CN111674118A - 铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板 - Google Patents

铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板 Download PDF

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CN111674118A
CN111674118A CN202010518237.4A CN202010518237A CN111674118A CN 111674118 A CN111674118 A CN 111674118A CN 202010518237 A CN202010518237 A CN 202010518237A CN 111674118 A CN111674118 A CN 111674118A
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based microwave
copper
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周渭宁
张�诚
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Shaanxi Weining Electronic Material Co ltd
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Abstract

本发明公开了铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板，制备方法包括以下步骤：S1、在搅拌器内依次加入聚四氟乙烯乳液、二氧化钛，搅拌均匀后得到乳液状混合物；S2、用压延机将乳液状混合物压成片状并以250～270℃的温度烘烤5小时，然后烧结成型，得到粘结片；S3、使用激光光束对粘结片、铝板的外表面进行粗糙度处理；S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，得到铝基微波覆铜板。所述铝基微波覆铜板由上述制备方法制得。

Description

铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板
技术领域
本发明涉及覆铜板领域，尤其涉及铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板。
背景技术
随着铝基微波覆铜板市场需求量的不断加大以及其产品技术的不断更新和发展，铝基微波覆铜板已经成为金属基微波覆铜板市场的高端产品，铝板、铜箔和粘结片是其成型的关键原材料，铝基微波覆铜板的生产通常采用粘结片、铝板和铜箔叠合并通过高温一体压合而成，目前的铝基微波覆铜板制造还受到了设备和处理工艺的制约，原氧化处理工艺制作的铝基微波覆铜板存在剥离强度较低(仅为2.9N/cm)，粘结片脆性大，工艺落后、生产效率较低、成本较高的问题，因此现有的铝基微波覆铜板工艺难以满足目前铝基微波覆铜板的生产需求。
发明内容
本发明目的是针对上述问题，提供一种提高铝基微波覆铜板剥离强度以及生产效率的铝基微波覆铜板的制备方法及其制成的铝基微波覆铜板。
为了实现上述目的，本发明的技术方案是：
铝基微波覆铜板的制备方法，包括以下步骤：
S1、在搅拌器内依次加入30～40份聚四氟乙烯乳液、60～70份二氧化钛，搅拌均匀后得到乳液状混合物；
S2、用压延机将乳液状混合物压成片状并以250～270℃的温度烘烤5小时，然后在300℃的温度下烧结成型，得到粘结片；
S3、使用激光光束对粘结片、铝板的外表面进行粗糙度处理；
S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；
S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，得到铝基微波覆铜板。
进一步的，所述步骤S3中采用激光表面处理机对粘结片、铝板的外表面进行粗糙度处理。
进一步的，所述步骤S3中的激光光束为短脉冲激光光束，其能量为50～100W。
进一步的，所述步骤S3中使用激光光束对粘结片、铝板的外表面进行粗糙度处理时，激光光束的处理速度为1～2m/min。
进一步的，所述步骤S3中激光光束对粘结片、铝板的外表面进行粗糙度处理后，粘结片外表面的粗糙度为5～10um，铝板外表面的粗糙度为1～10um。
进一步的，所述步骤S5中，将铜箔、粘结片、铝板放置在高温热压机中进行压合时，其压合温度为390～395℃；其压合时间为8～10小时；其压合压力为 50～60kg/m2。
铝基微波覆铜板，所述铝基微波覆铜板由上述铝基微波覆铜板的制备方法制成。
与现有技术相比，本发明具有的优点和积极效果是：
本发明通过采用以聚四氟乙烯乳液、二氧化钛为原料制备得到粘结片，其使得粘结片具有一定的韧性，避免了因粘结片脆性大导致铝基微波覆铜板不易叠合的状况发生，并且其通过使用激光光束对铝板、粘结片表面进行粗糙度处理，使得铝板、粘结片、铜箔叠合时其摩擦力更大，从而提高了铝基微波覆铜板的剥离强度，同时通过激光光束对铝板、粘结片表面进行处理具有效率高、成本低的优势，完全可以满足铝基微波覆铜板的生产需求，给铝基微波覆铜板的进一步发展作出了一定的贡献。
具体实施方式
下面将结合本发明的实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
实施例1、本实施例中的铝基微波覆铜板的制备方法，包括以下步骤：
S1、在搅拌器内依次加入30份聚四氟乙烯乳液、60份二氧化钛，搅拌均匀后得到乳液状混合物；
S2、用压延机将乳液状混合物压成片状并以250℃的温度烘烤5小时，然后在300℃的温度下烧结成型，得到粘结片；
S3、采用激光表面处理机发射短脉冲激光光束对粘结片、铝板的外表面进行粗糙度处理，短脉冲激光光束的能量为50W；其处理速度为1m/min；处理过后，粘结片外表面的粗糙度为5um，铝板外表面的粗糙度为1um；
S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；
S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，其压合温度为390℃；其压合时间为8小时；其压合压力为50kg/m2；得到铝基微波覆铜板。
一种铝基微波覆铜板，所述铝基微波覆铜板由上述铝基微波覆铜板的制备方法制成。
实施例2、本实施例中的铝基微波覆铜板的制备方法，包括以下步骤：
S1、在搅拌器内依次加入35份聚四氟乙烯乳液、65份二氧化钛，搅拌均匀后得到乳液状混合物；
S2、用压延机将乳液状混合物压成片状并以260℃的温度烘烤5小时，然后在300℃的温度下烧结成型，得到粘结片；
S3、采用激光表面处理机发射短脉冲激光光束对粘结片、铝板的外表面进行粗糙度处理，短脉冲激光光束的能量为80W；其处理速度为2m/min；处理过后，粘结片外表面的粗糙度为8um，铝板外表面的粗糙度为8um；
S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；
S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，其压合温度为392℃；其压合时间为9小时；其压合压力为55kg/m2；得到铝基微波覆铜板。
一种铝基微波覆铜板，所述铝基微波覆铜板由上述铝基微波覆铜板的制备方法制成。
实施例3、本实施例中的铝基微波覆铜板的制备方法，包括以下步骤：
S1、在搅拌器内依次加入40份聚四氟乙烯乳液、70份二氧化钛，搅拌均匀后得到乳液状混合物；
S2、用压延机将乳液状混合物压成片状并以270℃的温度烘烤5小时，然后在300℃的温度下烧结成型，得到粘结片；
S3、采用激光表面处理机发射短脉冲激光光束对粘结片、铝板的外表面进行粗糙度处理，短脉冲激光光束的能量为100W；其处理速度为2m/min；处理过后，粘结片外表面的粗糙度为10um，铝板外表面的粗糙度为10um；
S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；
S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，其压合温度为395℃；其压合时间为10小时；其压合压力为60kg/m2；得到铝基微波覆铜板。
一种铝基微波覆铜板，所述铝基微波覆铜板由上述铝基微波覆铜板的制备方法制成。
本发明通过采用以聚四氟乙烯乳液、二氧化钛为原料制备得到粘结片，其使得粘结片具有一定的韧性，避免了因粘结片脆性大导致铝基微波覆铜板不易叠合的状况发生，并且其通过使用激光光束对铝板、粘结片表面进行粗糙度处理，使得铝板、粘结片、铜箔叠合时其摩擦力更大，从而提高了铝基微波覆铜板的剥离强度，同时通过激光光束对铝板、粘结片表面进行处理具有效率高、成本低的优势，完全可以满足铝基微波覆铜板的生产需求，给铝基微波覆铜板的进一步发展作出了一定的贡献。

