ATE549437T1 - Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats - Google Patents
Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substratsInfo
- Publication number
- ATE549437T1 ATE549437T1 AT06018730T AT06018730T ATE549437T1 AT E549437 T1 ATE549437 T1 AT E549437T1 AT 06018730 T AT06018730 T AT 06018730T AT 06018730 T AT06018730 T AT 06018730T AT E549437 T1 ATE549437 T1 AT E549437T1
- Authority
- AT
- Austria
- Prior art keywords
- conductive polymer
- metallization
- deposition
- electrically conductive
- conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06018730A EP1897975B1 (de) | 2006-09-07 | 2006-09-07 | Abscheidung eines leitfähigen Polymers und Metallisierung eines nicht-leitenden Substrats |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE549437T1 true ATE549437T1 (de) | 2012-03-15 |
Family
ID=37672294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06018730T ATE549437T1 (de) | 2006-09-07 | 2006-09-07 | Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1897975B1 (de) |
AT (1) | ATE549437T1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2785896B1 (de) * | 2011-12-02 | 2015-09-23 | Altana AG | Verfahren zur herstellung elektrisch leitfähiger strukturen auf nichtleitenden substraten und auf diese weise erzeugte strukturen |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL291575A (de) * | 1962-04-16 | |||
FR2029120A5 (de) * | 1969-01-10 | 1970-10-16 | Commissariat Energie Atomique | |
DE3327012A1 (de) * | 1983-07-27 | 1985-02-07 | Basf Ag, 6700 Ludwigshafen | Verfahren zur elektrochemischen polymerisation von pyrrolen, anode zur durchfuehrung dieses verfahrens sowie nach diesem verfahren erhaltene produkte |
DE3603373A1 (de) * | 1986-02-05 | 1987-08-06 | Basf Ag | Verfahren zur elektrochemischen beschichtung von kohlenstoff-fasern |
SU1528818A1 (ru) * | 1987-07-14 | 1989-12-15 | Симферопольский Филиал Центрального Проектно-Конструкторского И Технологического Бюро Главсантехпрома | Электролит дл предварительного меднени цинковых сплавов перед нанесением гальванических покрытий |
AU622650B2 (en) * | 1988-03-03 | 1992-04-16 | Blasberg-Oberflachentechnik Gmbh | New through-hole plated printed circuit board and process for manufacturing same |
DE4138771A1 (de) * | 1991-11-26 | 1993-05-27 | Daimler Benz Ag | Verfahren zur bildung elektrisch leitender schichten auf kunststoffoberflaechen |
DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
DE4205190C2 (de) * | 1992-02-20 | 1994-07-14 | Blasberg Oberflaechentech | Verfahren und Mittel zur Konditionierung von Substraten oder Basismaterialien für die nachfolgende Metallisierung |
US6899829B2 (en) * | 2000-11-30 | 2005-05-31 | Shipley Company, L.L.C. | Conductive polymer colloidal compositions with selectivity for non-conductive surfaces |
US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
-
2006
- 2006-09-07 EP EP06018730A patent/EP1897975B1/de active Active
- 2006-09-07 AT AT06018730T patent/ATE549437T1/de active
Also Published As
Publication number | Publication date |
---|---|
EP1897975A1 (de) | 2008-03-12 |
EP1897975B1 (de) | 2012-03-14 |
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