GB2391706B - Test system and method - Google Patents

Test system and method

Info

Publication number
GB2391706B
GB2391706B GB0311342A GB0311342A GB2391706B GB 2391706 B GB2391706 B GB 2391706B GB 0311342 A GB0311342 A GB 0311342A GB 0311342 A GB0311342 A GB 0311342A GB 2391706 B GB2391706 B GB 2391706B
Authority
GB
United Kingdom
Prior art keywords
test system
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0311342A
Other languages
English (en)
Other versions
GB2391706A (en
GB0311342D0 (en
Inventor
Erik H Volkerink
Ajay Khoche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of GB0311342D0 publication Critical patent/GB0311342D0/en
Publication of GB2391706A publication Critical patent/GB2391706A/en
Application granted granted Critical
Publication of GB2391706B publication Critical patent/GB2391706B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
GB0311342A 2002-05-24 2003-05-16 Test system and method Expired - Fee Related GB2391706B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/155,651 US7412639B2 (en) 2002-05-24 2002-05-24 System and method for testing circuitry on a wafer

Publications (3)

Publication Number Publication Date
GB0311342D0 GB0311342D0 (en) 2003-06-25
GB2391706A GB2391706A (en) 2004-02-11
GB2391706B true GB2391706B (en) 2005-12-28

Family

ID=22556237

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0311342A Expired - Fee Related GB2391706B (en) 2002-05-24 2003-05-16 Test system and method

Country Status (3)

Country Link
US (1) US7412639B2 (enExample)
JP (1) JP2003347373A (enExample)
GB (1) GB2391706B (enExample)

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US7417450B2 (en) * 2005-12-02 2008-08-26 Texas Instruments Incorporated Testing combinational logic die with bidirectional TDI-TMS/TDO chanel circuit
JP3446124B2 (ja) * 2001-12-04 2003-09-16 科学技術振興事業団 高速入出力装置を備えた半導体集積回路装置の試験方法及び試験装置
US6777971B2 (en) * 2002-03-20 2004-08-17 Lsi Logic Corporation High speed wafer sort and final test
US7131046B2 (en) * 2002-12-03 2006-10-31 Verigy Ipco System and method for testing circuitry using an externally generated signature
US7512851B2 (en) * 2003-08-01 2009-03-31 Syntest Technologies, Inc. Method and apparatus for shifting at-speed scan patterns in a scan-based integrated circuit
US7279919B2 (en) * 2005-01-14 2007-10-09 Verigy (Singapore) Pte. Ltd. Systems and methods of allocating device testing resources to sites of a probe card
JP2008102045A (ja) * 2006-10-20 2008-05-01 Matsushita Electric Ind Co Ltd 半導体集積回路および半導体集積回路の検査方法
US7882405B2 (en) * 2007-02-16 2011-02-01 Atmel Corporation Embedded architecture with serial interface for testing flash memories
US8000519B1 (en) * 2007-04-04 2011-08-16 Xilinx, Inc. Method of metal pattern inspection verification
KR100892262B1 (ko) * 2007-06-27 2009-04-09 세크론 주식회사 프로빙 검사장치 가동률 산출 시스템 및 이를 이용한 산출방법
WO2009147721A1 (ja) * 2008-06-02 2009-12-10 株式会社アドバンテスト 試験用ウエハユニット、および、試験システム
JP4335961B1 (ja) * 2008-09-01 2009-09-30 Ｎｅｃエレクトロニクス株式会社 テスト回路
KR101202020B1 (ko) * 2008-11-14 2012-11-16 한국전자통신연구원 웨이퍼 수준의 집적회로 칩 조정 시스템 및 집적회로 칩 조정 방법
US8059478B2 (en) * 2008-12-04 2011-11-15 Kovio, Inc. Low cost testing and sorting for integrated circuits
US9064716B2 (en) * 2009-09-30 2015-06-23 Virtium Technology, Inc. Stacking devices at finished package level
US9002673B2 (en) * 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
US8952712B2 (en) 2010-06-16 2015-02-10 Broadcom Corporation Tagging of functional blocks of a semiconductor component on a wafer
US20120159274A1 (en) * 2010-12-21 2012-06-21 Balakrishnan Kedarnath J Apparatus to facilitate built-in self-test data collection
US20140088911A1 (en) * 2011-05-29 2014-03-27 Cigol Digital Systems Ltd. VLSI Circuit Verification
US9304163B2 (en) 2013-11-07 2016-04-05 Qualcomm Incorporated Methodology for testing integrated circuits
US10451653B2 (en) * 2014-12-19 2019-10-22 Teradyne, Inc. Controlling a per-pin measurement unit
US9824774B2 (en) 2015-03-16 2017-11-21 Nxp Usa, Inc. Magnetic field programming of electronic devices on a wafer
US9607911B2 (en) 2015-03-16 2017-03-28 Nxp Usa, Inc. Optical programming of electronic devices on a wafer
EP3252487A1 (en) * 2016-06-01 2017-12-06 NXP USA, Inc. Wafer-level programming and testing of electronic devices
US10429441B2 (en) * 2017-05-24 2019-10-01 Qualcomm Incorporated Efficient test architecture for multi-die chips
GB2581861B (en) * 2018-09-14 2022-10-05 Sino Ic Tech Co Ltd IC Test Information Management System Based on Industrial Internet
TWI773301B (zh) * 2021-05-07 2022-08-01 華邦電子股份有限公司 半導體晶圓與多晶片的並行測試方法
CN119137730A (zh) * 2022-05-23 2024-12-13 美商艾德亚半导体接合科技有限公司 用于结合结构的测试元件
CN114880184B (zh) * 2022-05-23 2023-09-08 山东三未信安信息科技有限公司 一种批量检测pci密码卡的方法及系统
US12393544B2 (en) * 2023-04-18 2025-08-19 Qualcomm Incorporated Dynamic die-to-die serial lane configuration

Citations (2)

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JPH0613445A (ja) * 1992-06-25 1994-01-21 Sharp Corp 大規模集積回路のウェハテスト方法
JP2000100880A (ja) * 1998-09-22 2000-04-07 Sharp Corp 半導体集積回路のテスト装置

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JPH0621188A (ja) 1991-12-13 1994-01-28 Yamaha Corp 半導体ウェハ
US5457400A (en) 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
EP0578858A1 (en) * 1992-07-17 1994-01-19 International Business Machines Corporation AC interconnect test of integrated circuit chips
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5399505A (en) * 1993-07-23 1995-03-21 Motorola, Inc. Method and apparatus for performing wafer level testing of integrated circuit dice
JP3080847B2 (ja) * 1994-10-05 2000-08-28 日本電気株式会社 半導体記憶装置
JPH0955411A (ja) * 1995-08-17 1997-02-25 Fujitsu Ltd 半導体ウェハの試験方法および半導体ウェハ
US6000047A (en) 1995-12-08 1999-12-07 Hewlett-Packard Company Scanning memory device and error correction method
US5898186A (en) 1996-09-13 1999-04-27 Micron Technology, Inc. Reduced terminal testing system
US5701308A (en) * 1996-10-29 1997-12-23 Lockheed Martin Corporation Fast bist architecture with flexible standard interface
US6060891A (en) 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6285200B1 (en) 1998-03-02 2001-09-04 Agilent Technologies, Inc. Apparatus and method for testing integrated circuit devices
TW462103B (en) 1998-03-27 2001-11-01 Shiu Fu Jia Wafer testing device and method
DE19831563C2 (de) * 1998-07-14 2000-11-30 Siemens Ag Anordnungen zum Testen von Chips
JP2000036523A (ja) 1998-07-17 2000-02-02 Mitsubishi Electric Corp マルチテスト回路を備える半導体ウェハおよびマルチテスト工程を含む半導体装置の製造方法
US6321320B1 (en) 1998-10-30 2001-11-20 Hewlett-Packard Company Flexible and programmable BIST engine for on-chip memory array testing and characterization
US6499121B1 (en) * 1999-03-01 2002-12-24 Formfactor, Inc. Distributed interface for parallel testing of multiple devices using a single tester channel
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US6593762B1 (en) * 1999-11-01 2003-07-15 Agilent Technologies, Inc. Apparatus for testing electronic components
US7113902B2 (en) * 2000-03-02 2006-09-26 Texas Instruments Incorporated Data processing condition detector with table lookup
DE60001254T2 (de) * 2000-06-16 2003-07-10 Agilent Technologies, Inc. (N.D.Ges.D.Staates Delaware) Testgerät für integrierte Schaltungen mit Multiportprüffunktionalität
US6717429B2 (en) * 2000-06-30 2004-04-06 Texas Instruments Incorporated IC having comparator inputs connected to core circuitry and output pad
JP2002090414A (ja) * 2000-09-14 2002-03-27 Advantest Corp 半導体試験装置
US7054788B2 (en) * 2000-11-06 2006-05-30 Advantest Corporation Memory defect remedy analyzing method and memory test instrument
CA2329597A1 (en) * 2000-12-22 2002-06-22 Logicvision, Inc. Method for scan controlled sequential sampling of analog signals and circuit for use therewith
US6710616B1 (en) * 2001-07-30 2004-03-23 Lsi Logic Corporation Wafer level dynamic burn-in
US6788091B1 (en) * 2001-11-05 2004-09-07 Lsi Logic Corporation Method and apparatus for automatic marking of integrated circuits in wafer scale testing
US6816990B2 (en) * 2002-01-28 2004-11-09 International Business Machines Corporation VLSI chip test power reduction
US7089473B2 (en) * 2002-03-29 2006-08-08 Intel Corporation Method and apparatus for testing a circuit using a die frame logic analyzer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613445A (ja) * 1992-06-25 1994-01-21 Sharp Corp 大規模集積回路のウェハテスト方法
JP2000100880A (ja) * 1998-09-22 2000-04-07 Sharp Corp 半導体集積回路のテスト装置

Also Published As

Publication number Publication date
US7412639B2 (en) 2008-08-12
GB2391706A (en) 2004-02-11
GB0311342D0 (en) 2003-06-25
US20030221152A1 (en) 2003-11-27
JP2003347373A (ja) 2003-12-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080516