HK100891A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
HK100891A
HK100891A HK1008/91A HK100891A HK100891A HK 100891 A HK100891 A HK 100891A HK 1008/91 A HK1008/91 A HK 1008/91A HK 100891 A HK100891 A HK 100891A HK 100891 A HK100891 A HK 100891A
Authority
HK
Hong Kong
Prior art keywords
ptfe
circuit board
printed circuit
layer
porous
Prior art date
Application number
HK1008/91A
Other languages
German (de)
English (en)
French (fr)
Inventor
Hirosuke Suzuki
Original Assignee
Junkosha Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co. Ltd. filed Critical Junkosha Co. Ltd.
Publication of HK100891A publication Critical patent/HK100891A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
HK1008/91A 1984-04-10 1991-12-12 Printed circuit board HK100891A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59072472A JPS60214941A (ja) 1984-04-10 1984-04-10 プリント基板

Publications (1)

Publication Number Publication Date
HK100891A true HK100891A (en) 1991-12-20

Family

ID=13490289

Family Applications (1)

Application Number Title Priority Date Filing Date
HK1008/91A HK100891A (en) 1984-04-10 1991-12-12 Printed circuit board

Country Status (6)

Country Link
US (1) US4640866A (cs)
EP (1) EP0160418B1 (cs)
JP (1) JPS60214941A (cs)
DE (1) DE3578811D1 (cs)
HK (1) HK100891A (cs)
SG (1) SG93691G (cs)

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US4999248A (en) * 1981-08-20 1991-03-12 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4982056A (en) * 1981-08-20 1991-01-01 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide
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JP2001185653A (ja) * 1999-10-12 2001-07-06 Fujitsu Ltd 半導体装置及び基板の製造方法
EP1194020A3 (en) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
JP2002160316A (ja) * 2000-11-27 2002-06-04 Daikin Ind Ltd 電気絶縁板、プリプレグ積層体及びこれらの製造方法
KR100910188B1 (ko) * 2001-07-19 2009-07-30 도레이 카부시키가이샤 회로기판, 회로기판용 부재 및 그 제조방법 및가요성필름의 라미네이트방법
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Also Published As

Publication number Publication date
EP0160418B1 (en) 1990-07-25
EP0160418A2 (en) 1985-11-06
JPS60214941A (ja) 1985-10-28
JPH0131717B2 (cs) 1989-06-27
US4640866A (en) 1987-02-03
EP0160418A3 (en) 1986-11-26
SG93691G (en) 1991-12-13
DE3578811D1 (de) 1990-08-30

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)