HK1084159A1 - Copper electrolytic solution and electrolytic copper foil produced therewith - Google Patents
Copper electrolytic solution and electrolytic copper foil produced therewithInfo
- Publication number
- HK1084159A1 HK1084159A1 HK06104253.8A HK06104253A HK1084159A1 HK 1084159 A1 HK1084159 A1 HK 1084159A1 HK 06104253 A HK06104253 A HK 06104253A HK 1084159 A1 HK1084159 A1 HK 1084159A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electrolytic
- copper
- produced therewith
- foil produced
- copper foil
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002366353 | 2002-12-18 | ||
PCT/JP2003/013044 WO2004055246A1 (ja) | 2002-12-18 | 2003-10-10 | 銅電解液およびそれにより製造された電解銅箔 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1084159A1 true HK1084159A1 (en) | 2006-07-21 |
Family
ID=32588305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06104253.8A HK1084159A1 (en) | 2002-12-18 | 2006-04-07 | Copper electrolytic solution and electrolytic copper foil produced therewith |
Country Status (10)
Country | Link |
---|---|
US (2) | US7777078B2 (xx) |
EP (1) | EP1574599B1 (xx) |
JP (1) | JP4294593B2 (xx) |
KR (1) | KR100682224B1 (xx) |
CN (1) | CN100526515C (xx) |
DE (1) | DE60333308D1 (xx) |
ES (1) | ES2348207T3 (xx) |
HK (1) | HK1084159A1 (xx) |
TW (1) | TWI241358B (xx) |
WO (1) | WO2004055246A1 (xx) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100823769B1 (ko) * | 2005-01-25 | 2008-04-21 | 닛코킨조쿠 가부시키가이샤 | 특정 골격을 가진 화합물을 첨가제로서 포함하는구리전해액 및 이것에 의해 제조되는 전해구리박 |
WO2006080148A1 (ja) | 2005-01-25 | 2006-08-03 | Nippon Mining & Metals Co., Ltd. | 特定骨格を有する化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
JP2007107074A (ja) * | 2005-10-17 | 2007-04-26 | Okuno Chem Ind Co Ltd | 酸性電気銅めっき液及び電気銅めっき方法 |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
WO2007125994A1 (ja) * | 2006-04-28 | 2007-11-08 | Mitsui Mining & Smelting Co., Ltd. | 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法 |
JP5255229B2 (ja) * | 2006-04-28 | 2013-08-07 | 三井金属鉱業株式会社 | 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法 |
JPWO2008126522A1 (ja) * | 2007-03-15 | 2010-07-22 | 日鉱金属株式会社 | 銅電解液及びそれを用いて得られた2層フレキシブル基板 |
JP5352542B2 (ja) | 2010-07-15 | 2013-11-27 | エル エス エムトロン リミテッド | リチウム二次電池の集電体用銅箔 |
CN103210124B (zh) | 2010-11-15 | 2016-01-06 | 吉坤日矿日石金属株式会社 | 电解铜箔 |
JP5595320B2 (ja) * | 2011-03-31 | 2014-09-24 | Jx日鉱日石金属株式会社 | 銅電解液 |
US10519557B2 (en) | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
KR102377286B1 (ko) | 2017-03-23 | 2022-03-21 | 에스케이넥실리스 주식회사 | 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박 |
KR102378297B1 (ko) | 2017-03-29 | 2022-03-23 | 에스케이넥실리스 주식회사 | 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박 |
CN108998815B (zh) * | 2018-10-09 | 2019-09-17 | 广东嘉元科技股份有限公司 | 一种铜箔的制备方法及该铜箔生产用改性添加剂 |
LU500134B1 (en) | 2021-05-07 | 2022-11-08 | Circuit Foil Luxembourg | Method for producing an electrodeposited copper foil and copper foil obtained therewith |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE934508C (de) * | 1954-04-23 | 1955-10-27 | Dehydag Gmbh | Verfahren zur Herstellung galvanischer Metallueberzuege |
US4336114A (en) | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
GB2155919B (en) * | 1984-03-20 | 1987-12-02 | Dearborn Chemicals Ltd | A method of inhibiting corrosion in aqueous systems |
US4555315A (en) | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
JPS6152387A (ja) | 1984-08-17 | 1986-03-15 | Fukuda Kinzoku Hakufun Kogyo Kk | 高温加熱時の伸び率が優れた電解銅箔の製造方法 |
US5607570A (en) * | 1994-10-31 | 1997-03-04 | Rohbani; Elias | Electroplating solution |
JPH10330983A (ja) | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
US6183622B1 (en) | 1998-07-13 | 2001-02-06 | Enthone-Omi, Inc. | Ductility additives for electrorefining and electrowinning |
JP2000297395A (ja) * | 1999-04-15 | 2000-10-24 | Japan Energy Corp | 電気銅めっき液 |
JP3291482B2 (ja) | 1999-08-31 | 2002-06-10 | 三井金属鉱業株式会社 | 整面電解銅箔、その製造方法および用途 |
JP4394234B2 (ja) * | 2000-01-20 | 2010-01-06 | 日鉱金属株式会社 | 銅電気めっき液及び銅電気めっき方法 |
TW200403358A (en) * | 2002-08-01 | 2004-03-01 | Furukawa Circuit Foil | Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector |
-
2003
- 2003-10-10 US US10/531,645 patent/US7777078B2/en active Active
- 2003-10-10 EP EP03769899A patent/EP1574599B1/en not_active Expired - Lifetime
- 2003-10-10 JP JP2004560597A patent/JP4294593B2/ja not_active Expired - Lifetime
- 2003-10-10 KR KR1020057011164A patent/KR100682224B1/ko active IP Right Grant
- 2003-10-10 WO PCT/JP2003/013044 patent/WO2004055246A1/ja active Application Filing
- 2003-10-10 ES ES03769899T patent/ES2348207T3/es not_active Expired - Lifetime
- 2003-10-10 CN CNB200380106297XA patent/CN100526515C/zh not_active Expired - Lifetime
- 2003-10-10 DE DE60333308T patent/DE60333308D1/de not_active Expired - Lifetime
- 2003-10-20 TW TW092128986A patent/TWI241358B/zh not_active IP Right Cessation
-
2006
- 2006-04-07 HK HK06104253.8A patent/HK1084159A1/xx not_active IP Right Cessation
-
2010
- 2010-06-29 US US12/803,534 patent/US20100270163A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004055246A1 (ja) | 2004-07-01 |
KR20050084369A (ko) | 2005-08-26 |
KR100682224B1 (ko) | 2007-02-12 |
WO2004055246A8 (ja) | 2004-08-19 |
US7777078B2 (en) | 2010-08-17 |
US20060166032A1 (en) | 2006-07-27 |
EP1574599B1 (en) | 2010-07-07 |
ES2348207T3 (es) | 2010-12-01 |
CN100526515C (zh) | 2009-08-12 |
DE60333308D1 (de) | 2010-08-19 |
JP4294593B2 (ja) | 2009-07-15 |
TW200411080A (en) | 2004-07-01 |
CN1726309A (zh) | 2006-01-25 |
EP1574599A1 (en) | 2005-09-14 |
US20100270163A1 (en) | 2010-10-28 |
JPWO2004055246A1 (ja) | 2006-04-20 |
TWI241358B (en) | 2005-10-11 |
EP1574599A4 (en) | 2006-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |
Effective date: 20231009 |