GB1414013A - Testing of electrical interconnection networks on substrates - Google Patents
Testing of electrical interconnection networks on substratesInfo
- Publication number
- GB1414013A GB1414013A GB1971973A GB1971973A GB1414013A GB 1414013 A GB1414013 A GB 1414013A GB 1971973 A GB1971973 A GB 1971973A GB 1971973 A GB1971973 A GB 1971973A GB 1414013 A GB1414013 A GB 1414013A
- Authority
- GB
- United Kingdom
- Prior art keywords
- chip
- test
- inter
- connectors
- sites
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 abstract 10
- 238000005259 measurement Methods 0.000 abstract 2
- 239000000523 sample Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010998 test method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25053772A | 1972-05-05 | 1972-05-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1414013A true GB1414013A (en) | 1975-11-12 |
Family
ID=22948165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1971973A Expired GB1414013A (en) | 1972-05-05 | 1973-04-25 | Testing of electrical interconnection networks on substrates |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3746973A (en:Method) |
| JP (1) | JPS5753661B2 (en:Method) |
| DE (1) | DE2319011C2 (en:Method) |
| FR (1) | FR2183691B1 (en:Method) |
| GB (1) | GB1414013A (en:Method) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3882532A (en) * | 1972-07-03 | 1975-05-06 | Ibm | Externally accessing mechanically difficult to access circuit nodes in integrated circuits |
| US3984860A (en) * | 1973-06-04 | 1976-10-05 | International Business Machines Corporation | Multi-function LSI wafers |
| US3867693A (en) * | 1974-02-20 | 1975-02-18 | Ibm | LSI chip test probe contact integrity checking circuit |
| US3982180A (en) * | 1974-12-20 | 1976-09-21 | Bell Telephone Laboratories, Incorporated | Apparatus for testing multiconductor cables for continuity, correct connections, and the absence of short circuits between conductors |
| US3999126A (en) * | 1975-04-17 | 1976-12-21 | A & P Products Incorporated | Test device for simultaneously displaying the level of logic signals in a plurality of circuits |
| SE433782B (sv) * | 1977-10-31 | 1984-06-12 | Western Electric Co | Forfarande och anordning for testning av elektriska ledarelement |
| US4202007A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers |
| US4220917A (en) * | 1978-07-31 | 1980-09-02 | International Business Machines Corporation | Test circuitry for module interconnection network |
| US4241307A (en) * | 1978-08-18 | 1980-12-23 | International Business Machines Corporation | Module interconnection testing scheme |
| US4379259A (en) * | 1980-03-12 | 1983-04-05 | National Semiconductor Corporation | Process of performing burn-in and parallel functional testing of integrated circuit memories in an environmental chamber |
| US4295359A (en) * | 1980-03-17 | 1981-10-20 | Honeywell Information Systems Inc. | Calibration apparatus for CML circuit test unit |
| DE3029883A1 (de) * | 1980-08-07 | 1982-03-11 | Ibm Deutschland Gmbh, 7000 Stuttgart | Schieberegister fuer pruef- und test-zwecke |
| DE3030299A1 (de) | 1980-08-09 | 1982-04-08 | Ibm Deutschland Gmbh, 7000 Stuttgart | Schieberegister fuer pruef- und test-zwecke |
| JPS615804Y2 (en:Method) * | 1980-09-30 | 1986-02-21 | ||
| JPS57153464A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Injection type semiconductor integrated logic circuit |
| US4395767A (en) * | 1981-04-20 | 1983-07-26 | Control Data Corporation | Interconnect fault detector for LSI logic chips |
| US4426773A (en) | 1981-05-15 | 1984-01-24 | General Electric Ceramics, Inc. | Array of electronic packaging substrates |
| US4441075A (en) * | 1981-07-02 | 1984-04-03 | International Business Machines Corporation | Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packaging structure having a plurality of interconnected chips, without any physical disconnection |
| US4503386A (en) * | 1982-04-20 | 1985-03-05 | International Business Machines Corporation | Chip partitioning aid (CPA)-A structure for test pattern generation for large logic networks |
| DE3235119A1 (de) * | 1982-09-22 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Anordnung fuer die pruefung von mikroverdrahtungen und verfahren zu ihrem betrieb |
| US4674007A (en) * | 1985-06-07 | 1987-06-16 | Microscience Corporation | Method and apparatus for facilitating production of electronic circuit boards |
| US4937203A (en) * | 1986-09-26 | 1990-06-26 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
| US4884122A (en) * | 1988-08-05 | 1989-11-28 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
| US4812742A (en) * | 1987-12-03 | 1989-03-14 | Unisys Corporation | Integrated circuit package having a removable test region for testing for shorts and opens |
| GB2249639A (en) * | 1990-09-06 | 1992-05-13 | Digital Equipment Int | Testing printed circuit boards |
| US5477160A (en) * | 1992-08-12 | 1995-12-19 | Fujitsu Limited | Module test card |
| US5363038A (en) * | 1992-08-12 | 1994-11-08 | Fujitsu Limited | Method and apparatus for testing an unpopulated chip carrier using a module test card |
| JPH0669306A (ja) * | 1992-08-18 | 1994-03-11 | Sumitomo Kinzoku Ceramics:Kk | シート状セラミックパッケージ |
| US5357192A (en) * | 1993-02-01 | 1994-10-18 | Motorola, Inc. | Method of contacting a semiconductor die with probes |
| US5751015A (en) * | 1995-11-17 | 1998-05-12 | Micron Technology, Inc. | Semiconductor reliability test chip |
| US6087841A (en) * | 1997-10-01 | 2000-07-11 | International Business Machines Corporation | Contact test circuit |
| US8093921B2 (en) * | 2009-02-13 | 2012-01-10 | Cisco Technology, Inc. | Monitoring of interconnect reliability using a programmable device |
| EP2790027B1 (en) | 2013-04-08 | 2017-10-18 | Imec | Two-step interconnect testing of semiconductor dies |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1977703A (en) * | 1932-01-07 | 1934-10-23 | Western Electric Co | Method of and apparatus for electrical testing |
| US3217244A (en) * | 1961-12-27 | 1965-11-09 | George G Glover | Multiple conductor cable tester having rotatable annular switch means for testing insulation resistance, cross wiring and continuity |
| US3405361A (en) * | 1964-01-08 | 1968-10-08 | Signetics Corp | Fluid actuable multi-point microprobe for semiconductors |
| US3192307A (en) * | 1964-05-29 | 1965-06-29 | Burndy Corp | Connector for component and printed circuit board |
| US3560907A (en) * | 1968-05-17 | 1971-02-02 | Peter V N Heller | Test connector for microminiature circuits |
| US3609538A (en) * | 1969-04-04 | 1971-09-28 | Thomas & Betts Corp | Device to identify individual wires in a random bundle |
-
1972
- 1972-05-05 US US00250537A patent/US3746973A/en not_active Expired - Lifetime
-
1973
- 1973-03-21 FR FR7311018A patent/FR2183691B1/fr not_active Expired
- 1973-04-13 JP JP48041517A patent/JPS5753661B2/ja not_active Expired
- 1973-04-14 DE DE2319011A patent/DE2319011C2/de not_active Expired
- 1973-04-25 GB GB1971973A patent/GB1414013A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2183691B1 (en:Method) | 1978-05-26 |
| FR2183691A1 (en:Method) | 1973-12-21 |
| JPS5753661B2 (en:Method) | 1982-11-13 |
| JPS4924076A (en:Method) | 1974-03-04 |
| DE2319011A1 (de) | 1973-11-15 |
| US3746973A (en) | 1973-07-17 |
| DE2319011C2 (de) | 1983-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1414013A (en) | Testing of electrical interconnection networks on substrates | |
| US4220917A (en) | Test circuitry for module interconnection network | |
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| GB1514060A (en) | Contact structure for an electronic test system | |
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| US3801910A (en) | Externally accessing mechanical difficult to access circuit nodes using photo-responsive conductors in integrated circuits | |
| US6489791B1 (en) | Build off self-test (Bost) testing method | |
| JP2737774B2 (ja) | ウェハテスタ | |
| JP2657315B2 (ja) | プローブカード | |
| JPS62269075A (ja) | プリント基板検査装置 | |
| JPS59208469A (ja) | プロ−ブカ−ド | |
| GB1305010A (en:Method) | ||
| JP2919087B2 (ja) | 半導体試験装置 | |
| JPS626653B2 (en:Method) | ||
| JPH04109645A (ja) | 半導体プロービング試験装置 | |
| KR100231481B1 (ko) | 프로브패드 | |
| JPS63177437A (ja) | 半導体集積回路装置の試験方法 | |
| JP2001358185A (ja) | テストシステム | |
| JPH05315411A (ja) | テストヘッド | |
| SU538346A1 (ru) | Устройство контрол контактировани | |
| JPH04320044A (ja) | 半導体装置,その製造方法,その試験方法及びその試験装置 | |
| JPS6137776B2 (en:Method) | ||
| JPH05160216A (ja) | 半導体回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |