WO2004055246A8 - 銅電解液およびそれにより製造された電解銅箔 - Google Patents

銅電解液およびそれにより製造された電解銅箔

Info

Publication number
WO2004055246A8
WO2004055246A8 PCT/JP2003/013044 JP0313044W WO2004055246A8 WO 2004055246 A8 WO2004055246 A8 WO 2004055246A8 JP 0313044 W JP0313044 W JP 0313044W WO 2004055246 A8 WO2004055246 A8 WO 2004055246A8
Authority
WO
WIPO (PCT)
Prior art keywords
electrolytic
copper
copper foil
electrolytic solution
quaternary amine
Prior art date
Application number
PCT/JP2003/013044
Other languages
English (en)
French (fr)
Other versions
WO2004055246A1 (ja
Inventor
Masashi Kumagai
Mikio Hanafusa
Original Assignee
Nikko Materials Co Ltd
Masashi Kumagai
Mikio Hanafusa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd, Masashi Kumagai, Mikio Hanafusa filed Critical Nikko Materials Co Ltd
Priority to US10/531,645 priority Critical patent/US7777078B2/en
Priority to JP2004560597A priority patent/JP4294593B2/ja
Priority to DE60333308T priority patent/DE60333308D1/de
Priority to EP03769899A priority patent/EP1574599B1/en
Publication of WO2004055246A1 publication Critical patent/WO2004055246A1/ja
Publication of WO2004055246A8 publication Critical patent/WO2004055246A8/ja
Priority to HK06104253.8A priority patent/HK1084159A1/xx
Priority to US12/803,534 priority patent/US20100270163A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Metals (AREA)
PCT/JP2003/013044 2002-12-18 2003-10-10 銅電解液およびそれにより製造された電解銅箔 WO2004055246A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/531,645 US7777078B2 (en) 2002-12-18 2003-10-10 Copper electrolytic solution and electrolytic copper foil produced therewith
JP2004560597A JP4294593B2 (ja) 2002-12-18 2003-10-10 銅電解液およびそれにより製造された電解銅箔
DE60333308T DE60333308D1 (de) 2002-12-18 2003-10-10 Kupferelektrolyselösung und damit hergestellte elektrolytkupferfolie
EP03769899A EP1574599B1 (en) 2002-12-18 2003-10-10 Copper electrolytic solution and electrolytic copper foil produced therewith
HK06104253.8A HK1084159A1 (en) 2002-12-18 2006-04-07 Copper electrolytic solution and electrolytic copper foil produced therewith
US12/803,534 US20100270163A1 (en) 2002-12-18 2010-06-29 Copper electrolytic solution and electrolytic copper foil produced therewith

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002366353 2002-12-18
JP2002-366353 2002-12-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/803,534 Division US20100270163A1 (en) 2002-12-18 2010-06-29 Copper electrolytic solution and electrolytic copper foil produced therewith

Publications (2)

Publication Number Publication Date
WO2004055246A1 WO2004055246A1 (ja) 2004-07-01
WO2004055246A8 true WO2004055246A8 (ja) 2004-08-19

Family

ID=32588305

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/013044 WO2004055246A1 (ja) 2002-12-18 2003-10-10 銅電解液およびそれにより製造された電解銅箔

Country Status (10)

Country Link
US (2) US7777078B2 (ja)
EP (1) EP1574599B1 (ja)
JP (1) JP4294593B2 (ja)
KR (1) KR100682224B1 (ja)
CN (1) CN100526515C (ja)
DE (1) DE60333308D1 (ja)
ES (1) ES2348207T3 (ja)
HK (1) HK1084159A1 (ja)
TW (1) TWI241358B (ja)
WO (1) WO2004055246A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100823769B1 (ko) * 2005-01-25 2008-04-21 닛코킨조쿠 가부시키가이샤 특정 골격을 가진 화합물을 첨가제로서 포함하는구리전해액 및 이것에 의해 제조되는 전해구리박
US7824534B2 (en) 2005-01-25 2010-11-02 Nippon Mining & Metals Co., Ltd. Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
JP2007107074A (ja) * 2005-10-17 2007-04-26 Okuno Chem Ind Co Ltd 酸性電気銅めっき液及び電気銅めっき方法
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN101426959B (zh) 2006-04-28 2010-11-17 三井金属矿业株式会社 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
US20100084275A1 (en) * 2007-03-15 2010-04-08 Mikio Hanafusa Copper electrolytic solution and two-layer flexible substrate obtained using the same
JP5352542B2 (ja) 2010-07-15 2013-11-27 エル エス エムトロン リミテッド リチウム二次電池の集電体用銅箔
EP2641999A1 (en) 2010-11-15 2013-09-25 JX Nippon Mining & Metals Corporation Electrolytic copper foil
JP5595320B2 (ja) * 2011-03-31 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102377286B1 (ko) 2017-03-23 2022-03-21 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
KR102378297B1 (ko) 2017-03-29 2022-03-23 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
CN108998815B (zh) * 2018-10-09 2019-09-17 广东嘉元科技股份有限公司 一种铜箔的制备方法及该铜箔生产用改性添加剂
LU500134B1 (en) 2021-05-07 2022-11-08 Circuit Foil Luxembourg Method for producing an electrodeposited copper foil and copper foil obtained therewith

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE934508C (de) * 1954-04-23 1955-10-27 Dehydag Gmbh Verfahren zur Herstellung galvanischer Metallueberzuege
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
GB2155919B (en) * 1984-03-20 1987-12-02 Dearborn Chemicals Ltd A method of inhibiting corrosion in aqueous systems
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
JPS6152387A (ja) 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法
US5607570A (en) 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
US6183622B1 (en) * 1998-07-13 2001-02-06 Enthone-Omi, Inc. Ductility additives for electrorefining and electrowinning
JP2000297395A (ja) * 1999-04-15 2000-10-24 Japan Energy Corp 電気銅めっき液
JP3291482B2 (ja) * 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
TW200403358A (en) * 2002-08-01 2004-03-01 Furukawa Circuit Foil Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector

Also Published As

Publication number Publication date
EP1574599A4 (en) 2006-08-02
TW200411080A (en) 2004-07-01
CN100526515C (zh) 2009-08-12
WO2004055246A1 (ja) 2004-07-01
ES2348207T3 (es) 2010-12-01
US20100270163A1 (en) 2010-10-28
JP4294593B2 (ja) 2009-07-15
US20060166032A1 (en) 2006-07-27
TWI241358B (en) 2005-10-11
DE60333308D1 (de) 2010-08-19
EP1574599B1 (en) 2010-07-07
CN1726309A (zh) 2006-01-25
JPWO2004055246A1 (ja) 2006-04-20
EP1574599A1 (en) 2005-09-14
KR100682224B1 (ko) 2007-02-12
KR20050084369A (ko) 2005-08-26
US7777078B2 (en) 2010-08-17
HK1084159A1 (en) 2006-07-21

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