FR3001097A1 - Dispositif de commutation avec diviseur resistif - Google Patents
Dispositif de commutation avec diviseur resistif Download PDFInfo
- Publication number
- FR3001097A1 FR3001097A1 FR1450111A FR1450111A FR3001097A1 FR 3001097 A1 FR3001097 A1 FR 3001097A1 FR 1450111 A FR1450111 A FR 1450111A FR 1450111 A FR1450111 A FR 1450111A FR 3001097 A1 FR3001097 A1 FR 3001097A1
- Authority
- FR
- France
- Prior art keywords
- switching device
- resistive divider
- fet
- resistor
- fets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005669 field effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electronic Switches (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Power Conversion In General (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Des modes de réalisation proposent un dispositif de commutation comprenant un ou plusieurs transistors à effet de champ (FET) (104). Dans des modes de réalisation, un diviseur résistif (132) comprenant une première résistance (136) et une seconde résistance (140) peut être couplé au FET à une position électriquement entre une borne de grille (120) du FET et une borne de corps (124) du FET.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/742,086 US8847672B2 (en) | 2013-01-15 | 2013-01-15 | Switching device with resistive divider |
Publications (1)
Publication Number | Publication Date |
---|---|
FR3001097A1 true FR3001097A1 (fr) | 2014-07-18 |
Family
ID=51031600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1450111A Withdrawn FR3001097A1 (fr) | 2013-01-15 | 2014-01-08 | Dispositif de commutation avec diviseur resistif |
Country Status (7)
Country | Link |
---|---|
US (1) | US8847672B2 (fr) |
JP (1) | JP6574549B2 (fr) |
KR (1) | KR102110615B1 (fr) |
CN (1) | CN103929163B (fr) |
FR (1) | FR3001097A1 (fr) |
IL (1) | IL230314A (fr) |
TW (1) | TWI608700B (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8880014B2 (en) | 2010-06-07 | 2014-11-04 | Skyworks Solutions, Inc. | CMOS RF switch device and method for biasing the same |
EP2568606B1 (fr) * | 2011-09-06 | 2014-03-19 | ST-Ericsson SA | Dispositif électronique avec circuit de polarisation de corps pour équipement portable avec connecteur USB pour casque |
US9373955B2 (en) * | 2012-01-09 | 2016-06-21 | Skyworks Solutions, Inc. | Devices and methods related to electrostatic discharge-protected CMOS switches |
US9214932B2 (en) | 2013-02-11 | 2015-12-15 | Triquint Semiconductor, Inc. | Body-biased switching device |
US9203396B1 (en) * | 2013-02-22 | 2015-12-01 | Triquint Semiconductor, Inc. | Radio frequency switch device with source-follower |
US9379698B2 (en) | 2014-02-04 | 2016-06-28 | Triquint Semiconductor, Inc. | Field effect transistor switching circuit |
TWI580185B (zh) * | 2015-03-05 | 2017-04-21 | 瑞昱半導體股份有限公司 | 類比開關電路 |
US9503074B2 (en) * | 2015-03-06 | 2016-11-22 | Qualcomm Incorporated | RF circuit with switch transistor with body connection |
CN106033961B (zh) * | 2015-03-12 | 2019-09-03 | 瑞昱半导体股份有限公司 | 类比开关电路 |
KR101901699B1 (ko) | 2016-10-05 | 2018-09-28 | 삼성전기 주식회사 | 고조파 억제특성을 개선한 안테나 스위치 회로 |
US11320158B2 (en) * | 2017-05-11 | 2022-05-03 | Coway Co., Ltd. | Multifunctional circulation system enabling purification of outside air |
CN109150150A (zh) * | 2018-08-06 | 2019-01-04 | 上海华虹宏力半导体制造有限公司 | 一种可改善射频开关特性的射频开关电路 |
WO2020113175A2 (fr) * | 2018-11-29 | 2020-06-04 | OctoTech, Inc. | Limiteur de puissance rf cmos et circuits de protection contre les décharges électrostatiques |
JP7337561B2 (ja) * | 2019-06-25 | 2023-09-04 | ローム株式会社 | アナログスイッチ回路、ボリウム回路、半導体集積回路 |
US11585844B1 (en) * | 2021-09-09 | 2023-02-21 | Board Of Regents, The University Of Texas System | Systems, circuits, and methods to detect gate-open failures in MOS based insulated gate transistors |
