HK1026390A1 - Leadless solder. - Google Patents

Leadless solder.

Info

Publication number
HK1026390A1
HK1026390A1 HK00105678A HK00105678A HK1026390A1 HK 1026390 A1 HK1026390 A1 HK 1026390A1 HK 00105678 A HK00105678 A HK 00105678A HK 00105678 A HK00105678 A HK 00105678A HK 1026390 A1 HK1026390 A1 HK 1026390A1
Authority
HK
Hong Kong
Prior art keywords
leadless solder
leadless
solder
Prior art date
Application number
HK00105678A
Other languages
English (en)
Inventor
Tetsuro Nishimura
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27309154&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1026390(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of HK1026390A1 publication Critical patent/HK1026390A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Coating With Molten Metal (AREA)
  • Conductive Materials (AREA)
HK00105678A 1998-03-26 2000-09-08 Leadless solder. HK1026390A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10014198 1998-03-26
JP32448298 1998-10-28
JP32448398 1998-10-28
PCT/JP1999/001229 WO1999048639A1 (fr) 1998-03-26 1999-03-15 Soudure sans plomb

Publications (1)

Publication Number Publication Date
HK1026390A1 true HK1026390A1 (en) 2000-12-15

Family

ID=27309154

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00105678A HK1026390A1 (en) 1998-03-26 2000-09-08 Leadless solder.

Country Status (13)

Country Link
US (1) US6180055B1 (de)
EP (1) EP0985486B1 (de)
JP (2) JP3152945B2 (de)
KR (1) KR100377232B1 (de)
AU (1) AU757312B2 (de)
CA (1) CA2288817C (de)
DE (1) DE69918758T2 (de)
ES (1) ES2224609T3 (de)
HK (1) HK1026390A1 (de)
ID (1) ID22854A (de)
MY (1) MY114845A (de)
TW (1) TW411731B (de)
WO (1) WO1999048639A1 (de)

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JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP3036636B1 (ja) * 1999-02-08 2000-04-24 日本アルミット株式会社 無鉛半田合金
JP3312618B2 (ja) * 2000-02-03 2002-08-12 千住金属工業株式会社 はんだ槽へのはんだの追加供給方法
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
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US6570260B1 (en) * 2002-02-15 2003-05-27 Delphi Technologies, Inc. Solder process and solder alloy therefor
KR100453074B1 (ko) * 2002-03-18 2004-10-15 삼성전자주식회사 무연 솔더 합금
US6840434B2 (en) * 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US20040141873A1 (en) * 2003-01-22 2004-07-22 Tadashi Takemoto Solder composition substantially free of lead
US7193326B2 (en) * 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4569423B2 (ja) 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
JP4890221B2 (ja) * 2006-12-06 2012-03-07 株式会社日本スペリア社 ダイボンド材
WO2008132933A1 (ja) * 2007-04-13 2008-11-06 Sekisui Chemical Co., Ltd. 導電性微粒子、異方性導電材料、及び、導電接続構造体
JP4364928B2 (ja) 2007-04-13 2009-11-18 積水化学工業株式会社 導電性微粒子、異方性導電材料及び導電接続構造体
JP5331322B2 (ja) * 2007-09-20 2013-10-30 株式会社日立製作所 半導体装置
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
EP2243590B1 (de) * 2008-02-22 2020-04-15 Nihon Superior Sha Co., Ltd Verfahren zur regulierung der nickelkonzentration in einem bleifreien nickelhaltigen lot
CN102017111B (zh) * 2008-03-05 2013-01-16 千住金属工业株式会社 无铅焊料连接构造体和焊料球
JP2011044624A (ja) 2009-08-24 2011-03-03 Hitachi Ltd 半導体装置および車載用交流発電機
WO2011106421A2 (en) * 2010-02-24 2011-09-01 Ramirez Ainissa G Low melting temperature alloys with magnetic dispersions
TWI461252B (zh) * 2010-12-24 2014-11-21 Murata Manufacturing Co A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
MX344239B (es) * 2011-02-04 2016-12-07 Antaya Tech Corp Composicion de soldadura sin plomo.
JP5973992B2 (ja) 2011-04-08 2016-08-23 株式会社日本スペリア社 はんだ合金
WO2014103934A1 (ja) * 2012-12-25 2014-07-03 三菱マテリアル株式会社 パワーモジュール
JPWO2014142153A1 (ja) * 2013-03-13 2017-02-16 株式会社日本スペリア社 はんだ接合物及びはんだ接合方法
EP3062956B1 (de) * 2013-10-31 2019-09-11 Alpha Assembly Solutions Inc. Bleifreie, silberfreie lotlegierungen
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
JP6287739B2 (ja) * 2014-09-30 2018-03-07 株式会社村田製作所 ステンドグラスの製造方法
CN104972241B (zh) * 2015-07-30 2017-11-10 好利来（中国）电子科技股份有限公司 锡锌铜系高温无铅焊锡
JP6330786B2 (ja) 2015-11-16 2018-05-30 トヨタ自動車株式会社 半導体装置の製造方法
JP6234488B2 (ja) * 2016-02-05 2017-11-22 株式会社リソー技研 無鉛はんだ
JP6203894B1 (ja) 2016-03-31 2017-09-27 株式会社寺岡製作所 粘着テープ及びその製造方法
JP7287606B2 (ja) * 2018-08-10 2023-06-06 株式会社日本スペリア社 鉛フリーはんだ合金
TWI820277B (zh) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 無鉛焊料組成物
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手
US20220281035A1 (en) * 2019-08-05 2022-09-08 Nihon Superior Co., Ltd. Solder-metal mesh composite material and method for producing same
JP7007623B1 (ja) * 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手

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US3481795A (en) * 1965-08-09 1969-12-02 Westinghouse Electric Corp Thermoelectric device including tin solder with particles of iron,cobalt or nickel
US4248905A (en) * 1980-01-21 1981-02-03 General Motors Corporation Tin-base body solder
US4358884A (en) * 1980-10-20 1982-11-16 General Motors Corporation Tin-base body solder
US4506822A (en) * 1982-03-18 1985-03-26 The United States Of America As Represented By The United States Department Of Energy Method for brazing together planar and nonplanar metal members
JPS62230493A (ja) * 1986-03-31 1987-10-09 Taruchin Kk はんだ合金
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JPH0234295A (ja) * 1988-07-19 1990-02-05 Jw Harris Co Inc ソルダーコンポジション及びその使用方法
US5094700A (en) * 1990-03-22 1992-03-10 University Of Cincinnati Solder and brazing alloys having improved properties and method of preparation
US5066544A (en) * 1990-08-27 1991-11-19 U.S. Philips Corporation Dispersion strengthened lead-tin alloy solder
US5125574A (en) * 1990-10-09 1992-06-30 Iowa State University Research Foundation Atomizing nozzle and process
JP3186178B2 (ja) * 1992-03-06 2001-07-11 田中電子工業株式会社 半導体素子用のはんだバンプ形成材料
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5429689A (en) * 1993-09-07 1995-07-04 Ford Motor Company Lead-free solder alloys
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH106075A (ja) * 1996-06-13 1998-01-13 Nippon Handa Kk 無鉛ハンダ合金
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP3600899B2 (ja) * 1996-11-05 2004-12-15 トピー工業株式会社 耐酸化特性を有する無鉛はんだ
JPH10144718A (ja) * 1996-11-14 1998-05-29 Fukuda Metal Foil & Powder Co Ltd スズ基鉛フリーハンダワイヤー及びボール
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
DE19752215A1 (de) * 1997-03-11 1998-09-17 Fraunhofer Ges Forschung Lötverbindung
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys

Also Published As

Publication number Publication date
US6180055B1 (en) 2001-01-30
JP3152945B2 (ja) 2001-04-03
EP0985486B1 (de) 2004-07-21
ES2224609T3 (es) 2005-03-01
CA2288817C (en) 2005-07-26
KR100377232B1 (ko) 2003-03-26
WO1999048639A1 (fr) 1999-09-30
EP0985486A1 (de) 2000-03-15
DE69918758D1 (de) 2004-08-26
CA2288817A1 (en) 1999-09-30
ID22854A (id) 1999-12-09
AU4119799A (en) 1999-10-18
DE69918758T2 (de) 2004-11-25
AU757312B2 (en) 2003-02-13
KR20010012869A (ko) 2001-02-26
JP2007203373A (ja) 2007-08-16
TW411731B (en) 2000-11-11
EP0985486A4 (de) 2003-01-02
MY114845A (en) 2003-01-31

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20190314