CN111206245A - 一种柔性湿度传感器用镍铬-铝电极图形制备方法 - Google Patents
一种柔性湿度传感器用镍铬-铝电极图形制备方法 Download PDFInfo
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- -1 nickel-chromium-aluminum Chemical compound 0.000 title claims abstract description 10
- 238000002360 preparation method Methods 0.000 title description 2
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910018487 Ni—Cr Inorganic materials 0.000 claims abstract description 21
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 20
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 8
- 238000001259 photo etching Methods 0.000 claims abstract description 8
- 238000004528 spin coating Methods 0.000 claims abstract description 6
- 230000000295 complement effect Effects 0.000 claims abstract description 4
- 239000008367 deionised water Substances 0.000 claims abstract description 4
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 4
- 238000005137 deposition process Methods 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000010703 silicon Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims abstract description 3
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 238000001035 drying Methods 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
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- General Chemical & Material Sciences (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
本发明公开了一种柔性湿度传感器用镍铬‑铝电极图形制备方法,包括以下步骤:将硅或玻璃衬底彻底清洗干燥;在衬底上沉积一薄层铝;旋涂正性光刻胶并低温烘烤几分钟;光刻胶采用互补的负光刻版曝光以形成引出端和电极图形;显影,然后用磷酸腐蚀暴露出的铝;在丙酮中去除光刻胶,此时衬底上除了电极和引出端图形区外,其他区域都覆盖了铝薄膜;衬底彻底清洗干燥后连续沉积一层镍铬薄膜和铝薄膜,沉积过程中衬底不加温;旋涂正性光刻胶并低温烘烤几分钟;采用正性光刻版图曝光形成引出端图形并显影;用磷酸刻蚀暴露的铝薄膜;衬底在去离子水中彻底清洗后,用丙酮去掉光刻胶,形成镍铬电极图形,本发明工艺简单、成本低。
Description
技术领域
本发明涉及一种传感器,特别涉及一种传感器用镍铬-铝电极图形。
背景技术
由于器件结构的需要,柔性湿度传感器经常需要用到铝和镍铬两种电极材料:铝电极通常用与信号处理电路相连而镍铬用做敏感材料电极,两种电极还需互联。来目前通用的在金、铜、铝等导电材料上的镍铬薄膜电极图形化的方法一般都是采用两种刻蚀液——一种用来刻蚀镍铬、一种用来刻蚀下层金属(金、铜、铝等)。但是该方法的缺点在于需要使用两种刻蚀液,成本相对较高;此外,对于镍铬-铝构成的电极图形,镍铬刻蚀液需要加热到特定温度才能起到有效的刻蚀效果,如果不小心超过了该温度,这种刻蚀液也会对铝产生刻蚀。
发明内容
本发明的目的是提供一种柔性湿度传感器用镍铬-铝电极图形制备方法,其工艺简单,成本低廉。
本发明的目的是这样实现的:一种柔性湿度传感器用镍铬-铝电极图形制备方法,包括以下步骤:
1)将硅或玻璃衬底彻底清洗干燥;
2)在衬底上沉积一薄层铝;
3)旋涂正性光刻胶并低温烘烤几分钟;
4)光刻胶采用互补的负光刻版曝光以形成引出端和电极图形;
5)显影,然后用磷酸腐蚀暴露出的铝;
6)在丙酮中去除光刻胶,此时衬底上除了电极和引出端图形区外,其他区域都覆盖了铝薄膜;
7)衬底彻底清洗干燥后连续沉积一层镍铬薄膜和铝薄膜,沉积过程中衬底不加温;
8)旋涂正性光刻胶并低温烘烤几分钟;
9)采用正性光刻版图曝光形成引出端图形并显影;
10)用磷酸刻蚀暴露的铝薄膜;