Family Cites Families (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3551788A (en) | 1968-09-13 | 1970-12-29 | Servo Corp Of America | High voltage transistorized stack with leakage current compensation |
US3699359A (en) | 1971-04-20 | 1972-10-17 | Philco Ford Corp | Electronic latching device |
US4053916A (en) | 1975-09-04 | 1977-10-11 | Westinghouse Electric Corporation | Silicon on sapphire MOS transistor |
DE2851789C2 (de) | 1978-11-30 | 1981-10-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Schaltung zum Schalten und Übertragen von Wechselspannungen |
US4491750A (en) | 1982-09-28 | 1985-01-01 | Eaton Corporation | Bidirectionally source stacked FETs with drain-referenced common gating |
JPH01254014A (ja) | 1988-04-04 | 1989-10-11 | Toshiba Corp | 電力増幅器 |
JPH07105447B2 (ja) | 1988-12-15 | 1995-11-13 | 株式会社東芝 | 伝送ゲート |
US5313083A (en) | 1988-12-16 | 1994-05-17 | Raytheon Company | R.F. switching circuits |
US5105164A (en) | 1989-02-28 | 1992-04-14 | At&T Bell Laboratories | High efficiency uhf linear power amplifier |
US5012123A (en) | 1989-03-29 | 1991-04-30 | Hittite Microwave, Inc. | High-power rf switching system |
JPH0732335B2 (ja) | 1990-11-16 | 1995-04-10 | 日本電信電話株式会社 | 高周波増幅器 |
JP3243892B2 (ja) | 1993-05-21 | 2002-01-07 | ソニー株式会社 | 信号切り替え用スイッチ |
US5863823A (en) | 1993-07-12 | 1999-01-26 | Peregrine Semiconductor Corporation | Self-aligned edge control in silicon on insulator |
US5973363A (en) | 1993-07-12 | 1999-10-26 | Peregrine Semiconductor Corp. | CMOS circuitry with shortened P-channel length on ultrathin silicon on insulator |
US5930638A (en) | 1993-07-12 | 1999-07-27 | Peregrine Semiconductor Corp. | Method of making a low parasitic resistor on ultrathin silicon on insulator |
US5572040A (en) | 1993-07-12 | 1996-11-05 | Peregrine Semiconductor Corporation | High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
US5973382A (en) | 1993-07-12 | 1999-10-26 | Peregrine Semiconductor Corporation | Capacitor on ultrathin semiconductor on insulator |
US5416043A (en) | 1993-07-12 | 1995-05-16 | Peregrine Semiconductor Corporation | Minimum charge FET fabricated on an ultrathin silicon on sapphire wafer |
US5452473A (en) | 1994-02-28 | 1995-09-19 | Qualcomm Incorporated | Reverse link, transmit power correction and limitation in a radiotelephone system |
US5553295A (en) | 1994-03-23 | 1996-09-03 | Intel Corporation | Method and apparatus for regulating the output voltage of negative charge pumps |
JP2801563B2 (ja) | 1994-08-30 | 1998-09-21 | 松下電器産業株式会社 | 通信用無線機の送受信回路、半導体集積回路装置および通信用無線機 |
JPH08148949A (ja) | 1994-11-18 | 1996-06-07 | Fujitsu Ltd | 高周波増幅器 |
FR2742942B1 (fr) | 1995-12-26 | 1998-01-16 | Sgs Thomson Microelectronics | Generateur de creneaux de haute tension |
US5777530A (en) | 1996-01-31 | 1998-07-07 | Matsushita Electric Industrial Co., Ltd. | Switch attenuator |
JP3484462B2 (ja) | 1996-04-11 | 2004-01-06 | 株式会社ルネサステクノロジ | フローティングsoi−mosfetの寿命を予測する方法 |
JPH09284114A (ja) | 1996-04-19 | 1997-10-31 | Toshiba Microelectron Corp | アナログ入力回路 |
US5689144A (en) * | 1996-05-15 | 1997-11-18 | Siliconix Incorporated | Four-terminal power MOSFET switch having reduced threshold voltage and on-resistance |
WO1998006174A1 (fr) | 1996-08-05 | 1998-02-12 | Mitsubishi Denki Kabushiki Kaisha | Circuit integre haute frequence pour emetteur-recepteur radio haute frequence exempt de fuites de puissance haute frequence |
US5818099A (en) | 1996-10-03 | 1998-10-06 | International Business Machines Corporation | MOS high frequency switch circuit using a variable well bias |
US5920233A (en) | 1996-11-18 | 1999-07-06 | Peregrine Semiconductor Corp. | Phase locked loop including a sampling circuit for reducing spurious side bands |
