DE3585017D1 - Stromlose kupferplattierloesung. - Google Patents
Stromlose kupferplattierloesung.Info
- Publication number
- DE3585017D1 DE3585017D1 DE8585109921T DE3585017T DE3585017D1 DE 3585017 D1 DE3585017 D1 DE 3585017D1 DE 8585109921 T DE8585109921 T DE 8585109921T DE 3585017 T DE3585017 T DE 3585017T DE 3585017 D1 DE3585017 D1 DE 3585017D1
- Authority
- DE
- Germany
- Prior art keywords
- plating solution
- copper plating
- current copper
- current
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20044584A JPS6179775A (ja) | 1984-09-27 | 1984-09-27 | 化学銅めつき液 |
JP27330384A JPS61153281A (ja) | 1984-12-26 | 1984-12-26 | 化学銅めつき液 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3585017D1 true DE3585017D1 (de) | 1992-02-06 |
Family
ID=26512194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585109921T Expired - Lifetime DE3585017D1 (de) | 1984-09-27 | 1985-08-07 | Stromlose kupferplattierloesung. |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0179212B1 (de) |
DE (1) | DE3585017D1 (de) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377174A (en) * | 1963-10-24 | 1968-04-09 | Torigai Eiichi | Method and bath for chemically plating copper |
US3959531A (en) * | 1971-04-23 | 1976-05-25 | Photocircuits Corporation | Improvements in electroless metal plating |
US3661597A (en) * | 1971-05-20 | 1972-05-09 | Shipley Co | Electroless copper plating |
US3902907A (en) * | 1973-08-17 | 1975-09-02 | Kazutaka Kishita | System for electroless plating of copper and composition |
CA1135903A (en) * | 1978-09-13 | 1982-11-23 | John F. Mccormack | Electroless copper deposition process having faster plating rates |
JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
US4548644A (en) * | 1982-09-28 | 1985-10-22 | Hitachi Chemical Company, Ltd. | Electroless copper deposition solution |
-
1985
- 1985-08-07 EP EP85109921A patent/EP0179212B1/de not_active Expired - Lifetime
- 1985-08-07 DE DE8585109921T patent/DE3585017D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0179212A2 (de) | 1986-04-30 |
EP0179212A3 (en) | 1988-01-27 |
EP0179212B1 (de) | 1991-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |