GB1261057A - Improvements in or relating to electrolytically reinforced metallic micro-structures - Google Patents

Improvements in or relating to electrolytically reinforced metallic micro-structures

Info

Publication number
GB1261057A
GB1261057A GB42854/69A GB4285469A GB1261057A GB 1261057 A GB1261057 A GB 1261057A GB 42854/69 A GB42854/69 A GB 42854/69A GB 4285469 A GB4285469 A GB 4285469A GB 1261057 A GB1261057 A GB 1261057A
Authority
GB
United Kingdom
Prior art keywords
layer
photovarnish
exposed
area
electrolytically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42854/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1261057A publication Critical patent/GB1261057A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB42854/69A 1968-08-29 1969-08-28 Improvements in or relating to electrolytically reinforced metallic micro-structures Expired GB1261057A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681790025 DE1790025B1 (de) 1968-08-29 1968-08-29 Verfahren zur herstellung galvanisch verstaerkter m etallischer mikrostrukturen

Publications (1)

Publication Number Publication Date
GB1261057A true GB1261057A (en) 1972-01-19

Family

ID=5706846

Family Applications (1)

Application Number Title Priority Date Filing Date
GB42854/69A Expired GB1261057A (en) 1968-08-29 1969-08-28 Improvements in or relating to electrolytically reinforced metallic micro-structures

Country Status (6)

Country Link
CH (1) CH519592A (de)
DE (1) DE1790025B1 (de)
FR (1) FR2016573A1 (de)
GB (1) GB1261057A (de)
NL (1) NL6912860A (de)
SE (1) SE352223B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111206245A (zh) * 2020-02-17 2020-05-29 江苏友润微电子有限公司 一种柔性湿度传感器用镍铬-铝电极图形制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2822011B2 (de) * 1978-05-19 1980-06-04 Fujitsu Ltd., Kawasaki, Kanagawa (Japan) Halbleiteranordnung und Verfahren zu deren Herstellung
AT398675B (de) * 1989-08-29 1995-01-25 Austria Tech & System Tech Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111206245A (zh) * 2020-02-17 2020-05-29 江苏友润微电子有限公司 一种柔性湿度传感器用镍铬-铝电极图形制备方法

Also Published As

Publication number Publication date
DE1790025B1 (de) 1972-05-04
NL6912860A (de) 1970-03-03
FR2016573A1 (de) 1970-05-08
CH519592A (de) 1972-02-29
SE352223B (de) 1972-12-18

Similar Documents

Publication Publication Date Title
US5268068A (en) High aspect ratio molybdenum composite mask method
GB1527108A (en) Methods of forming conductors on substrates involving electroplating
US3386894A (en) Formation of metallic contacts
US4640739A (en) Process of producing galvanic layers of solder of precise contour on inorganic substrates
GB1248142A (en) Improvements in or relating to electrical circuits assemblies
GB1308477A (en) Thin film circuits
GB1268317A (en) Improvements in or relating to the manufacture of conductor plates
US3560358A (en) Electrolytic etching of platinum for metallization
GB1261057A (en) Improvements in or relating to electrolytically reinforced metallic micro-structures
GB1130341A (en) Thin-film electrical components
US4495026A (en) Method for manufacturing metallized semiconductor components
JPH0279494A (ja) プリント回路基板およびその製造方法
US3398032A (en) Method of making cermet resistors by etching
US3607476A (en) Method of manufacturing thin film circuits
US3634202A (en) Process for the production of thick film conductors and circuits incorporating such conductors
JPS6459936A (en) Manufacture of integrated circuit
GB1287791A (en) A microcircuit and manufacture of same
JPS5855686B2 (ja) 表面弾性波装置の製造方法
IE812691L (en) Fabricating a metallic pattern on a substrate.
GB1512029A (en) Formation of thin layer patterns on a substrate
SU360009A1 (ru) Способ получени рельефных изображений
JPS6156879B2 (de)
GB1002358A (en) Improvements in and relating to the manufacture of electrical components by coating of metal on to an insulating substrate
US3502555A (en) Selective etching of chromium-silica laminates
JPH05347468A (ja) プリント配線板の製造方法