JPH10242829A (ja) | 1997-02-24 | 1998-09-11 | Sanyo Electric Co Ltd | スイッチ回路装置 |
JP3441330B2 (ja) | 1997-02-28 | 2003-09-02 | 株式会社東芝 | 半導体装置及びその製造方法 |
US6160292A (en) | 1997-04-23 | 2000-12-12 | International Business Machines Corporation | Circuit and methods to improve the operation of SOI devices |
US6033974A (en) | 1997-05-12 | 2000-03-07 | Silicon Genesis Corporation | Method for controlled cleaving process |
US6013563A (en) | 1997-05-12 | 2000-01-11 | Silicon Genesis Corporation | Controlled cleaning process |
EP1018153A1 (fr) | 1997-08-29 | 2000-07-12 | Sharon N. Farrens | Procede de soudage de tranches in situ par plasma |
JPH11136111A (ja) | 1997-10-30 | 1999-05-21 | Sony Corp | 高周波回路 |
JP3711193B2 (ja) | 1998-01-16 | 2005-10-26 | 三菱電機株式会社 | 送受信切り換え回路 |
US5959488A (en) | 1998-01-24 | 1999-09-28 | Winbond Electronics Corp. | Dual-node capacitor coupled MOSFET for improving ESD performance |
US6271067B1 (en) * | 1998-02-27 | 2001-08-07 | Micron Technology, Inc. | Methods of forming field effect transistors and field effect transistor circuitry |
US6249027B1 (en) | 1998-06-08 | 2001-06-19 | Sun Microsystems, Inc. | Partially depleted SOI device having a dedicated single body bias means |
JP2000022160A (ja) | 1998-07-06 | 2000-01-21 | Hitachi Ltd | 半導体集積回路及びその製造方法 |
JP4360702B2 (ja) | 1998-08-07 | 2009-11-11 | 株式会社ルネサステクノロジ | 半導体装置 |
JP3408762B2 (ja) | 1998-12-03 | 2003-05-19 | シャープ株式会社 | Soi構造の半導体装置及びその製造方法 |
US6171965B1 (en) | 1999-04-21 | 2001-01-09 | Silicon Genesis Corporation | Treatment method of cleaved film for the manufacture of substrates |
AU6905000A (en) | 1999-08-10 | 2001-03-05 | Silicon Genesis Corporation | A cleaving process to fabricate multilayered substrates using low implantation doses |
US6628159B2 (en) * | 1999-09-17 | 2003-09-30 | International Business Machines Corporation | SOI voltage-tolerant body-coupled pass transistor |
JP3608456B2 (ja) | 1999-12-08 | 2005-01-12 | セイコーエプソン株式会社 | Soi構造のmis電界効果トランジスタの製造方法 |
US6504212B1 (en) | 2000-02-03 | 2003-01-07 | International Business Machines Corporation | Method and apparatus for enhanced SOI passgate operations |
JP3504212B2 (ja) | 2000-04-04 | 2004-03-08 | シャープ株式会社 | Soi構造の半導体装置 |
JP2002033399A (ja) | 2000-07-13 | 2002-01-31 | Toshiba Corp | 半導体集積回路及びその製造方法 |
US6816016B2 (en) | 2000-08-10 | 2004-11-09 | Tropian, Inc. | High-efficiency modulating RF amplifier |
US6496074B1 (en) | 2000-09-28 | 2002-12-17 | Koninklijke Philips Electronics N.V. | Cascode bootstrapped analog power amplifier circuit |
US6978437B1 (en) | 2000-10-10 | 2005-12-20 | Toppan Photomasks, Inc. | Photomask for eliminating antenna effects in an integrated circuit and integrated circuit manufacture with same |
JP4434474B2 (ja) | 2000-11-29 | 2010-03-17 | Necエレクトロニクス株式会社 | Mosトランジスタの模擬試験方法 |
TWI230392B (en) | 2001-06-18 | 2005-04-01 | Innovative Silicon Sa | Semiconductor device |
US6819938B2 (en) | 2001-06-26 | 2004-11-16 | Qualcomm Incorporated | System and method for power control calibration and a wireless communication device |
KR100906356B1 (ko) | 2001-08-10 | 2009-07-06 | 히타치 긴조쿠 가부시키가이샤 | 하이 패스 필터 |
JP3986780B2 (ja) | 2001-08-17 | 2007-10-03 | 三菱電機株式会社 | 相補型プッシュプル増幅器 |
US6804502B2 (en) | 2001-10-10 | 2004-10-12 | Peregrine Semiconductor Corporation | Switch circuit and method of switching radio frequency signals |
US7796969B2 (en) | 2001-10-10 | 2010-09-14 | Peregrine Semiconductor Corporation | Symmetrically and asymmetrically stacked transistor group RF switch |
JP3813869B2 (ja) | 2001-12-20 | 2006-08-23 | 松下電器産業株式会社 | 電界効果トランジスタスイッチ回路 |
JP3947044B2 (ja) * | 2002-05-31 | 2007-07-18 | 富士通株式会社 | 入出力バッファ |
US6642578B1 (en) | 2002-07-22 | 2003-11-04 | Anadigics, Inc. | Linearity radio frequency switch with low control voltage |
