HK1027134A1 - Microetching agent for copper and copper alloy. - Google Patents
Microetching agent for copper and copper alloy.Info
- Publication number
- HK1027134A1 HK1027134A1 HK00106326A HK00106326A HK1027134A1 HK 1027134 A1 HK1027134 A1 HK 1027134A1 HK 00106326 A HK00106326 A HK 00106326A HK 00106326 A HK00106326 A HK 00106326A HK 1027134 A1 HK1027134 A1 HK 1027134A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- copper
- microetching agent
- alloy
- copper alloy
- microetching
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK00106326A HK1027134A1 (en) | 1995-08-01 | 2000-10-05 | Microetching agent for copper and copper alloy. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19663695A JP3458023B2 (en) | 1995-08-01 | 1995-08-01 | Copper and copper alloy microetchants |
HK00106326A HK1027134A1 (en) | 1995-08-01 | 2000-10-05 | Microetching agent for copper and copper alloy. |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1027134A1 true HK1027134A1 (en) | 2001-01-05 |
Family
ID=35431684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00106326A HK1027134A1 (en) | 1995-08-01 | 2000-10-05 | Microetching agent for copper and copper alloy. |
Country Status (1)
Country | Link |
---|---|
HK (1) | HK1027134A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9441303B2 (en) | 2012-07-24 | 2016-09-13 | Mec Company Ltd. | Microetching solution for copper, replenishment solution therefor and method for production of wiring board |
-
2000
- 2000-10-05 HK HK00106326A patent/HK1027134A1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9441303B2 (en) | 2012-07-24 | 2016-09-13 | Mec Company Ltd. | Microetching solution for copper, replenishment solution therefor and method for production of wiring board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |
Effective date: 20170128 |