US2493092A - Method of electrodepositing copper and baths therefor - Google Patents
Method of electrodepositing copper and baths therefor Download PDFInfo
- Publication number
- US2493092A US2493092A US640680A US64068046A US2493092A US 2493092 A US2493092 A US 2493092A US 640680 A US640680 A US 640680A US 64068046 A US64068046 A US 64068046A US 2493092 A US2493092 A US 2493092A
- Authority
- US
- United States
- Prior art keywords
- copper
- bath
- baths
- pyrophosphate
- electrodepositing copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 title claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 20
- 229910052802 copper Inorganic materials 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 14
- 235000011180 diphosphates Nutrition 0.000 claims description 12
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 6
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 230000001464 adherent effect Effects 0.000 claims description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 claims description 2
- 229940048084 pyrophosphate Drugs 0.000 description 9
- 238000007747 plating Methods 0.000 description 6
- 238000013019 agitation Methods 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- -1 alkali metal pyrophosphate salt Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000005255 carburizing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Definitions
- the bath is like that of Patent #2,250,556, in that it contains the complex copper pyrophosphate ion, Cu(P2Oz) 2; according to the present invention the bath contains the nitrate ion, N03 ammonia (NI-I3), and has a pH between 7.5 and 9.5 (measured by a glass electrode pH meter).
- NI-I3 N03 ammonia
- the quantity of N03 ion which is present is from 5 to 20 g./l.
- alkali metal pyrophosphates notably the potassium salt
- the potassium salt when used can produce baths which are more concentrated, and which, in turn, permit a corresponding increase in plating current densities at the cathode to be attained.
- the pyrophosphate radical may be said to combine with the copper in the molecular weight ratio of 2 to 1 to form a pyrophosphate copper complex radical having the formula (CuPzOflz (see Jour. American Chemical Society 1936, pp. 14124429).
- the proportion of the pyrophosphate radical to copper may vary considerably, but it is advantageous when electrodepositing copper on iron, steel, and other less noble metals, to have an excess of py p p dissolved in the bath beyond that necessary to give the molecular weight ratio of 2 to 1 between P201 and Cu.
- the baths given in the specific examples contain such an excess of pyrophosphate radicals.
- the free pyrophosphate content of the bath decreases the tendency for the deposition of copper by immersion on the less noble metals. It also tends to prevent the formation of traces of insoluble salts in the bath and promotes anode corrosion.
- ammonia About 3 g./l. of ammonia are added to aid anode corrosion with an optimum range from 1 to 3 g./l.
- the pH of the bath ranges from 7.5 to 9.5 and is adjusted by adding a suitable acid such as pyrophosphoric acid, or citric acid, or nitric acid, when a test shows that the pH of the bath is higher than the pH desired, or by adding a suitable alkali such as sodium hydroxide for a sodium bath, or potassium hydroxide for a potas-- sium bath, when the test shows that the pH of the bath is lower than the pH desired.
- a suitable acid such as pyrophosphoric acid, or citric acid, or nitric acid
- the baths hereinafter described are stable at higher temperatures, up to the boiling point of the solution. No poisonous fumes are evolved. The operating current efiiciency is nearly The throwing power of the baths is excellent. Under ordinary operating conditions, temperatures from to F. are usually preferrerd, although 70 to F. may be used. For a strike solution, temperatures of about 70 to 80 F. are preferred.
- Agitation of the solution is desirable. Air agitation is generally used because it is simple, convenient, and causes no buildup of carbonates in this bath. Mechanical agitation or a combination thereof with air agitation is also satisfactory. Agitation of the solution increases the operable current density range. The operable current density range also increases with rising tempera- Examples of baths and of operating conditions for using the invention to the best advantage are given below.
- Bath composition for ordinary tank plating Optimum range Cu, 30 g./1 24 to 36 P207, 200 g./l 150 to 250 Citrate radical, 15 g./l to 25 NO3,10 g./1 5110 20 NI-Ia, 1.5 g./l. Ito 3 ,pH, 8.5 8.0 to 9.5 Temperature, 135 F. F 120 to 150 Bath composition for maximum plating speeds Cu, 35 g./l.
