NL267368A - - Google Patents

Info

Publication number
NL267368A
NL267368A NL267368DA NL267368A NL 267368 A NL267368 A NL 267368A NL 267368D A NL267368D A NL 267368DA NL 267368 A NL267368 A NL 267368A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL267368A publication Critical patent/NL267368A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D285/00Heterocyclic compounds containing rings having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by groups C07D275/00 - C07D283/00
    • C07D285/01Five-membered rings
    • C07D285/02Thiadiazoles; Hydrogenated thiadiazoles
    • C07D285/04Thiadiazoles; Hydrogenated thiadiazoles not condensed with other rings
    • C07D285/121,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles
    • C07D285/1251,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles with oxygen, sulfur or nitrogen atoms, directly attached to ring carbon atoms, the nitrogen atoms not forming part of a nitro radical
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
NL267368D 1960-07-23 NL267368A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB25733/60A GB939997A (en) 1960-07-23 1960-07-23 Improvements in or relating to copper pyrophosphate electroplating solutions

Publications (1)

Publication Number Publication Date
NL267368A true NL267368A (xx)

Family

ID=10232403

Family Applications (2)

Application Number Title Priority Date Filing Date
NL267368D NL267368A (xx) 1960-07-23
NL123240D NL123240C (xx) 1960-07-23

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL123240D NL123240C (xx) 1960-07-23

Country Status (4)

Country Link
US (1) US3161575A (xx)
DE (1) DE1225938B (xx)
GB (1) GB939997A (xx)
NL (2) NL123240C (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235101A (en) * 1967-05-01 1971-06-09 Albright & Wilson Mfg Ltd Improvements relating to electrodeposition of copper
CA898183A (en) * 1970-05-25 1972-04-18 R. Bharucha Nanabhai Method of plating copper on aluminum
CA1001581A (en) * 1971-11-10 1976-12-14 Canada Wire And Cable Limited Plating copper on aluminum
JPS4970834A (xx) * 1972-11-08 1974-07-09
JPS5167234A (ja) * 1974-12-09 1976-06-10 Hitachi Ltd Pirorinsandometsukizeikahimakuboshiho
US4517103A (en) * 1983-04-18 1985-05-14 R. T. Vanderbilt Company, Inc. Lubricating compositions containing 5,5'-dithiobis(1,3,4-thiadiazole-2-thiol)
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
ES2656789T3 (es) 1999-10-20 2018-02-28 Vanderbilt Chemicals, Llc Aditivos de dímeros de tiadizol y composiciones lubricantes que los contienen
US6620771B2 (en) * 1999-10-20 2003-09-16 R. T. Vanderbilt Company, Inc. Thiadiazole dimer additives and lubricating compositions containing the same
WO2002068727A2 (en) * 2001-02-23 2002-09-06 Ebara Corporation Copper-plating solution, plating method and plating apparatus
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
DE102005004472A1 (de) * 2005-01-31 2006-08-10 Rhein Chemie Rheinau Gmbh Verfahren zur Herstellung von Bis-DMTD
CN102395712A (zh) * 2009-02-12 2012-03-28 技术研究及发展基金有限公司 电镀铜的方法
DE102009041250B4 (de) * 2009-09-11 2011-09-01 Umicore Galvanotechnik Gmbh Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung
US20110092465A1 (en) * 2009-10-21 2011-04-21 Syracuse University Monomeric pyrophosphate complexes and methods of treatment using the complexes
SE545031C2 (en) * 2021-07-15 2023-03-07 Seolfor Ab Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2462870A (en) * 1942-07-09 1949-03-01 Gen Motors Corp Electrodeposition of copper
US2437865A (en) * 1943-09-25 1948-03-16 United Chromium Inc Method of electrodepositing copper and baths and compositions therefor
US2493092A (en) * 1946-01-11 1950-01-03 United Chromium Inc Method of electrodepositing copper and baths therefor
US2609339A (en) * 1948-11-02 1952-09-02 United Chromium Inc Bright copper plating from cyanide baths
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
BE556801A (xx) * 1956-04-19
BE556462A (xx) * 1956-06-15
US2914535A (en) * 1956-12-31 1959-11-24 Monsanto Chemicals 5-carbalkoxy-4-alkyl-2-thiazole-sulfenamides

Also Published As

Publication number Publication date
US3161575A (en) 1964-12-15
DE1225938B (de) 1966-09-29
NL123240C (xx)
GB939997A (en) 1963-10-16

Similar Documents

Publication Publication Date Title
JPS4828553B1 (xx)
DE1211152C2 (xx)
FR920M (xx)
FR1579453A (xx)
FR1271578A (xx)
FR878M (xx)
FR700M (xx)
FR779M (xx)
IT649856A (xx)
NL245932A (xx)
NL102890C (xx)
BE625232A (xx)
BE605487A (xx)
BE643818A (xx)
BE655951A (xx)
CH1047261A4 (xx)
BE606549A (xx)
BE603511A (xx)
CH1098160A4 (xx)
BE606732A (xx)
BE607032A (xx)
NL267368A (xx)
CH1025060A4 (xx)
BE604825A (xx)
BE624777A (xx)