CH461657A - Elektrolytisches Schleifverfahren - Google Patents

Elektrolytisches Schleifverfahren

Info

Publication number
CH461657A
CH461657A CH82267A CH82267A CH461657A CH 461657 A CH461657 A CH 461657A CH 82267 A CH82267 A CH 82267A CH 82267 A CH82267 A CH 82267A CH 461657 A CH461657 A CH 461657A
Authority
CH
Switzerland
Prior art keywords
grinding process
electrolytic grinding
electrolytic
grinding
Prior art date
Application number
CH82267A
Other languages
English (en)
Inventor
M Bell Ramsay
Original Assignee
Hammond Machinery Builders Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hammond Machinery Builders Inc filed Critical Hammond Machinery Builders Inc
Publication of CH461657A publication Critical patent/CH461657A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CH82267A 1966-01-20 1967-01-17 Elektrolytisches Schleifverfahren CH461657A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52198766A 1966-01-20 1966-01-20

Publications (1)

Publication Number Publication Date
CH461657A true CH461657A (de) 1968-08-31

Family

ID=24078961

Family Applications (1)

Application Number Title Priority Date Filing Date
CH82267A CH461657A (de) 1966-01-20 1967-01-17 Elektrolytisches Schleifverfahren

Country Status (4)

Country Link
US (1) US3448023A (de)
JP (1) JPS4823598B1 (de)
CH (1) CH461657A (de)
GB (1) GB1148187A (de)

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GB2000055B (en) * 1977-06-14 1982-03-03 Inoue Japax Research Incorporated Method of and apparatus for shaping workpieces
US4294673A (en) * 1979-02-24 1981-10-13 Hitachi Shipbuilding & Engineering Co., Ltd. Method of mirror-finishing a cylindrical workpiece
US4642943A (en) * 1985-11-21 1987-02-17 Taylor Jr Joseph R Belt abrading apparatus and method
US5284554A (en) * 1992-01-09 1994-02-08 International Business Machines Corporation Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces
US5782679A (en) * 1996-09-23 1998-07-21 Hunter; David T. Metal abrasive belt and method of making same
US6902659B2 (en) * 1998-12-01 2005-06-07 Asm Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US7425250B2 (en) * 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
EP1052062A1 (de) * 1999-05-03 2000-11-15 Applied Materials, Inc. Vorbehandlung eines fixierten Schleifmittels
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) * 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6921551B2 (en) * 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US7754061B2 (en) * 2000-08-10 2010-07-13 Novellus Systems, Inc. Method for controlling conductor deposition on predetermined portions of a wafer
US20040170753A1 (en) * 2000-12-18 2004-09-02 Basol Bulent M. Electrochemical mechanical processing using low temperature process environment
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
KR20060055463A (ko) * 2003-06-06 2006-05-23 어플라이드 머티어리얼스, 인코포레이티드 전기화학적 기계적 폴리싱을 위한 전도성 폴리싱 아티클
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) * 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US7390744B2 (en) * 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20060021974A1 (en) * 2004-01-29 2006-02-02 Applied Materials, Inc. Method and composition for polishing a substrate
US7648622B2 (en) * 2004-02-27 2010-01-19 Novellus Systems, Inc. System and method for electrochemical mechanical polishing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
WO2006081589A2 (en) * 2005-01-28 2006-08-03 Applied Materials, Inc. Tungsten electroprocessing
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US8070933B2 (en) * 2005-05-06 2011-12-06 Thielenhaus Microfinishing Corp. Electrolytic microfinishing of metallic workpieces
TW200720494A (en) * 2005-11-01 2007-06-01 Applied Materials Inc Ball contact cover for copper loss reduction and spike reduction
EP1839695A1 (de) * 2006-03-31 2007-10-03 Debiotech S.A. Vorrichtung zur Injektion einer medizinischen Flüssigkeit
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
US8500985B2 (en) * 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US20080237048A1 (en) * 2007-03-30 2008-10-02 Ismail Emesh Method and apparatus for selective electrofilling of through-wafer vias
US20090065365A1 (en) * 2007-09-11 2009-03-12 Asm Nutool, Inc. Method and apparatus for copper electroplating
EP2574583A1 (de) * 2011-09-30 2013-04-03 Inventio AG Reduzierung der übermäßigen Traktion eines Fahrstuhls

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US2680938A (en) * 1949-11-09 1954-06-15 Osborn Mfg Co Apparatus for conditioning metal sheets and the like
US2997437A (en) * 1958-09-09 1961-08-22 Thompson Ramo Wooldridge Inc Abrasive machine and method
US3238114A (en) * 1960-06-06 1966-03-01 Gen Electric Cathode for electrolytic erosion of metal
US3162588A (en) * 1961-04-17 1964-12-22 Hammond Machinery Builders Inc Belt type electrolytic grinding machine

Also Published As

Publication number Publication date
JPS4823598B1 (de) 1973-07-14
US3448023A (en) 1969-06-03
GB1148187A (en) 1969-04-10

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