HK1086851A1 - Curable resin composition, curable film and cured film - Google Patents

Curable resin composition, curable film and cured film

Info

Publication number
HK1086851A1
HK1086851A1 HK06109116.4A HK06109116A HK1086851A1 HK 1086851 A1 HK1086851 A1 HK 1086851A1 HK 06109116 A HK06109116 A HK 06109116A HK 1086851 A1 HK1086851 A1 HK 1086851A1
Authority
HK
Hong Kong
Prior art keywords
film
curable
resin composition
curable resin
cured film
Prior art date
Application number
HK06109116.4A
Other languages
English (en)
Inventor
Daisuke Ohno
Kenji Ishii
Yasumasa Norisue
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of HK1086851A1 publication Critical patent/HK1086851A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/20—Manufacture of shaped structures of ion-exchange resins
    • C08J5/22—Films, membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
HK06109116.4A 2004-08-19 2006-08-16 Curable resin composition, curable film and cured film HK1086851A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004239068 2004-08-19
JP2005194942A JP4867217B2 (ja) 2004-08-19 2005-07-04 硬化性樹脂組成物および硬化性フィルムおよびフィルム

Publications (1)

Publication Number Publication Date
HK1086851A1 true HK1086851A1 (en) 2006-09-29

Family

ID=35219581

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06109116.4A HK1086851A1 (en) 2004-08-19 2006-08-16 Curable resin composition, curable film and cured film

Country Status (8)

Country Link
US (1) US7541408B2 (xx)
EP (1) EP1632534B1 (xx)
JP (1) JP4867217B2 (xx)
KR (2) KR101311909B1 (xx)
CN (1) CN1737050B (xx)
DE (1) DE602005008523D1 (xx)
HK (1) HK1086851A1 (xx)
TW (1) TWI332516B (xx)

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US7662906B2 (en) 2006-03-10 2010-02-16 Mitsubishi Gas Chemical Company, Inc. Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
JP4757070B2 (ja) * 2006-03-27 2011-08-24 富士通株式会社 半田付け用フラックス及び半導体素子の接合方法
US20090239992A1 (en) * 2006-08-08 2009-09-24 Toshiaki Yamada Thermosetting resin composition and uncured film comprising the same
JP4892295B2 (ja) * 2006-08-08 2012-03-07 ナミックス株式会社 帯電防止性絶縁材フィルム及びその製造方法
JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム
JP5080847B2 (ja) * 2007-04-17 2012-11-21 ナミックス株式会社 積層フィルム及びこれを用いた半導体装置の製造方法
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
JP5115135B2 (ja) * 2007-10-15 2013-01-09 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化物
JP5541122B2 (ja) 2010-11-30 2014-07-09 山一電機株式会社 フレキシブル配線板
JP5812467B2 (ja) * 2011-04-29 2015-11-11 株式会社伏見製薬所 不飽和カルボニル基で変性したオリゴ（フェニレンオキシ）基含有環状ホスファゼン化合物およびその製造方法
US8598281B2 (en) 2011-09-01 2013-12-03 Sabic Innovative Plastics Ip B.V. Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
CN102807658B (zh) * 2012-08-09 2014-06-11 广东生益科技股份有限公司 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板
JP6106405B2 (ja) * 2012-10-31 2017-03-29 ナミックス株式会社 半導体装置
JP6230363B2 (ja) * 2013-10-08 2017-11-15 ナミックス株式会社 フィルム用樹脂組成物、絶縁フィルムおよび半導体装置
JP6340811B2 (ja) * 2014-02-18 2018-06-13 三菱瓦斯化学株式会社 ポリカーボネート樹脂組成物及びそれを用いた耐熱性印刷インキ
JP6221846B2 (ja) * 2014-03-07 2017-11-01 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6504386B2 (ja) * 2014-12-16 2019-04-24 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
JP6483159B2 (ja) * 2015-01-19 2019-03-13 株式会社巴川製紙所 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム
JP6579309B2 (ja) 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
US10577487B2 (en) * 2016-05-06 2020-03-03 Canon Kabushiki Kaisha Thermoplastic resin composition, molded article, and manufacturing method of molded article
JP6906170B2 (ja) * 2016-12-16 2021-07-21 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、プリプレグ、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板
EP3604435A4 (en) * 2017-03-30 2020-09-16 Kuraray Plastics Co., Ltd. STRUCTURE WITH ELASTIC ELEMENT WITH LOW ELASTICITY AND ELASTIC ELEMENT WITH HIGH ELASTICITY
JP7065463B2 (ja) * 2017-07-12 2022-05-12 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属箔、及び配線板
WO2019049922A1 (ja) * 2017-09-08 2019-03-14 倉敷紡績株式会社 フラットケーブル用基材フィルムおよびそれを用いたフラットケーブル用絶縁フィルム
WO2019130735A1 (ja) 2017-12-28 2019-07-04 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
TW202012481A (zh) 2018-07-20 2020-04-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板
WO2021010431A1 (ja) * 2019-07-17 2021-01-21 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
US20220259363A1 (en) * 2019-07-17 2022-08-18 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
JPWO2022172759A1 (xx) * 2021-02-10 2022-08-18
WO2022244726A1 (ja) * 2021-05-17 2022-11-24 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
US11926736B1 (en) 2023-02-17 2024-03-12 Thintronics, Inc. Curable film composition, curable film, and cured product thereof

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Also Published As

Publication number Publication date
EP1632534A2 (en) 2006-03-08
TWI332516B (en) 2010-11-01
CN1737050A (zh) 2006-02-22
CN1737050B (zh) 2011-01-05
TW200617086A (en) 2006-06-01
US20060041068A1 (en) 2006-02-23
EP1632534A3 (en) 2007-05-30
KR20130094765A (ko) 2013-08-26
KR101311909B1 (ko) 2013-09-27
DE602005008523D1 (de) 2008-09-11
US7541408B2 (en) 2009-06-02
EP1632534B1 (en) 2008-07-30
JP2006083364A (ja) 2006-03-30
KR20060053172A (ko) 2006-05-19
JP4867217B2 (ja) 2012-02-01

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