HK1024028A1 - Copper alloy and process for obtaining same - Google Patents

Copper alloy and process for obtaining same

Info

Publication number
HK1024028A1
HK1024028A1 HK00103311A HK00103311A HK1024028A1 HK 1024028 A1 HK1024028 A1 HK 1024028A1 HK 00103311 A HK00103311 A HK 00103311A HK 00103311 A HK00103311 A HK 00103311A HK 1024028 A1 HK1024028 A1 HK 1024028A1
Authority
HK
Hong Kong
Prior art keywords
copper alloy
obtaining same
obtaining
same
alloy
Prior art date
Application number
HK00103311A
Other languages
English (en)
Inventor
Ashok K Bhargava
Original Assignee
Waterbury Rolling Mills Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Waterbury Rolling Mills Inc filed Critical Waterbury Rolling Mills Inc
Publication of HK1024028A1 publication Critical patent/HK1024028A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
HK00103311A 1997-09-16 2000-06-01 Copper alloy and process for obtaining same HK1024028A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/931,696 US5893953A (en) 1997-09-16 1997-09-16 Copper alloy and process for obtaining same
PCT/US1998/013221 WO1999014388A1 (en) 1997-09-16 1998-06-24 Copper alloy and process for obtaining same

Publications (1)

Publication Number Publication Date
HK1024028A1 true HK1024028A1 (en) 2000-09-29

Family

ID=25461198

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00103311A HK1024028A1 (en) 1997-09-16 2000-06-01 Copper alloy and process for obtaining same

Country Status (12)

Country Link
US (2) US5893953A (ko)
EP (1) EP0908526B1 (ko)
JP (1) JPH11106851A (ko)
KR (1) KR100344782B1 (ko)
CN (1) CN1080768C (ko)
CA (1) CA2270627C (ko)
DE (1) DE69819104T2 (ko)
HK (1) HK1024028A1 (ko)
HU (1) HUP9801474A3 (ko)
PL (1) PL189342B1 (ko)
TW (1) TW474998B (ko)
WO (1) WO1999014388A1 (ko)

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US6679956B2 (en) * 1997-09-16 2004-01-20 Waterbury Rolling Mills, Inc. Process for making copper-tin-zinc alloys
US6695934B1 (en) * 1997-09-16 2004-02-24 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US6471792B1 (en) 1998-11-16 2002-10-29 Olin Corporation Stress relaxation resistant brass
US6436206B1 (en) 1999-04-01 2002-08-20 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US6241831B1 (en) * 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6264764B1 (en) 2000-05-09 2001-07-24 Outokumpu Oyj Copper alloy and process for making same
KR100798747B1 (ko) * 2001-06-04 2008-01-28 빌란트-베르케악티엔게젤샤프트 구리-아연-알루미늄-합금 재료 및 이 재료로 이루어진 베어링 부시
DE10139953A1 (de) * 2001-08-21 2003-03-27 Stolberger Metallwerke Gmbh Werkstoff für ein Metallband
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JP4441467B2 (ja) * 2004-12-24 2010-03-31 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性を備えた銅合金
JP4684787B2 (ja) * 2005-07-28 2011-05-18 株式会社神戸製鋼所 高強度銅合金
CN100389217C (zh) * 2006-01-13 2008-05-21 菏泽广源铜带股份有限公司 耐腐蚀合金黄铜h70及其铜带的制作方法
CN100387739C (zh) * 2006-01-13 2008-05-14 菏泽广源铜带股份有限公司 耐腐蚀合金黄铜h80及其铜带的制作方法
KR100640273B1 (ko) * 2006-04-11 2006-11-01 (주) 케이 이엔씨 윤활성 동합금
JP5492089B2 (ja) * 2008-09-10 2014-05-14 大豊工業株式会社 ＰｂフリーＣｕ−Ｂｉ系焼結材料製摺動部品
US20110123643A1 (en) * 2009-11-24 2011-05-26 Biersteker Robert A Copper alloy enclosures
CN105779810A (zh) * 2009-11-25 2016-07-20 诺而达埃斯波公司 铜合金以及换热器管
JP5468423B2 (ja) * 2010-03-10 2014-04-09 株式会社神戸製鋼所 高強度高耐熱性銅合金材
JP5120477B2 (ja) * 2011-04-07 2013-01-16 日立化成工業株式会社 電極用ペースト組成物及び太陽電池
AT511196B1 (de) * 2011-06-14 2012-10-15 Miba Gleitlager Gmbh Mehrschichtlagerschale
DE102012002450A1 (de) * 2011-08-13 2013-02-14 Wieland-Werke Ag Verwendung einer Kupferlegierung
TWI591192B (zh) * 2011-08-13 2017-07-11 Wieland-Werke Ag Copper alloy
JP5303678B1 (ja) 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP6029296B2 (ja) * 2012-03-08 2016-11-24 Ｊｘ金属株式会社 電気電子機器用Ｃｕ−Ｚｎ−Ｓｎ−Ｃａ合金
CN103060792B (zh) * 2012-11-23 2014-11-05 金星铜集团有限公司 一种使乌铜作品具有乌金效果的表面处理方法
JP5572754B2 (ja) 2012-12-28 2014-08-13 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
WO2014115307A1 (ja) 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
DE102013012288A1 (de) * 2013-07-24 2015-01-29 Wieland-Werke Ag Korngefeinte Kupfer-Gusslegierung
CN104818407A (zh) * 2015-05-12 2015-08-05 苏州列治埃盟新材料技术转移有限公司 新型多组分环保无铅合金新材料合金管及其制备方法
CN104831114A (zh) * 2015-05-12 2015-08-12 苏州列治埃盟新材料技术转移有限公司 新型多组分环保无铅合金新材料合金棒及其制备方法
CN105063418B (zh) * 2015-07-24 2017-04-26 宁波金田铜业(集团)股份有限公司 一种低合金化铜带的制备方法
CN105316520B (zh) * 2015-11-26 2017-11-14 山西春雷铜材有限责任公司 一种Cu‑Ni‑Sn铜合金板带的制备方法
CN107245600B (zh) * 2017-06-07 2018-11-20 安徽师范大学 一种锡磷锌铜合金及其制备方法
KR101829711B1 (ko) 2017-08-31 2018-02-19 박동한 치과보철용 동 합금
CN107974574B (zh) * 2017-12-08 2020-05-26 宁波兴业盛泰集团有限公司 一种耐应力松弛的复杂黄铜合金及其制备方法
CN110004322B (zh) * 2018-01-05 2021-05-14 比亚迪股份有限公司 一种铜基微晶合金及其制备方法和一种电子产品
CN108517439A (zh) * 2018-05-30 2018-09-11 苏州金仓合金新材料有限公司 一种机车零部件用青铜合金材料及其制备方法
CN109338151B (zh) * 2018-12-14 2021-07-20 宁波博威合金材料股份有限公司 一种电子电气设备用铜合金及用途
US11427891B2 (en) 2019-07-24 2022-08-30 Nibco Inc. Low silicon copper alloy piping components and articles
CN115896536A (zh) * 2022-12-26 2023-04-04 江西科美格新材料有限公司 一种锡锌铜合金及其制备方法和应用

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Also Published As

Publication number Publication date
EP0908526A1 (en) 1999-04-14
CA2270627A1 (en) 1999-03-25
KR100344782B1 (ko) 2002-07-20
HUP9801474A3 (en) 1999-08-30
TW474998B (en) 2002-02-01
HUP9801474A2 (hu) 1999-07-28
EP0908526B1 (en) 2003-10-22
CN1237212A (zh) 1999-12-01
CA2270627C (en) 2003-05-13
JPH11106851A (ja) 1999-04-20
US5893953A (en) 1999-04-13
PL189342B1 (pl) 2005-07-29
DE69819104D1 (de) 2003-11-27
PL327272A1 (en) 1999-03-29
HU9801474D0 (en) 1998-09-28
WO1999014388A1 (en) 1999-03-25
KR20000068598A (ko) 2000-11-25
DE69819104T2 (de) 2004-06-17
US6099663A (en) 2000-08-08
CN1080768C (zh) 2002-03-13

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20060624