GB1034484A - Improvements in or relating to the electrodeposition of copper - Google Patents
Improvements in or relating to the electrodeposition of copperInfo
- Publication number
- GB1034484A GB1034484A GB14632/63A GB1463263A GB1034484A GB 1034484 A GB1034484 A GB 1034484A GB 14632/63 A GB14632/63 A GB 14632/63A GB 1463263 A GB1463263 A GB 1463263A GB 1034484 A GB1034484 A GB 1034484A
- Authority
- GB
- United Kingdom
- Prior art keywords
- compounds
- group
- copper
- compound
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 238000004070 electrodeposition Methods 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 5
- 238000007747 plating Methods 0.000 abstract 3
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 abstract 2
- 150000002170 ethers Chemical class 0.000 abstract 2
- 229920000570 polyether Polymers 0.000 abstract 2
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 abstract 1
- SSZWWUDQMAHNAQ-UHFFFAOYSA-N 3-chloropropane-1,2-diol Chemical compound OCC(O)CCl SSZWWUDQMAHNAQ-UHFFFAOYSA-N 0.000 abstract 1
- XKTYXVDYIKIYJP-UHFFFAOYSA-N 3h-dioxole Chemical compound C1OOC=C1 XKTYXVDYIKIYJP-UHFFFAOYSA-N 0.000 abstract 1
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical class C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 abstract 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 abstract 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 abstract 1
- 229910006069 SO3H Inorganic materials 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 150000001298 alcohols Chemical class 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001408 amides Chemical class 0.000 abstract 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 abstract 1
- 239000000975 dye Substances 0.000 abstract 1
- 125000001033 ether group Chemical group 0.000 abstract 1
- -1 fluoborate Chemical compound 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 150000003568 thioethers Chemical group 0.000 abstract 1
- 150000003573 thiols Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US187926A US3267010A (en) | 1962-04-16 | 1962-04-16 | Electrodeposition of copper from acidic baths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1034484A true GB1034484A (en) | 1966-06-29 |
Family
ID=22691053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB14632/63A Expired GB1034484A (en) | 1962-04-16 | 1963-04-11 | Improvements in or relating to the electrodeposition of copper |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3267010A (enrdf_load_stackoverflow) |
| DE (1) | DE1521062B2 (enrdf_load_stackoverflow) |
| FR (1) | FR1361558A (enrdf_load_stackoverflow) |
| GB (1) | GB1034484A (enrdf_load_stackoverflow) |
| NL (1) | NL291575A (enrdf_load_stackoverflow) |
| SE (1) | SE301576B (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
| EP1897973A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone, Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| EP1897975A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone, Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| US8366901B2 (en) | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3373095A (en) * | 1967-06-05 | 1968-03-12 | Dayton Bright Copper Company | Electroplating of copper |
| US3542655A (en) * | 1968-04-29 | 1970-11-24 | M & T Chemicals Inc | Electrodeposition of copper |
| DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
| US3715289A (en) * | 1971-02-08 | 1973-02-06 | Stauffer Chemical Co | Brightener composition for acid copper electroplating baths |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| US3956120A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3966565A (en) * | 1972-12-14 | 1976-06-29 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956084A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3940320A (en) * | 1972-12-14 | 1976-02-24 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4014760A (en) * | 1974-11-21 | 1977-03-29 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036710A (en) * | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4272335A (en) * | 1980-02-19 | 1981-06-09 | Oxy Metal Industries Corporation | Composition and method for electrodeposition of copper |
| US4316778A (en) * | 1980-09-24 | 1982-02-23 | Rca Corporation | Method for the manufacture of recording substrates for capacitance electronic discs |
| US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
| US4551212A (en) * | 1985-03-11 | 1985-11-05 | Rca Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
