GB939997A - Improvements in or relating to copper pyrophosphate electroplating solutions - Google Patents
Improvements in or relating to copper pyrophosphate electroplating solutionsInfo
- Publication number
- GB939997A GB939997A GB25733/60A GB2573360A GB939997A GB 939997 A GB939997 A GB 939997A GB 25733/60 A GB25733/60 A GB 25733/60A GB 2573360 A GB2573360 A GB 2573360A GB 939997 A GB939997 A GB 939997A
- Authority
- GB
- United Kingdom
- Prior art keywords
- relating
- copper pyrophosphate
- equivalent
- electroplating solutions
- pyrophosphate electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009713 electroplating Methods 0.000 title abstract 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 title 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical class [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 238000010792 warming Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D285/00—Heterocyclic compounds containing rings having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by groups C07D275/00 - C07D283/00
- C07D285/01—Five-membered rings
- C07D285/02—Thiadiazoles; Hydrogenated thiadiazoles
- C07D285/04—Thiadiazoles; Hydrogenated thiadiazoles not condensed with other rings
- C07D285/12—1,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles
- C07D285/125—1,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles with oxygen, sulfur or nitrogen atoms, directly attached to ring carbon atoms, the nitrogen atoms not forming part of a nitro radical
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL267368D NL267368A (enEXAMPLES) | 1960-07-23 | ||
| NL123240D NL123240C (enEXAMPLES) | 1960-07-23 | ||
| GB25733/60A GB939997A (en) | 1960-07-23 | 1960-07-23 | Improvements in or relating to copper pyrophosphate electroplating solutions |
| GB2558461A GB940282A (en) | 1960-07-23 | 1961-07-14 | Improvements in or relating to copper pyrophosphate electroplating baths |
| US125363A US3161575A (en) | 1960-07-23 | 1961-07-20 | Copper pyrophosphate electroplating solutions |
| FR868589A FR1295775A (fr) | 1960-07-23 | 1961-07-21 | Solution pour le dépôt électrolytique de cuivre |
| DEA37961A DE1225938B (de) | 1960-07-23 | 1961-07-24 | Bad zum galvanischen Abscheiden von Kupferueberzuegen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB25733/60A GB939997A (en) | 1960-07-23 | 1960-07-23 | Improvements in or relating to copper pyrophosphate electroplating solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB939997A true GB939997A (en) | 1963-10-16 |
Family
ID=10232403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB25733/60A Expired GB939997A (en) | 1960-07-23 | 1960-07-23 | Improvements in or relating to copper pyrophosphate electroplating solutions |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3161575A (enEXAMPLES) |
| DE (1) | DE1225938B (enEXAMPLES) |
| GB (1) | GB939997A (enEXAMPLES) |
| NL (2) | NL267368A (enEXAMPLES) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4970834A (enEXAMPLES) * | 1972-11-08 | 1974-07-09 | ||
| JPS5167234A (ja) * | 1974-12-09 | 1976-06-10 | Hitachi Ltd | Pirorinsandometsukizeikahimakuboshiho |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1235101A (en) * | 1967-05-01 | 1971-06-09 | Albright & Wilson Mfg Ltd | Improvements relating to electrodeposition of copper |
| CA898183A (en) * | 1970-05-25 | 1972-04-18 | R. Bharucha Nanabhai | Method of plating copper on aluminum |
| CA1001581A (en) * | 1971-11-10 | 1976-12-14 | Canada Wire And Cable Limited | Plating copper on aluminum |
| US4517103A (en) * | 1983-04-18 | 1985-05-14 | R. T. Vanderbilt Company, Inc. | Lubricating compositions containing 5,5'-dithiobis(1,3,4-thiadiazole-2-thiol) |
| US6544399B1 (en) | 1999-01-11 | 2003-04-08 | Applied Materials, Inc. | Electrodeposition chemistry for filling apertures with reflective metal |
| US6379522B1 (en) | 1999-01-11 | 2002-04-30 | Applied Materials, Inc. | Electrodeposition chemistry for filling of apertures with reflective metal |
| US6620771B2 (en) * | 1999-10-20 | 2003-09-16 | R. T. Vanderbilt Company, Inc. | Thiadiazole dimer additives and lubricating compositions containing the same |
| CA2346023C (en) | 1999-10-20 | 2002-12-10 | R.T. Vanderbilt Company, Inc. | Thiadizole dimer additives and lubricating compositions containing the same |
| JP2004519557A (ja) * | 2001-02-23 | 2004-07-02 | 株式会社荏原製作所 | 銅めっき液、めっき方法及びめっき装置 |
| US20050067297A1 (en) * | 2003-09-26 | 2005-03-31 | Innovative Technology Licensing, Llc | Copper bath for electroplating fine circuitry on semiconductor chips |
| DE102005004472A1 (de) * | 2005-01-31 | 2006-08-10 | Rhein Chemie Rheinau Gmbh | Verfahren zur Herstellung von Bis-DMTD |
| CN102395712A (zh) * | 2009-02-12 | 2012-03-28 | 技术研究及发展基金有限公司 | 电镀铜的方法 |
| DE102009041250B4 (de) * | 2009-09-11 | 2011-09-01 | Umicore Galvanotechnik Gmbh | Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung |
| US20110092465A1 (en) * | 2009-10-21 | 2011-04-21 | Syracuse University | Monomeric pyrophosphate complexes and methods of treatment using the complexes |
| SE545031C2 (en) * | 2021-07-15 | 2023-03-07 | Seolfor Ab | Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2462870A (en) * | 1942-07-09 | 1949-03-01 | Gen Motors Corp | Electrodeposition of copper |
| US2437865A (en) * | 1943-09-25 | 1948-03-16 | United Chromium Inc | Method of electrodepositing copper and baths and compositions therefor |
| US2493092A (en) * | 1946-01-11 | 1950-01-03 | United Chromium Inc | Method of electrodepositing copper and baths therefor |
| US2609339A (en) * | 1948-11-02 | 1952-09-02 | United Chromium Inc | Bright copper plating from cyanide baths |
| US2663684A (en) * | 1952-06-02 | 1953-12-22 | Houdaille Hershey Corp | Method of and composition for plating copper |
| BE556801A (enEXAMPLES) * | 1956-04-19 | |||
| NL110592C (enEXAMPLES) * | 1956-06-15 | |||
| US2914535A (en) * | 1956-12-31 | 1959-11-24 | Monsanto Chemicals | 5-carbalkoxy-4-alkyl-2-thiazole-sulfenamides |
-
0
- NL NL123240D patent/NL123240C/xx active
- NL NL267368D patent/NL267368A/xx unknown
-
1960
- 1960-07-23 GB GB25733/60A patent/GB939997A/en not_active Expired
-
1961
- 1961-07-20 US US125363A patent/US3161575A/en not_active Expired - Lifetime
- 1961-07-24 DE DEA37961A patent/DE1225938B/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4970834A (enEXAMPLES) * | 1972-11-08 | 1974-07-09 | ||
| JPS5167234A (ja) * | 1974-12-09 | 1976-06-10 | Hitachi Ltd | Pirorinsandometsukizeikahimakuboshiho |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1225938B (de) | 1966-09-29 |
| US3161575A (en) | 1964-12-15 |
| NL123240C (enEXAMPLES) | |
| NL267368A (enEXAMPLES) |
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