11)衬底在去离子水中彻底清洗后,用丙酮去掉光刻胶,形成镍铬电极图形。
作为本发明的进一步限定,步骤7)中的镍铬薄膜的方阻为200~500Ω/□。
作为本发明的进一步限定,步骤7)中的铝薄膜的厚度为500±20nm。
与现有技术相比,本发明的有益效果在于:
1. 工艺简单、成本低,只用到一种刻蚀液,即引出端所用金属材料刻蚀液(如铝);
2. 本发明适用于任何包含电极和导电两种薄膜的结构,只要引出端刻蚀液不会刻蚀电极材料;
3. 本发明重复性好,效率高。
附图说明
图1为本发明中衬底层示意图。
图2为本发明中步骤6后的示意图。
图3为本发明中步骤9后的示意图。
图4为本发明最终获得的镍铬电极图形示意图。
具体实施方式
如图1-4所示的一种柔性湿度传感器镍铬-铝电极图形制备的方法。该方法的特点是只需用到铝刻蚀液,且适合于任意一种含铝的电极材料;具体步骤如下:
(1)将硅或玻璃衬底彻底清洗干燥,如图1所示。
(2)沉积一薄层铝,该层铝起到牺牲层的作用。
(3)旋涂正性光刻胶并低温烘烤几分钟。
(4)采用与引出端和电极图形互补的负光刻版曝光光刻胶。
(5)显影,然后用磷酸腐蚀暴露出的铝。
(6)在丙酮中去除光刻胶;此时衬底上除了电极和引出端图形区外,其他区域都覆盖了铝薄膜,如图2所示。
(7)衬底彻底清洗干燥后连续沉积一层方阻为200~500Ω/□的镍铬薄膜和500nm左右的铝薄膜;沉积过程中衬底不加温。
(8)旋涂正性光刻胶并低温烘烤几分钟。
(9)采用正性光刻版图曝光形成引出端图形并显影,此时衬底图形如图3示意。
(10)用磷酸刻蚀暴露的铝薄膜;在这个过程中,底层的铝膜也因为刻蚀液渗透过镍铬薄膜的针孔而被刻蚀掉;事实上,方阻为200~500Ω/□的镍铬薄膜结构上是不连续的,这有助于刻蚀其下方的铝。
(11)衬底在去离子水中彻底清洗后,用丙酮去掉光刻胶。
至此,镍铬电极图形最终形成,而上层500nm铝薄膜和其下方的镍铬薄膜为引出端图形,如图4所示。
本发明并不局限于上述实施例,在本发明公开的技术方案的基础上,本领域的技术人员根据所公开的技术内容,不需要创造性的劳动就可以对其中的一些技术特征作出一些替换和变形,这些替换和变形均在本发明的保护范围内。
Claims (3)
1.一种柔性湿度传感器用镍铬-铝电极图形制备方法,其特征在于,包括以下步骤:
1)将硅或玻璃衬底彻底清洗干燥;
2)在衬底上沉积一薄层铝;
3)旋涂正性光刻胶并低温烘烤几分钟;
4)光刻胶采用互补的负光刻版曝光以形成引出端和电极图形;
5)显影,然后用磷酸腐蚀暴露出的铝;
6)在丙酮中去除光刻胶,此时衬底上除了电极和引出端图形区外,其他区域都覆盖了铝薄膜;
7)衬底彻底清洗干燥后连续沉积一层镍铬薄膜和铝薄膜,沉积过程中衬底不加温;
8)旋涂正性光刻胶并低温烘烤几分钟;
9)采用正性光刻版图曝光形成引出端图形并显影;
10)用磷酸刻蚀暴露的铝薄膜;
11)衬底在去离子水中彻底清洗后,用丙酮去掉光刻胶,形成镍铬电极图形。
2.根据权利要求1所述的一种柔性湿度传感器用镍铬-铝电极图形制备方法,其特征在于,步骤7)中的镍铬薄膜的方阻为200~500Ω/□。
3.根据权利要求1所述的一种柔性湿度传感器用镍铬-铝电极图形制备方法,其特征在于,步骤7)中的铝薄膜的厚度为500±20nm。
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CN114242835A (zh) * | 2021-12-08 | 2022-03-25 | 西南技术物理研究所 | 一种用于硅基光敏芯片减薄的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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GB1261057A (en) * | 1968-08-29 | 1972-01-19 | Siemens Ag | Improvements in or relating to electrolytically reinforced metallic micro-structures |
CN101718950A (zh) * | 2008-10-09 | 2010-06-02 | 北京京东方光电科技有限公司 | 薄膜构图方法及制造液晶显示装置的方法 |
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GB1261057A (en) * | 1968-08-29 | 1972-01-19 | Siemens Ag | Improvements in or relating to electrolytically reinforced metallic micro-structures |
CN101718950A (zh) * | 2008-10-09 | 2010-06-02 | 北京京东方光电科技有限公司 | 薄膜构图方法及制造液晶显示装置的方法 |
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CN114242835A (zh) * | 2021-12-08 | 2022-03-25 | 西南技术物理研究所 | 一种用于硅基光敏芯片减薄的方法 |
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