FR1361558A - Perfectionnements à la production de dépôts électrolytiques de cuivre - Google Patents

Perfectionnements à la production de dépôts électrolytiques de cuivre

Info

Publication number
FR1361558A
FR1361558A FR931603A FR931603A FR1361558A FR 1361558 A FR1361558 A FR 1361558A FR 931603 A FR931603 A FR 931603A FR 931603 A FR931603 A FR 931603A FR 1361558 A FR1361558 A FR 1361558A
Authority
FR
France
Prior art keywords
production
electrolytic copper
copper deposits
deposits
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR931603A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Research Corp
Original Assignee
Udylite Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Research Corp filed Critical Udylite Research Corp
Application granted granted Critical
Publication of FR1361558A publication Critical patent/FR1361558A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
FR931603A 1962-04-16 1963-04-16 Perfectionnements à la production de dépôts électrolytiques de cuivre Expired FR1361558A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US187926A US3267010A (en) 1962-04-16 1962-04-16 Electrodeposition of copper from acidic baths

Publications (1)

Publication Number Publication Date
FR1361558A true FR1361558A (fr) 1964-05-22

Family

ID=22691053

Family Applications (1)

Application Number Title Priority Date Filing Date
FR931603A Expired FR1361558A (fr) 1962-04-16 1963-04-16 Perfectionnements à la production de dépôts électrolytiques de cuivre

Country Status (6)

Country Link
US (1) US3267010A (fr)
DE (1) DE1521062B2 (fr)
FR (1) FR1361558A (fr)
GB (1) GB1034484A (fr)
NL (1) NL291575A (fr)
SE (1) SE301576B (fr)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3373095A (en) * 1967-06-05 1968-03-12 Dayton Bright Copper Company Electroplating of copper
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3715289A (en) * 1971-02-08 1973-02-06 Stauffer Chemical Co Brightener composition for acid copper electroplating baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4551212A (en) * 1985-03-11 1985-11-05 Rca Corporation Bath and process for the electrodeposition of micromachinable copper and additive for said bath
US4673467A (en) * 1986-09-02 1987-06-16 Cbs Inc. Method of manufacturing fine-grained copper substrate for optical information carrier
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4126502C1 (fr) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6358388B1 (en) * 1996-07-15 2002-03-19 Semitool, Inc. Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6454926B1 (en) 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US7247229B2 (en) * 1999-06-28 2007-07-24 Eltech Systems Corporation Coatings for the inhibition of undesirable oxidation in an electrochemical cell
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6596148B1 (en) 1999-08-04 2003-07-22 Mykrolis Corporation Regeneration of plating baths and system therefore
US6391209B1 (en) 1999-08-04 2002-05-21 Mykrolis Corporation Regeneration of plating baths
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
ES2300670T3 (es) * 2000-08-18 2008-06-16 Ti Group Automotive Systems Limited Metodo de metalizado de una tira metalica para su uso en la fabricacion de un tubo de paredes multiples.
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
DE10354860B4 (de) 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
WO2006018872A1 (fr) * 2004-08-18 2006-02-23 Ebara-Udylite Co., Ltd. Additif pour cuivrage et processus de production de substrat de circuit électronique utilisant ledit additif
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
US8366901B2 (en) 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1897973A1 (fr) * 2006-09-07 2008-03-12 Enthone, Inc. Dépôt d'un polymère conducteur et métallisation de substrats non conducteurs
ATE549437T1 (de) * 2006-09-07 2012-03-15 Enthone Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
CN102443818B (zh) 2010-10-08 2016-01-13 水之星公司 多层混合金属氧化物电极及其制造方法
CN102523785B (zh) * 2012-01-19 2013-10-02 南京农业大学 藏红t在种子染色标记示踪方面的应用
ES2761883T3 (es) * 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre
US11668017B2 (en) 2018-07-30 2023-06-06 Water Star, Inc. Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL83873C (fr) * 1952-05-26
DE1075398B (de) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bad zur galvanischen Herstellung von Metallüberzügen
NL217034A (fr) * 1956-06-15
US3021266A (en) * 1957-08-12 1962-02-13 Barnet D Ostrow Additive for copper plating bath
US3030282A (en) * 1961-05-02 1962-04-17 Metal & Thermit Corp Electrodeposition of copper
DE1133610B (de) * 1959-06-06 1962-07-19 Dehydag Gmbh Saure galvanische Kupferbaeder

Also Published As

Publication number Publication date
GB1034484A (en) 1966-06-29
DE1521062B2 (de) 1971-11-18
US3267010A (en) 1966-08-16
DE1521062A1 (de) 1969-08-14
SE301576B (fr) 1968-06-10
NL291575A (fr)

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