KR100496863B1 (ko) | 2002-10-04 | 2005-06-22 | 삼성전자주식회사 | 파워-온 리셋 회로 |
JP3445608B2 (ja) | 2002-10-25 | 2003-09-08 | 株式会社東芝 | 映像情報を含むデジタル情報の管理システム |
JP2004205301A (ja) | 2002-12-25 | 2004-07-22 | Nec Corp | 評価装置及びそれに用いる回路設計方法 |
JP4257971B2 (ja) * | 2003-03-27 | 2009-04-30 | 独立行政法人産業技術総合研究所 | 二重ゲート電界効果トランジスタのゲート信号印加方法 |
JP4342970B2 (ja) | 2004-02-02 | 2009-10-14 | 株式会社東芝 | 半導体メモリ装置及びその製造方法 |
US7042044B2 (en) | 2004-02-18 | 2006-05-09 | Koucheng Wu | Nor-type channel-program channel-erase contactless flash memory on SOI |
US7072217B2 (en) | 2004-02-24 | 2006-07-04 | Micron Technology, Inc. | Multi-state memory cell with asymmetric charge trapping |
JP2006041232A (ja) * | 2004-07-28 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 高周波回路 |
CN1989610A (zh) * | 2004-07-28 | 2007-06-27 | 松下电器产业株式会社 | 振荡器 |
US7158067B2 (en) * | 2005-01-31 | 2007-01-02 | The United States Of America As Represented By The Secretary Of The Navy | Analog to digital converter using sawtooth voltage signals with differential comparator |
US7402850B2 (en) | 2005-06-21 | 2008-07-22 | Micron Technology, Inc. | Back-side trapped non-volatile memory device |
US7890891B2 (en) | 2005-07-11 | 2011-02-15 | Peregrine Semiconductor Corporation | Method and apparatus improving gate oxide reliability by controlling accumulated charge |
US20080076371A1 (en) | 2005-07-11 | 2008-03-27 | Alexander Dribinsky | Circuit and method for controlling charge injection in radio frequency switches |
US8742502B2 (en) | 2005-07-11 | 2014-06-03 | Peregrine Semiconductor Corporation | Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction |
US7910993B2 (en) | 2005-07-11 | 2011-03-22 | Peregrine Semiconductor Corporation | Method and apparatus for use in improving linearity of MOSFET's using an accumulated charge sink |
US20070023833A1 (en) | 2005-07-28 | 2007-02-01 | Serguei Okhonin | Method for reading a memory cell having an electrically floating body transistor, and memory cell and array implementing same |
WO2007018037A1 (fr) | 2005-08-09 | 2007-02-15 | Hitachi Metals, Ltd. | Circuit de commutation à haute fréquence |
JP2009065304A (ja) * | 2007-09-05 | 2009-03-26 | Panasonic Corp | 高周波スイッチ装置 |
US7863691B2 (en) | 2008-03-10 | 2011-01-04 | International Business Machines Corporation | Merged field effect transistor cells for switching |
JP5181893B2 (ja) * | 2008-07-17 | 2013-04-10 | 株式会社リコー | インバータ回路 |
JP5632663B2 (ja) | 2010-06-29 | 2014-11-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9160328B2 (en) * | 2012-07-07 | 2015-10-13 | Skyworks Solutions, Inc. | Circuits, devices, methods and applications related to silicon-on-insulator based radio-frequency switches |
WO2015107568A1 (fr) | 2014-01-20 | 2015-07-23 | 株式会社Leap | Procédé de fabrication de connecteur |
-
2013
- 2013-01-15 US US13/742,086 patent/US8847672B2/en active Active
-
2014
- 2014-01-02 IL IL230314A patent/IL230314A/en active IP Right Grant
- 2014-01-07 TW TW103100486A patent/TWI608700B/zh active
- 2014-01-08 FR FR1450111A patent/FR3001097A1/fr not_active Withdrawn
- 2014-01-10 JP JP2014003422A patent/JP6574549B2/ja active Active
- 2014-01-14 CN CN201410016473.0A patent/CN103929163B/zh not_active Expired - Fee Related
- 2014-01-14 KR KR1020140004273A patent/KR102110615B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20140092256A (ko) | 2014-07-23 |
US20140197882A1 (en) | 2014-07-17 |
TW201429161A (zh) | 2014-07-16 |
TWI608700B (zh) | 2017-12-11 |
KR102110615B1 (ko) | 2020-05-28 |
JP2014138423A (ja) | 2014-07-28 |
IL230314A (en) | 2016-06-30 |
JP6574549B2 (ja) | 2019-09-11 |
CN103929163A (zh) | 2014-07-16 |
US8847672B2 (en) | 2014-09-30 |
CN103929163B (zh) | 2019-03-22 |
IL230314A0 (en) | 2014-08-31 |
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