GB2383468A - Wafer holder protecting wafer against electrostatic breakdown - Google Patents

Wafer holder protecting wafer against electrostatic breakdown Download PDF

Info

Publication number
GB2383468A
GB2383468A GB0220191A GB0220191A GB2383468A GB 2383468 A GB2383468 A GB 2383468A GB 0220191 A GB0220191 A GB 0220191A GB 0220191 A GB0220191 A GB 0220191A GB 2383468 A GB2383468 A GB 2383468A
Authority
GB
United Kingdom
Prior art keywords
wafer
liquid
mounting plate
fluid
specific resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0220191A
Other languages
English (en)
Other versions
GB0220191D0 (en
Inventor
Masayoshi Kasahara
Masamichi Kudou
Yasunori Watanabe
Tomotake Morita
Yoshirou Ishiguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
NEC Corp
Original Assignee
NEC Electronics Corp
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp, NEC Corp filed Critical NEC Electronics Corp
Publication of GB0220191D0 publication Critical patent/GB0220191D0/en
Publication of GB2383468A publication Critical patent/GB2383468A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
  • Feeding Of Workpieces (AREA)
GB0220191A 2001-08-30 2002-08-30 Wafer holder protecting wafer against electrostatic breakdown Withdrawn GB2383468A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001262271A JP2003077993A (ja) 2001-08-30 2001-08-30 ウェーハ用ホルダ、及び、ウェーハの吸着解放方法

Publications (2)

Publication Number Publication Date
GB0220191D0 GB0220191D0 (en) 2002-10-09
GB2383468A true GB2383468A (en) 2003-06-25

Family

ID=19089190

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0220191A Withdrawn GB2383468A (en) 2001-08-30 2002-08-30 Wafer holder protecting wafer against electrostatic breakdown

Country Status (6)

Country Link
US (1) US20030045218A1 (ja)
JP (1) JP2003077993A (ja)
KR (1) KR20030019254A (ja)
CN (1) CN1404124A (ja)
GB (1) GB2383468A (ja)
TW (1) TW556305B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021094057A1 (en) * 2019-11-14 2021-05-20 Asml Netherlands B.V. Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147591A (ja) * 2006-12-13 2008-06-26 Nec Electronics Corp 半導体製造装置及び半導体製造方法
US20080268753A1 (en) * 2007-04-24 2008-10-30 Tetsuya Ishikawa Non-contact wet wafer holder
CN102486989B (zh) * 2010-12-01 2013-10-23 天威新能源控股有限公司 一种硅片脱胶清洗方法及其装载板
TWI546878B (zh) * 2012-12-28 2016-08-21 斯克林集團公司 基板處理裝置及基板處理方法
CN104409389B (zh) 2014-11-07 2017-10-27 合肥京东方光电科技有限公司 一种机台

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587831A (ja) * 1981-07-07 1983-01-17 Sumitomo Shoji Kk 高圧水によるウェハの洗浄方法及び装置
JPH06123924A (ja) * 1992-10-12 1994-05-06 Nikon Corp 基板ホルダ
US5775980A (en) * 1993-03-26 1998-07-07 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
JPH11289004A (ja) * 1998-04-03 1999-10-19 Nec Yamaguchi Ltd 被処理体の離脱方法および静電チャック装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3884435T2 (de) * 1987-03-25 1994-02-17 Hitachi Ltd Verfahren zur Erzeugung hochreinen Wassers und Verfahren zur Verwendung dieses Wassers.
JP2867051B2 (ja) * 1989-12-28 1999-03-08 住友シチックス株式会社 ウエーハの剥離方法
JP2506219B2 (ja) * 1990-06-19 1996-06-12 富士通株式会社 静電吸着方法
JPH04267541A (ja) * 1991-02-22 1992-09-24 Shibayama Kikai Kk チャック機構における半導体ウエハの取外し方法
JPH06177078A (ja) * 1992-12-08 1994-06-24 Tokyo Electron Ltd 静電チャック
JP3671379B2 (ja) * 1994-02-03 2005-07-13 アネルバ株式会社 静電吸着された被処理基板の離脱機構を持つプラズマ処理装置および静電吸着された被処理基板の離脱方法
US5979475A (en) * 1994-04-28 1999-11-09 Hitachi, Ltd. Specimen holding method and fluid treatment method of specimen surface and systems therefor
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6336845B1 (en) * 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587831A (ja) * 1981-07-07 1983-01-17 Sumitomo Shoji Kk 高圧水によるウェハの洗浄方法及び装置
JPH06123924A (ja) * 1992-10-12 1994-05-06 Nikon Corp 基板ホルダ
US5775980A (en) * 1993-03-26 1998-07-07 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
JPH11289004A (ja) * 1998-04-03 1999-10-19 Nec Yamaguchi Ltd 被処理体の離脱方法および静電チャック装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021094057A1 (en) * 2019-11-14 2021-05-20 Asml Netherlands B.V. Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate

Also Published As

Publication number Publication date
JP2003077993A (ja) 2003-03-14
CN1404124A (zh) 2003-03-19
US20030045218A1 (en) 2003-03-06
GB0220191D0 (en) 2002-10-09
TW556305B (en) 2003-10-01
KR20030019254A (ko) 2003-03-06

Similar Documents

Publication Publication Date Title
US7172674B2 (en) Device for liquid treatment of wafer-shaped articles
EP1612847B1 (en) Cleaning apparatus
WO2017154673A1 (ja) 基板洗浄装置、基板洗浄方法、基板処理装置および基板乾燥装置
KR102084844B1 (ko) 기판 처리 장치 및 기판 처리 방법
JPH10340884A (ja) ディスク状の物体の一方の面を処理する方法および装置
WO2013133401A1 (ja) 基板処理方法及び基板処理装置
CN108573897B (zh) 基板处理方法以及基板处理装置
KR20170073595A (ko) 기판액 처리 방법 및 기판액 처리 장치, 그리고 기판액 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체
JP2005051028A (ja) 基板支持装置および基板取り外し方法
GB2383468A (en) Wafer holder protecting wafer against electrostatic breakdown
JP2004031960A (ja) ポリッシング装置
JPS61283126A (ja) 処理ステ−シヨン内壁の洗浄方法と装置
JP2010093191A (ja) 基板処理装置
JP4702920B2 (ja) 基板処理方法および基板処理装置
US20210343576A1 (en) Substrate processing apparatus
JP5390824B2 (ja) 基板処理装置
US11154913B2 (en) Substrate treatment method and substrate treatment device
JPH09298181A (ja) 基板の裏面洗浄装置
US4791880A (en) Device for developing treatment of semiconductor materials
EP1107289A3 (en) Planarization apparatus
JP2018078208A (ja) チャックテーブル
JP2002184732A (ja) 受け渡し装置
TW201901744A (zh) 基板處理裝置及基板處理方法
US11955365B2 (en) Substrate processing method and substrate processing apparatus
KR100414022B1 (ko) 웨이퍼 세정장치의 매엽식 챔버

Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)