- the current density per a square foot may be 300 amperes per square foot, thus making the process ideally suitable for building up heavy coatings on rolls, electroforms, electrotypes, etc.
- the deposit Being fine grained and 4 dense, the deposit is particularly good as a stopofi for carburizing or for nitriding, often requiring less thickness than usual to prevent carbon penetration.
- the baths may have other embodiments than those herein specifically described, and the process may be practiced in other modes than that specifically described.
- a method of depositing dense and adherent copper consisting in passing electric current from an anode to a cathode-object immersed in an aqueous bath having a pH between 7.5 and 9.5, and a temperature between F. and 160 F., and in which the bath-consists essentially of 7.5 to 45 g./l. bivalent copper, to 250 g./l. pyrophosphate (P207), 5 to 20 g./l. nitrate (N03) and 1 to 3 g./l. ammonia (NHs).
- An aqueous bath for copper deposition consisting essentially of 7.5 to 45 g./1. bivalent copper, 100 to 250 g./l. pyrophosphate (P207) 5 to 20 g./1. nitrate (N03) and 1 to 3 g./l. ammonia (NH3) and having a pH between 7.5 and 9.5.
Description
Patented Jan. 3, 1950 DIETHOD OF ELECTRODEPOSITING COPPER AND RATES THEREFOR Jesse E. Stareck, Birmingham, Mich., assignor to United Chromium, Incorporated, New York, N. Y., a corporation of Delaware No Drawing. Application January 11, 1946, Serial No. 640,680
2 Claims. (Cl. 204-52) This invention relates to the electrodeposition of copper, and to baths therefor, and provides improvements therein.
In U. S. Patent 2,250,556, granted July 9, 1941,
'to Jesse E. Stareck, there is disclosed a process deposited copper on aluminum and stainless steel is obtained, and a superior process and bath for barrel plating is obtained. The inventioncan also be used to good advantage for obtaining strike deposits of copper. The low operating pH makes the process particularly favorable for plating over the more diificult metals, such as magnesium, aluminum, zinc, lead, stainless steel and certain alloy steels and castings.
The bath is like that of Patent #2,250,556, in that it contains the complex copper pyrophosphate ion, Cu(P2Oz) 2; according to the present invention the bath contains the nitrate ion, N03 ammonia (NI-I3), and has a pH between 7.5 and 9.5 (measured by a glass electrode pH meter).
With baths having composition given in the examples which follow, the quantity of N03 ion which is present is from 5 to 20 g./l.
The concentrations of the bath constituents may be varied widely to give satisfactor plating baths. An example of a bath according to the present invention is one containing in solution from 7.5 to 45 g./1 of metallic copper with a pyrophosphate content from that necessary to convert the copper to the complex radical Cu(PzO'1) 2 to an excess limited by saturation. The copper may be conveniently added in the form of copper pyrophosphate, copper sulphate (blue vitriol), or other common cupric compounds of copper. The pyrophosphate radical may be added in the form of an alkali metal pyrophosphate salt either in the hydrated or anhydrous state. From the standpoint of economy of solution cost, the sodium pyrophosphate may be used. However, certain of the other alkali metal pyrophosphates, notably the potassium salt, are more soluble than the sodium salt, and when used can produce baths which are more concentrated, and which, in turn, permit a corresponding increase in plating current densities at the cathode to be attained.
The pyrophosphate radical may be said to combine with the copper in the molecular weight ratio of 2 to 1 to form a pyrophosphate copper complex radical having the formula (CuPzOflz (see Jour. American Chemical Society 1936, pp. 14124429).
In baths used for the electrodeposition of copper on the more noble metals, the proportion of the pyrophosphate radical to copper may vary considerably, but it is advantageous when electrodepositing copper on iron, steel, and other less noble metals, to have an excess of py p p dissolved in the bath beyond that necessary to give the molecular weight ratio of 2 to 1 between P201 and Cu. The baths given in the specific examples contain such an excess of pyrophosphate radicals. The free pyrophosphate content of the bath decreases the tendency for the deposition of copper by immersion on the less noble metals. It also tends to prevent the formation of traces of insoluble salts in the bath and promotes anode corrosion.
