IT946822B - Ramatura non elettrolitica - Google Patents
Ramatura non elettroliticaInfo
- Publication number
- IT946822B IT946822B IT19688/72A IT1968872A IT946822B IT 946822 B IT946822 B IT 946822B IT 19688/72 A IT19688/72 A IT 19688/72A IT 1968872 A IT1968872 A IT 1968872A IT 946822 B IT946822 B IT 946822B
- Authority
- IT
- Italy
- Prior art keywords
- electrolytic copper
- electrolytic
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14550871A | 1971-05-20 | 1971-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT946822B true IT946822B (it) | 1973-05-21 |
Family
ID=22513423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT19688/72A IT946822B (it) | 1971-05-20 | 1972-01-21 | Ramatura non elettrolitica |
Country Status (5)
Country | Link |
---|---|
US (1) | US3661597A (it) |
JP (1) | JPS5236089B1 (it) |
CA (1) | CA979603A (it) |
GB (1) | GB1352087A (it) |
IT (1) | IT946822B (it) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3751289A (en) * | 1971-08-20 | 1973-08-07 | M & T Chemicals Inc | Method of preparing surfaces for electroplating |
JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
DE3473890D1 (en) * | 1983-07-25 | 1988-10-13 | Hitachi Ltd | Electroless copper plating solution |
DE3585017D1 (de) * | 1984-09-27 | 1992-02-06 | Toshiba Kawasaki Kk | Stromlose kupferplattierloesung. |
US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
US6395402B1 (en) | 1999-06-09 | 2002-05-28 | Laird Technologies, Inc. | Electrically conductive polymeric foam and method of preparation thereof |
US20050121327A1 (en) * | 2003-12-04 | 2005-06-09 | Giin-Shan Chen | Electroless-plated deposit process for silicon based dielectric insulating material |
EP1793013B1 (en) * | 2005-12-05 | 2017-07-19 | Rohm and Haas Electronic Materials LLC | Metallization of dielectrics |
EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
TWI707061B (zh) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3472664A (en) * | 1966-09-15 | 1969-10-14 | Enthone | Inhibiting stardusting in electroless copper plating |
US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
-
1971
- 1971-05-20 US US145508A patent/US3661597A/en not_active Expired - Lifetime
-
1972
- 1972-01-21 IT IT19688/72A patent/IT946822B/it active
- 1972-02-09 CA CA134,344A patent/CA979603A/en not_active Expired
- 1972-02-29 GB GB930472A patent/GB1352087A/en not_active Expired
- 1972-05-04 JP JP47043801A patent/JPS5236089B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5236089B1 (it) | 1977-09-13 |
DE2205869B2 (de) | 1976-02-19 |
GB1352087A (en) | 1974-05-15 |
CA979603A (en) | 1975-12-16 |
DE2205869A1 (de) | 1972-12-07 |
US3661597A (en) | 1972-05-09 |
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