Claims (7)

1.铝基微波覆铜板的制备方法，其特征在于：包括以下步骤：
S1、在搅拌器内依次加入30～40份聚四氟乙烯乳液、60～70份二氧化钛，搅拌均匀后得到乳液状混合物；
S2、用压延机将乳液状混合物压成片状并以250～270℃的温度烘烤5小时，然后在300℃的温度下烧结成型，得到粘结片；
S3、使用激光光束对粘结片、铝板的外表面进行粗糙度处理；
S4、对承载板表面进行清洁，将铜箔的氧化面朝下放置在承载板上，然后将粗糙度处理后的粘结片、铝板依次叠加在铜箔上端面并将铜箔、粘结片、铝板的边缘对齐；
S5、将叠加后的铜箔、粘结片、铝板放置在高温热压机中进行压合操作，得到铝基微波覆铜板。
2.如权利要求1所述的铝基微波覆铜板的制备方法，其特征在于：所述步骤S3中采用激光表面处理机对粘结片、铝板的外表面进行粗糙度处理。
3.如权利要求1所述的铝基微波覆铜板的制备方法，其特征在于：所述步骤S3中的激光光束为短脉冲激光光束，其能量为50～100W。
4.如权利要求1所述的铝基微波覆铜板的制备方法，其特征在于：所述步骤S3中使用激光光束对粘结片、铝板的外表面进行粗糙度处理时，激光光束的处理速度为1～2m/min。
5.如权利要求1所述的铝基微波覆铜板的制备方法，其特征在于：所述步骤S3中激光光束对粘结片、铝板的外表面进行粗糙度处理后，粘结片外表面的粗糙度为5～10um，铝板外表面的粗糙度为1～10um。
6.如权利要求1所述的铝基微波覆铜板的制备方法，其特征在于：所述步骤S5中，将铜箔、粘结片、铝板放置在高温热压机中进行压合时，其压合温度为390～395℃；其压合时间为8～10小时；其压合压力为50～60kg/m2。
7.铝基微波覆铜板，其特征在于：所述铝基微波覆铜板由权利要求1～6中任一所述的铝基微波覆铜板的制备方法制成。
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JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
US5082547A (en) * 1991-02-01 1992-01-21 Plasma Etch Plasma etching reactor
CN107867037A (zh) * 2016-09-26 2018-04-03 江门市华锐铝基板有限公司 一种铝基覆铜板的压制工艺
CN110602888A (zh) * 2019-09-18 2019-12-20 中国电子科技集团公司第四十六研究所 一种衬铝高频基板的制备方法
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Publication number Priority date Publication date Assignee Title
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
US5082547A (en) * 1991-02-01 1992-01-21 Plasma Etch Plasma etching reactor
CN107867037A (zh) * 2016-09-26 2018-04-03 江门市华锐铝基板有限公司 一种铝基覆铜板的压制工艺
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