IE812691L - Fabricating a metallic pattern on a substrate. - Google Patents

Fabricating a metallic pattern on a substrate.

Info

Publication number
IE812691L
IE812691L IE269181A IE269181A IE812691L IE 812691 L IE812691 L IE 812691L IE 269181 A IE269181 A IE 269181A IE 269181 A IE269181 A IE 269181A IE 812691 L IE812691 L IE 812691L
Authority
IE
Ireland
Prior art keywords
photoresist
substrate
adhesive
fabricating
layer
Prior art date
Application number
IE269181A
Other versions
IE51854B1 (en
Original Assignee
Memorex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memorex Corp filed Critical Memorex Corp
Publication of IE812691L publication Critical patent/IE812691L/en
Publication of IE51854B1 publication Critical patent/IE51854B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Magnetic Heads (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A method for fabricating a metallic pattern (6) eg of Ni-Fe alloy on a substrate (1) eg of SiO2 or glass consists of depositing an adhesive metal layer (2) and/or, plateable metal layer (3) which become(s) cathodic during etching, on a substrate. A narrow self-supporting border of photoresist (15, 16) is then applied. An anodic layer (4, 5 and 6) is then deposited and the photoresist removed. The adhesive and plateable metal material is etched in those areas (11, 12) previously covered by the photoresist and fresh photoresist (8) applied to encapsulate those areas (6) of the anodic layer which form the final pattern of interest. The unwanted anodic material (4 and 5) is then etched and the photoresist removed. The adhesive metal (2) may be Cr, Ti, Ta, W, Nb, V or Zr; and the plateable metal (3) may be Au, Pt, Pd, Cu, Ni or Ni-Fe. The invention overcomes the problem of severe undercutting of the cathodic layers (2 and 3). <IMAGE> [GB2088412A]
IE269181A 1980-12-03 1981-11-17 Method of fabricating a metallic pattern on a substrate IE51854B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21235980A 1980-12-03 1980-12-03

Publications (2)

Publication Number Publication Date
IE812691L true IE812691L (en) 1982-06-03
IE51854B1 IE51854B1 (en) 1987-04-15

Family

ID=22790676

Family Applications (1)

Application Number Title Priority Date Filing Date
IE269181A IE51854B1 (en) 1980-12-03 1981-11-17 Method of fabricating a metallic pattern on a substrate

Country Status (5)

Country Link
JP (1) JPS57120675A (en)
DE (1) DE3147401A1 (en)
FR (1) FR2495192B1 (en)
GB (1) GB2088412B (en)
IE (1) IE51854B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707586A (en) * 1981-05-11 1987-11-17 Sierracin Corporation Electro conductive film system for aircraft windows
US4424271A (en) * 1982-09-15 1984-01-03 Magnetic Peripherals Inc. Deposition process
US4874930A (en) * 1983-09-07 1989-10-17 Sierracin Corporation Electroconductive film system for aircraft windows
JPS621552A (en) * 1985-06-28 1987-01-07 Toshiba Corp Preparation of recording head

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2209216B1 (en) * 1972-11-30 1977-09-30 Ibm
US3853715A (en) * 1973-12-20 1974-12-10 Ibm Elimination of undercut in an anodically active metal during chemical etching
DE2512115C3 (en) * 1975-03-19 1979-06-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the production of microscopic metal and metal alloy structures for a cylindrical domain memory

Also Published As

Publication number Publication date
JPS57120675A (en) 1982-07-27
DE3147401C2 (en) 1990-09-06
FR2495192A1 (en) 1982-06-04
FR2495192B1 (en) 1985-11-08
DE3147401A1 (en) 1982-07-08
JPH037756B2 (en) 1991-02-04
GB2088412A (en) 1982-06-09
GB2088412B (en) 1983-09-21
IE51854B1 (en) 1987-04-15

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Legal Events

Date Code Title Description
MM4A Patent lapsed