FR2901498B1 - Feutre de polissage mecano-chimique - Google Patents

Feutre de polissage mecano-chimique

Info

Publication number
FR2901498B1
FR2901498B1 FR0755265A FR0755265A FR2901498B1 FR 2901498 B1 FR2901498 B1 FR 2901498B1 FR 0755265 A FR0755265 A FR 0755265A FR 0755265 A FR0755265 A FR 0755265A FR 2901498 B1 FR2901498 B1 FR 2901498B1
Authority
FR
France
Prior art keywords
mecano
chemical polishing
polishing felt
felt
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0755265A
Other languages
English (en)
French (fr)
Other versions
FR2901498A1 (fr
Inventor
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2901498A1 publication Critical patent/FR2901498A1/fr
Application granted granted Critical
Publication of FR2901498B1 publication Critical patent/FR2901498B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
FR0755265A 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique Active FR2901498B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/442,076 US7169030B1 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
FR2901498A1 FR2901498A1 (fr) 2007-11-30
FR2901498B1 true FR2901498B1 (fr) 2010-09-03

Family

ID=37681809

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0755265A Active FR2901498B1 (fr) 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique

Country Status (7)

Country Link
US (1) US7169030B1 (enExample)
JP (1) JP5346445B2 (enExample)
KR (1) KR101360654B1 (enExample)
CN (1) CN100540224C (enExample)
DE (1) DE102007024460B4 (enExample)
FR (1) FR2901498B1 (enExample)
TW (1) TWI402334B (enExample)

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US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
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CN106891246B (zh) * 2017-03-30 2019-05-07 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
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US11638978B2 (en) * 2019-06-10 2023-05-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-debris fluopolymer composite CMP polishing pad
CN110170917A (zh) * 2019-07-10 2019-08-27 蓝思科技（长沙）有限公司 一种抛光衬垫及其制备方法
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Also Published As

Publication number Publication date
TW200813199A (en) 2008-03-16
KR20070114018A (ko) 2007-11-29
TWI402334B (zh) 2013-07-21
JP5346445B2 (ja) 2013-11-20
CN101077569A (zh) 2007-11-28
KR101360654B1 (ko) 2014-02-07
FR2901498A1 (fr) 2007-11-30
CN100540224C (zh) 2009-09-16
DE102007024460A1 (de) 2007-11-29
JP2007313640A (ja) 2007-12-06
US7169030B1 (en) 2007-01-30
DE102007024460B4 (de) 2021-12-16

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