| US4673467A (en) * | 1986-09-02 | 1987-06-16 | Cbs Inc. | Method of manufacturing fine-grained copper substrate for optical information carrier |
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| DE4126502C1 (enrdf_load_stackoverflow) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
| US5980706A (en) * | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
| US6358388B1 (en) | 1996-07-15 | 2002-03-19 | Semitool, Inc. | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
| US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US6936153B1 (en) | 1997-09-30 | 2005-08-30 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face |
| US6454926B1 (en) * | 1997-09-30 | 2002-09-24 | Semitool Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| TWI223678B (en) | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US7247229B2 (en) * | 1999-06-28 | 2007-07-24 | Eltech Systems Corporation | Coatings for the inhibition of undesirable oxidation in an electrochemical cell |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| US6391209B1 (en) | 1999-08-04 | 2002-05-21 | Mykrolis Corporation | Regeneration of plating baths |
| US6596148B1 (en) | 1999-08-04 | 2003-07-22 | Mykrolis Corporation | Regeneration of plating baths and system therefore |
| US6942779B2 (en) * | 2000-05-25 | 2005-09-13 | Mykrolis Corporation | Method and system for regenerating of plating baths |
| EP1433544B1 (en) * | 2000-08-18 | 2008-02-13 | TI Group Automotive Systems Limited | Method for plating a metal strip for use when manufacturing a multiple walled tube |
| US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP3964263B2 (ja) * | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
| US7025866B2 (en) * | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
| DE10261852B3 (de) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| US20040211657A1 (en) * | 2003-04-11 | 2004-10-28 | Ingelbrecht Hugo Gerard Eduard | Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom |
| DE10337669B4 (de) * | 2003-08-08 | 2006-04-27 | Atotech Deutschland Gmbh | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
| DE10354860B4 (de) | 2003-11-19 | 2008-06-26 | Atotech Deutschland Gmbh | Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| JPWO2006018872A1 (ja) * | 2004-08-18 | 2008-05-01 | 荏原ユージライト株式会社 | 銅めっき用添加剤およびこれを用いる電子回路基板の製造方法 |
| DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| JP5525762B2 (ja) * | 2008-07-01 | 2014-06-18 | 上村工業株式会社 | 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法 |
| TWI433964B (zh) | 2010-10-08 | 2014-04-11 | Water Star Inc | 複數層之混合金屬氧化物電極及其製法 |
| CN102523785B (zh) * | 2012-01-19 | 2013-10-02 | 南京农业大学 | 藏红t在种子染色标记示踪方面的应用 |
| ES2761883T3 (es) * | 2017-06-16 | 2020-05-21 | Atotech Deutschland Gmbh | Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre |
| US11668017B2 (en) | 2018-07-30 | 2023-06-06 | Water Star, Inc. | Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE520209A (enrdf_load_stackoverflow) * | 1952-05-26 | |||
| DE1075398B (de) * | 1954-03-22 | 1960-02-11 | DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf | Bad zur galvanischen Herstellung von Metallüberzügen |
| NL217034A (enrdf_load_stackoverflow) * | 1956-06-15 | |||
| US3021266A (en) * | 1957-08-12 | 1962-02-13 | Barnet D Ostrow | Additive for copper plating bath |
| US3030282A (en) * | 1961-05-02 | 1962-04-17 | Metal & Thermit Corp | Electrodeposition of copper |
| DE1133610B (de) * | 1959-06-06 | 1962-07-19 | Dehydag Gmbh | Saure galvanische Kupferbaeder |
-
0
- NL NL291575D patent/NL291575A/xx unknown
-
1962
- 1962-04-16 US US187926A patent/US3267010A/en not_active Expired - Lifetime
-
1963
- 1963-04-09 SE SE3974/63A patent/SE301576B/xx unknown
- 1963-04-11 GB GB14632/63A patent/GB1034484A/en not_active Expired
- 1963-04-16 DE DE19631521062 patent/DE1521062B2/de not_active Ceased
- 1963-04-16 FR FR931603A patent/FR1361558A/fr not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2141141A (en) * | 1983-06-10 | 1984-12-12 | Omi Int Corp | Electrodepositing copper |
| EP1897973A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone, Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| EP1897975A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone, Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| US8366901B2 (en) | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1521062A1 (de) | 1969-08-14 |
| NL291575A (enrdf_load_stackoverflow) | |
| US3267010A (en) | 1966-08-16 |
| DE1521062B2 (de) | 1971-11-18 |
| FR1361558A (fr) | 1964-05-22 |
| SE301576B (enrdf_load_stackoverflow) | 1968-06-10 |
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