About 3 g./l. of ammonia are added to aid anode corrosion with an optimum range from 1 to 3 g./l.
The pH of the bath ranges from 7.5 to 9.5 and is adjusted by adding a suitable acid such as pyrophosphoric acid, or citric acid, or nitric acid, when a test shows that the pH of the bath is higher than the pH desired, or by adding a suitable alkali such as sodium hydroxide for a sodium bath, or potassium hydroxide for a potas-- sium bath, when the test shows that the pH of the bath is lower than the pH desired.
The baths hereinafter described are stable at higher temperatures, up to the boiling point of the solution. No poisonous fumes are evolved. The operating current efiiciency is nearly The throwing power of the baths is excellent. Under ordinary operating conditions, temperatures from to F. are usually preferrerd, although 70 to F. may be used. For a strike solution, temperatures of about 70 to 80 F. are preferred.
Agitation of the solution is desirable. Air agitation is generally used because it is simple, convenient, and causes no buildup of carbonates in this bath. Mechanical agitation or a combination thereof with air agitation is also satisfactory. Agitation of the solution increases the operable current density range. The operable current density range also increases with rising tempera- Examples of baths and of operating conditions for using the invention to the best advantage are given below.
Bath composition for ordinary tank plating Optimum range Cu, 30 g./1 24 to 36 P207, 200 g./l 150 to 250 Citrate radical, 15 g./l to 25 NO3,10 g./1 5110 20 NI-Ia, 1.5 g./l. Ito 3 ,pH, 8.5 8.0 to 9.5 Temperature, 135 F. F 120 to 150 Bath composition for maximum plating speeds Cu, 35 g./l. P207, 230 g./l 190 to 250 Citrate radical, I5 g./l 5 to 25 N03, g./1 5 to 20 NH3,1 /g g./l 1 to 2 pH, 8.5 8.0 to 9.5 Temperature, 140 F F 130 to 150 As hereinbefore stated, current densities of 100 amperes per square foot and more may be used;
with rotating cathodes the current density per a square foot may be 300 amperes per square foot, thus making the process ideally suitable for building up heavy coatings on rolls, electroforms, electrotypes, etc.
The above described process gives deposits which are smooth, fine grained, dense,ductile,
and relatively bright. Being fine grained and 4 dense, the deposit is particularly good as a stopofi for carburizing or for nitriding, often requiring less thickness than usual to prevent carbon penetration.
The baths may have other embodiments than those herein specifically described, and the process may be practiced in other modes than that specifically described.
A related bath is described in my co-pending application Serial No. 503,846, filed September 25, 1943, which has become Patent 2,437,865, granted March 16, 1948.
What is claimed is:
1. .A method of depositing dense and adherent copper, consisting in passing electric current from an anode to a cathode-object immersed in an aqueous bath having a pH between 7.5 and 9.5, and a temperature between F. and 160 F., and in which the bath-consists essentially of 7.5 to 45 g./l. bivalent copper, to 250 g./l. pyrophosphate (P207), 5 to 20 g./l. nitrate (N03) and 1 to 3 g./l. ammonia (NHs).
2. An aqueous bath for copper deposition consisting essentially of 7.5 to 45 g./1. bivalent copper, 100 to 250 g./l. pyrophosphate (P207) 5 to 20 g./1. nitrate (N03) and 1 to 3 g./l. ammonia (NH3) and having a pH between 7.5 and 9.5.
J ESSE E. STARECK.
REFERENCES CITED The following references are of record in the file of this patent:
UNITED STATES PATENTS Number Name Date 2,250,556 Stareck July 29, 1941 2,437,865 Stareck Mar. 16, 1948 OTHER REFERENCES Circular No. 52, Bureau of Standards, second edition, June 28, 1916, page 19.
Claims (1)
1. A METHOD OF DEPOSITING DENSE AND ADHERENT COPPER, CONSISTING IN PASSING ELECTRIC CURRENT FROM AN ANODE TO A CATHODE-OBJECT IMMERSED IN AN AQUEOUS BATH HAVING A PH BETWEEN 7.5 AND 9.5, AND A TEMPERATURE BETWEEN 70*F. AND 160*F., AND IN WHICH THE BATH CONSISTS ESSENTIALLY OF 7.5 TO 45 G./1. BIVALENT COPPER, 100 TO 250 G./. PYROPHOSPHATE (P2O7), 5 TO 20 G./1. NITRATE (NO3) AND 1 TO 3 G./1. AMMONIA (NH3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US640680A US2493092A (en) | 1946-01-11 | 1946-01-11 | Method of electrodepositing copper and baths therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US640680A US2493092A (en) | 1946-01-11 | 1946-01-11 | Method of electrodepositing copper and baths therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2493092A true US2493092A (en) | 1950-01-03 |
Family
ID=24569271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US640680A Expired - Lifetime US2493092A (en) | 1946-01-11 | 1946-01-11 | Method of electrodepositing copper and baths therefor |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2493092A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2871171A (en) * | 1956-05-10 | 1959-01-27 | Atkinson James Thomas Nesbitt | Method of electroplating copper on aluminum |
| US3157586A (en) * | 1961-07-14 | 1964-11-17 | Albright & Wilson Mfg Ltd | Copper pyrophosphate electroplating baths |
| US3161575A (en) * | 1960-07-23 | 1964-12-15 | Albright & Wilson Mfg Ltd | Copper pyrophosphate electroplating solutions |
| US3322656A (en) * | 1962-03-06 | 1967-05-30 | Pittsburgh Plate Glass Co | Metal surface of improved bonding quality |
| US3775268A (en) * | 1971-12-30 | 1973-11-27 | Us Navy | Use of lead in a nonorganic-containing copper pyrophosphate bath |
| JPS4843535B1 (en) * | 1969-01-09 | 1973-12-19 | ||
| US6656606B1 (en) | 2000-08-17 | 2003-12-02 | The Westaim Corporation | Electroplated aluminum parts and process of production |
| US20100326838A1 (en) * | 2008-06-02 | 2010-12-30 | Atotech Deutschland Gmbh | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2250556A (en) * | 1940-11-26 | 1941-07-29 | United Chromium Inc | Electrodeposition of copper and bath therefor |
| US2437865A (en) * | 1943-09-25 | 1948-03-16 | United Chromium Inc | Method of electrodepositing copper and baths and compositions therefor |
-
1946
- 1946-01-11 US US640680A patent/US2493092A/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2250556A (en) * | 1940-11-26 | 1941-07-29 | United Chromium Inc | Electrodeposition of copper and bath therefor |
| US2437865A (en) * | 1943-09-25 | 1948-03-16 | United Chromium Inc | Method of electrodepositing copper and baths and compositions therefor |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2871171A (en) * | 1956-05-10 | 1959-01-27 | Atkinson James Thomas Nesbitt | Method of electroplating copper on aluminum |
| US3161575A (en) * | 1960-07-23 | 1964-12-15 | Albright & Wilson Mfg Ltd | Copper pyrophosphate electroplating solutions |
| US3157586A (en) * | 1961-07-14 | 1964-11-17 | Albright & Wilson Mfg Ltd | Copper pyrophosphate electroplating baths |
| US3322656A (en) * | 1962-03-06 | 1967-05-30 | Pittsburgh Plate Glass Co | Metal surface of improved bonding quality |
| JPS4843535B1 (en) * | 1969-01-09 | 1973-12-19 | ||
| US3775268A (en) * | 1971-12-30 | 1973-11-27 | Us Navy | Use of lead in a nonorganic-containing copper pyrophosphate bath |
| US6656606B1 (en) | 2000-08-17 | 2003-12-02 | The Westaim Corporation | Electroplated aluminum parts and process of production |
| US6692630B2 (en) | 2000-08-17 | 2004-02-17 | The Westaim Corporation | Electroplated aluminum parts and process for production |
| US20100326838A1 (en) * | 2008-06-02 | 2010-12-30 | Atotech Deutschland Gmbh | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys |
| US9399824B2 (en) | 2008-06-02 | 2016-07-26 | Atotech Deutschland Gmbh | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys |
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