CH519592A - Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen - Google Patents
Verfahren zur Herstellung galvanisch verstärkter metallischer MikrostrukturenInfo
- Publication number
- CH519592A CH519592A CH1062269A CH1062269A CH519592A CH 519592 A CH519592 A CH 519592A CH 1062269 A CH1062269 A CH 1062269A CH 1062269 A CH1062269 A CH 1062269A CH 519592 A CH519592 A CH 519592A
- Authority
- CH
- Switzerland
- Prior art keywords
- production
- reinforced metallic
- galvanically reinforced
- metallic microstructures
- microstructures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0542—Continuous temporary metal layer over metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681790025 DE1790025B1 (de) | 1968-08-29 | 1968-08-29 | Verfahren zur herstellung galvanisch verstaerkter m etallischer mikrostrukturen |
Publications (1)
Publication Number | Publication Date |
---|---|
CH519592A true CH519592A (de) | 1972-02-29 |
Family
ID=5706846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1062269A CH519592A (de) | 1968-08-29 | 1969-07-11 | Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen |
Country Status (6)
Country | Link |
---|---|
CH (1) | CH519592A (de) |
DE (1) | DE1790025B1 (de) |
FR (1) | FR2016573A1 (de) |
GB (1) | GB1261057A (de) |
NL (1) | NL6912860A (de) |
SE (1) | SE352223B (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2822011B2 (de) * | 1978-05-19 | 1980-06-04 | Fujitsu Ltd., Kawasaki, Kanagawa (Japan) | Halbleiteranordnung und Verfahren zu deren Herstellung |
AT398675B (de) * | 1989-08-29 | 1995-01-25 | Austria Tech & System Tech | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
CN111206245A (zh) * | 2020-02-17 | 2020-05-29 | 江苏友润微电子有限公司 | 一种柔性湿度传感器用镍铬-铝电极图形制备方法 |
-
1968
- 1968-08-29 DE DE19681790025 patent/DE1790025B1/de not_active Withdrawn
-
1969
- 1969-07-11 CH CH1062269A patent/CH519592A/de not_active IP Right Cessation
- 1969-08-22 SE SE11688/69*A patent/SE352223B/xx unknown
- 1969-08-22 NL NL6912860A patent/NL6912860A/xx unknown
- 1969-08-26 FR FR6929153A patent/FR2016573A1/fr not_active Withdrawn
- 1969-08-28 GB GB42854/69A patent/GB1261057A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1261057A (en) | 1972-01-19 |
DE1790025B1 (de) | 1972-05-04 |
SE352223B (de) | 1972-12-18 |
FR2016573A1 (de) | 1970-05-08 |
NL6912860A (de) | 1970-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |