HK1027134A1 - Microetching agent for copper and copper alloy. - Google Patents

Microetching agent for copper and copper alloy.

Info

Publication number
HK1027134A1
HK1027134A1 HK00106326A HK00106326A HK1027134A1 HK 1027134 A1 HK1027134 A1 HK 1027134A1 HK 00106326 A HK00106326 A HK 00106326A HK 00106326 A HK00106326 A HK 00106326A HK 1027134 A1 HK1027134 A1 HK 1027134A1
Authority
HK
Hong Kong
Prior art keywords
copper
microetching agent
alloy
copper alloy
microetching
Prior art date
Application number
HK00106326A
Inventor
Yoshiro Maki
Toshiko Nakagawa
Yasushi Yamada
Takashi Haruta
Maki Arimura
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19663695A external-priority patent/JP3458023B2/en
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Priority to HK00106326A priority Critical patent/HK1027134A1/en
Publication of HK1027134A1 publication Critical patent/HK1027134A1/en

Links

HK00106326A 1995-08-01 2000-10-05 Microetching agent for copper and copper alloy. HK1027134A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
HK00106326A HK1027134A1 (en) 1995-08-01 2000-10-05 Microetching agent for copper and copper alloy.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19663695A JP3458023B2 (en) 1995-08-01 1995-08-01 Copper and copper alloy microetchants
HK00106326A HK1027134A1 (en) 1995-08-01 2000-10-05 Microetching agent for copper and copper alloy.

Publications (1)

Publication Number Publication Date
HK1027134A1 true HK1027134A1 (en) 2001-01-05

Family

ID=35431684

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00106326A HK1027134A1 (en) 1995-08-01 2000-10-05 Microetching agent for copper and copper alloy.

Country Status (1)

Country Link
HK (1) HK1027134A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9441303B2 (en) 2012-07-24 2016-09-13 Mec Company Ltd. Microetching solution for copper, replenishment solution therefor and method for production of wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9441303B2 (en) 2012-07-24 2016-09-13 Mec Company Ltd. Microetching solution for copper, replenishment solution therefor and method for production of wiring board

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20170128