GB2239829B - Semiconductor device and method of producing the same - Google Patents
Semiconductor device and method of producing the sameInfo
- Publication number
- GB2239829B GB2239829B GB9010385A GB9010385A GB2239829B GB 2239829 B GB2239829 B GB 2239829B GB 9010385 A GB9010385 A GB 9010385A GB 9010385 A GB9010385 A GB 9010385A GB 2239829 B GB2239829 B GB 2239829B
- Authority
- GB
- United Kingdom
- Prior art keywords
- ball
- semiconductor chip
- less
- electrode pad
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0133—Ternary Alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/1576—Iron [Fe] as principal constituent
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/201—Temperature ranges
- H01L2924/20107—Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9323785A GB2271073B (en) | 1990-01-10 | 1993-11-18 | Method of producing a semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001467A JPH03208355A (ja) | 1990-01-10 | 1990-01-10 | 半導体装置及びその製造方法 |
SG155894A SG155894G (en) | 1990-01-10 | 1994-10-21 | Semiconductor device and method of producing the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9010385D0 GB9010385D0 (en) | 1990-06-27 |
GB2239829A GB2239829A (en) | 1991-07-17 |
GB2239829B true GB2239829B (en) | 1994-07-06 |
Family
ID=26334679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9010385A Expired - Fee Related GB2239829B (en) | 1990-01-10 | 1990-05-09 | Semiconductor device and method of producing the same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH03208355A (ko) |
KR (1) | KR940003563B1 (ko) |
DE (1) | DE4021031C2 (ko) |
GB (1) | GB2239829B (ko) |
SG (1) | SG155894G (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5455195A (en) * | 1994-05-06 | 1995-10-03 | Texas Instruments Incorporated | Method for obtaining metallurgical stability in integrated circuit conductive bonds |
US6376910B1 (en) * | 1999-06-23 | 2002-04-23 | International Rectifier Corporation | Solder-on back metal for semiconductor die |
JPWO2010147187A1 (ja) * | 2009-06-18 | 2012-12-06 | ローム株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1457806A (en) * | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
EP0078480A2 (en) * | 1981-10-28 | 1983-05-11 | Hitachi, Ltd. | Method for fusing and connecting solder of IC chip |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2428373C2 (de) * | 1974-06-12 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen von weichlötbaren Anschlußkontakten auf einer Halbleiteranordnung |
DE2628433B2 (de) * | 1976-06-24 | 1978-09-07 | Focke & Pfuhl, 3090 Verden | Packung mit Schieber und Hülse |
JPS5321771A (en) * | 1976-08-11 | 1978-02-28 | Sharp Kk | Electronic parts mounting structure |
JPS586143A (ja) * | 1981-07-02 | 1983-01-13 | Matsushita Electronics Corp | 半導体装置 |
CH662007A5 (en) * | 1983-12-21 | 1987-08-31 | Bbc Brown Boveri & Cie | Method of soldering semiconductor components |
DE3523808C3 (de) * | 1984-07-03 | 1995-05-04 | Hitachi Ltd | Verfahren zum Löten von Teilen einer elektronischen Anordnung aus unterschiedlichen Werkstoffen und dessen Verwendung |
DE3446780A1 (de) * | 1984-12-21 | 1986-07-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen |
GB2178683A (en) * | 1985-07-11 | 1987-02-18 | Nat Semiconductor Corp | Improved semiconductor die-attach method and product |
DE3641524A1 (de) * | 1985-12-10 | 1987-06-11 | Mitsubishi Electric Corp | Verfahren zur herstellung eines halbleiterbauelements |
DE3641689A1 (de) * | 1985-12-24 | 1987-06-25 | Mitsubishi Electric Corp | Verfahren zur herstellung eines halbleiterbauelements und eines darin verwendeten halbleiterchips |
JPS63148646A (ja) * | 1986-12-12 | 1988-06-21 | Toshiba Corp | 半導体装置 |
JPH0748507B2 (ja) * | 1987-08-18 | 1995-05-24 | 三菱電機株式会社 | ワイヤボンデイング方法 |
JPH01201934A (ja) * | 1988-02-08 | 1989-08-14 | Mitsubishi Electric Corp | ワイヤボンディング方法及びキャピラリチップ |
JPH0817189B2 (ja) * | 1989-01-13 | 1996-02-21 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
1990
- 1990-01-10 JP JP2001467A patent/JPH03208355A/ja active Pending
- 1990-05-09 GB GB9010385A patent/GB2239829B/en not_active Expired - Fee Related
- 1990-07-02 DE DE4021031A patent/DE4021031C2/de not_active Expired - Fee Related
- 1990-11-09 KR KR1019900018073A patent/KR940003563B1/ko not_active IP Right Cessation
-
1994
- 1994-10-21 SG SG155894A patent/SG155894G/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1457806A (en) * | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
EP0078480A2 (en) * | 1981-10-28 | 1983-05-11 | Hitachi, Ltd. | Method for fusing and connecting solder of IC chip |
Also Published As
Publication number | Publication date |
---|---|
DE4021031C2 (de) | 1995-04-20 |
GB9010385D0 (en) | 1990-06-27 |
SG155894G (en) | 1995-03-17 |
GB2239829A (en) | 1991-07-17 |
JPH03208355A (ja) | 1991-09-11 |
KR940003563B1 (ko) | 1994-04-23 |
KR910015024A (ko) | 1991-08-31 |
DE4021031A1 (de) | 1991-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 19950519 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20080509 |