィルムおよび半導体装置 |
JP6340811B2 (ja) * | 2014-02-18 | 2018-06-13 | 三菱瓦斯化学株式会社 | ポリカーボネート樹脂組成物及びそれを用いた耐熱性印刷インキ |
JP6221846B2 (ja) * | 2014-03-07 | 2017-11-01 | 日本ゼオン株式会社 | 硬化性樹脂組成物、フィルム、プリプレグ、積層体、硬化物、及び複合体 |
JP6504386B2 (ja) * | 2014-12-16 | 2019-04-24 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
US10822527B2 (en) | 2015-01-19 | 2020-11-03 | Tomoegawa Co., Ltd. | Thermosetting adhesive composition, thermosetting adhesive film, and composite film |
JP6579309B2 (ja) | 2015-05-01 | 2019-09-25 | 味の素株式会社 | 硬化性組成物 |
US10577487B2 (en) * | 2016-05-06 | 2020-03-03 | Canon Kabushiki Kaisha | Thermoplastic resin composition, molded article, and manufacturing method of molded article |
JP6906170B2 (ja) * | 2016-12-16 | 2021-07-21 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、プリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 |
CN110461936B (zh) * | 2017-03-30 | 2022-08-30 | 可乐丽塑料株式会社 | 包含低回弹性构件和高回弹性构件的结构体 |
US11477883B2 (en) * | 2017-07-12 | 2022-10-18 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminate, metal foil with resin, and wiring board |
JP7116732B2 (ja) * | 2017-09-08 | 2022-08-10 | 倉敷紡績株式会社 | フラットケーブル用基材フィルムおよびそれを用いたフラットケーブル用絶縁フィルム |
JP7203386B2 (ja) | 2017-12-28 | 2023-01-13 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
TW202012481A (zh) | 2018-07-20 | 2020-04-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板 |
JP7519587B2 (ja) | 2019-07-17 | 2024-07-22 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
KR20220038379A (ko) | 2019-07-17 | 2022-03-28 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 수지 조성물, 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판, 및 배선판 |
WO2022172759A1 (fr) * | 2021-02-10 | 2022-08-18 | 三井金属鉱業株式会社 | Composition de résine, feuille de cuivre avec résine et carte de circuit imprimé |
CN117321093A (zh) * | 2021-05-17 | 2023-12-29 | 松下知识产权经营株式会社 | 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 |
US11926736B1 (en) | 2023-02-17 | 2024-03-12 | Thintronics, Inc. | Curable film composition, curable film, and cured product thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0488054A (ja) * | 1990-08-01 | 1992-03-19 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル系樹脂組成物 |
EP0546497A3 (en) | 1991-12-10 | 1993-11-18 | Idemitsu Kosan Co | Thermoplastic resin composition |
JPH07188362A (ja) | 1993-12-27 | 1995-07-25 | Asahi Chem Ind Co Ltd | 硬化ポリフェニレンエーテル系樹脂フィルム |
CA2333998A1 (fr) * | 1998-06-11 | 1999-12-16 | The Dow Chemical Company | Compositions elastomeriques photodurcissables |
JP2000143967A (ja) * | 1998-11-10 | 2000-05-26 | Ibiden Co Ltd | 樹脂複合体、プリント配線板および多層プリント配線板 |
JP2001342450A (ja) * | 2000-05-30 | 2001-12-14 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
JP4467816B2 (ja) | 2001-02-27 | 2010-05-26 | 株式会社日立製作所 | 低誘電正接樹脂組成物、硬化性フィルム、硬化物およびそれを用いた電気部品とその製法 |
JP3874089B2 (ja) * | 2001-11-19 | 2007-01-31 | 三菱瓦斯化学株式会社 | 熱硬化性ppeのオリゴマー体 |
JP3879831B2 (ja) * | 2002-01-28 | 2007-02-14 | 三菱瓦斯化学株式会社 | 熱硬化性ppeのオリゴマー体 |
EP1384733B1 (fr) | 2002-07-25 | 2007-04-25 | Mitsubishi Gas Chemical Company, Inc. | Composé vinylique et produit réticulé à partir de celui-ci |
JP2004067727A (ja) | 2002-08-01 | 2004-03-04 | Mitsubishi Gas Chem Co Inc | ビニル化合物およびその硬化物 |
JP4038667B2 (ja) * | 2002-07-25 | 2008-01-30 | 三菱瓦斯化学株式会社 | ビニル化合物およびその硬化物 |
TW200422336A (en) * | 2002-11-08 | 2004-11-01 | Mitsubishi Chem Corp | Radiation curable resin composition and cured product thereof |
US7071266B2 (en) * | 2003-01-17 | 2006-07-04 | Mitsubishi Gas Chemical Company, Inc. | Curable resin composition and cured product thereof |
TW200416243A (en) * | 2003-01-21 | 2004-09-01 | Mitsubishi Gas Chemical Co | Epoxy resin curing agent, curable epoxy resin composition and cured product |
US7192651B2 (en) * | 2003-08-20 | 2007-03-20 | Mitsubishi Gas Chemical Company, Inc. | Resin composition and prepreg for laminate and metal-clad laminate |
CN1914239B (zh) * | 2004-01-30 | 2010-05-05 | 新日铁化学株式会社 | 固化性树脂组合物 |
WO2006049263A1 (fr) * | 2004-11-01 | 2006-05-11 | Teijin Chemicals Ltd. | Composition de resine et chassis de fixation pour ecrans plats |
-
2005
- 2005-07-04 JP JP2005194942A patent/JP4867217B2/ja active Active
- 2005-08-16 US US11/204,320 patent/US7541408B2/en active Active
- 2005-08-17 EP EP05255085A patent/EP1632534B1/fr active Active
- 2005-08-17 DE DE602005008523T patent/DE602005008523D1/de active Active
- 2005-08-18 TW TW094128201A patent/TWI332516B/zh active
- 2005-08-19 KR KR1020050076239A patent/KR101311909B1/ko active IP Right Grant
- 2005-08-19 CN CN2005100932115A patent/CN1737050B/zh active Active
-
2006
- 2006-08-16 HK HK06109116.4A patent/HK1086851A1/xx unknown
-
2013
- 2013-08-07 KR KR1020130093499A patent/KR20130094765A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20060053172A (ko) | 2006-05-19 |
KR20130094765A (ko) | 2013-08-26 |
JP2006083364A (ja) | 2006-03-30 |
EP1632534A2 (fr) | 2006-03-08 |
DE602005008523D1 (de) | 2008-09-11 |
TW200617086A (en) | 2006-06-01 |
TWI332516B (en) | 2010-11-01 |
JP4867217B2 (ja) | 2012-02-01 |
CN1737050A (zh) | 2006-02-22 |
EP1632534A3 (fr) | 2007-05-30 |
US20060041068A1 (en) | 2006-02-23 |
CN1737050B (zh) | 2011-01-05 |
EP1632534B1 (fr) | 2008-07-30 |
US7541408B2 (en) | 2009-06-02 |
KR101311909B1 (ko) | 2013-09-27 |
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