SG93691G - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
SG93691G
SG93691G SG93691A SG93691A SG93691G SG 93691 G SG93691 G SG 93691G SG 93691 A SG93691 A SG 93691A SG 93691 A SG93691 A SG 93691A SG 93691 G SG93691 G SG 93691G
Authority
SG
Singapore
Prior art keywords
layer
ptfe
printed circuit
circuit board
solid
Prior art date
Application number
SG93691A
Other languages
English (en)
Original Assignee
Junkosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co Ltd filed Critical Junkosha Co Ltd
Publication of SG93691G publication Critical patent/SG93691G/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
SG93691A 1984-04-10 1991-11-07 Printed circuit board SG93691G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59072472A JPS60214941A (ja) 1984-04-10 1984-04-10 プリント基板

Publications (1)

Publication Number Publication Date
SG93691G true SG93691G (en) 1991-12-13

Family

ID=13490289

Family Applications (1)

Application Number Title Priority Date Filing Date
SG93691A SG93691G (en) 1984-04-10 1991-11-07 Printed circuit board

Country Status (6)

Country Link
US (1) US4640866A (cs)
EP (1) EP0160418B1 (cs)
JP (1) JPS60214941A (cs)
DE (1) DE3578811D1 (cs)
HK (1) HK100891A (cs)
SG (1) SG93691G (cs)

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US4977297A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4985308A (en) * 1981-08-20 1991-01-15 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977026A (en) * 1981-08-20 1990-12-11 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5000547A (en) * 1981-08-20 1991-03-19 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977025A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4977008A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4999248A (en) * 1981-08-20 1991-03-12 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4982056A (en) * 1981-08-20 1991-01-01 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxide
US4973142A (en) * 1981-08-20 1990-11-27 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
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US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
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US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
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US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
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US5882954A (en) * 1997-10-06 1999-03-16 Ford Motor Company Method for adhering a metallization to a substrate
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JP2001185653A (ja) * 1999-10-12 2001-07-06 Fujitsu Ltd 半導体装置及び基板の製造方法
EP1194020A3 (en) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
JP2002160316A (ja) * 2000-11-27 2002-06-04 Daikin Ind Ltd 電気絶縁板、プリプレグ積層体及びこれらの製造方法
KR100910188B1 (ko) * 2001-07-19 2009-07-30 도레이 카부시키가이샤 회로기판, 회로기판용 부재 및 그 제조방법 및가요성필름의 라미네이트방법
KR100408815B1 (ko) * 2001-12-13 2003-12-06 주식회사 비에스이 초고전하보존 특성을 갖는 다층 일렉트릿 및 그 제조방법
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CN103181247A (zh) * 2011-05-23 2013-06-26 住友电工超效能高分子股份有限公司 高频电路基板
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CN109561594B (zh) * 2018-12-28 2020-01-17 深圳市景旺电子股份有限公司 高频电路板及其制作方法
CN111674118A (zh) * 2020-06-09 2020-09-18 陕西卫宁电子材料有限公司 铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板
CN114434901B (zh) * 2021-12-13 2023-04-04 华为技术有限公司 一种覆铜板及其制备方法

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Also Published As

Publication number Publication date
EP0160418B1 (en) 1990-07-25
EP0160418A2 (en) 1985-11-06
JPS60214941A (ja) 1985-10-28
JPH0131717B2 (cs) 1989-06-27
HK100891A (en) 1991-12-20
US4640866A (en) 1987-02-03
EP0160418A3 (en) 1986-11-26
DE3578811D1 (de) 1990-08-30

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