FR2826510B1 - Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical - Google Patents
Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor verticalInfo
- Publication number
- FR2826510B1 FR2826510B1 FR0207914A FR0207914A FR2826510B1 FR 2826510 B1 FR2826510 B1 FR 2826510B1 FR 0207914 A FR0207914 A FR 0207914A FR 0207914 A FR0207914 A FR 0207914A FR 2826510 B1 FR2826510 B1 FR 2826510B1
- Authority
- FR
- France
- Prior art keywords
- vertical transistor
- producing
- memory device
- transistor
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7926—Vertical transistors, i.e. transistors having source and drain not in the same horizontal plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10130766A DE10130766B4 (de) | 2001-06-26 | 2001-06-26 | Vertikal-Transistor, Speicheranordnung sowie Verfahren zum Herstellen eines Vertikal-Transistors |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2826510A1 FR2826510A1 (fr) | 2002-12-27 |
FR2826510B1 true FR2826510B1 (fr) | 2005-08-19 |
Family
ID=7689491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0207914A Expired - Lifetime FR2826510B1 (fr) | 2001-06-26 | 2002-06-26 | Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical |
Country Status (5)
Country | Link |
---|---|
US (1) | US6768166B2 (fr) |
CN (1) | CN1265466C (fr) |
DE (1) | DE10130766B4 (fr) |
FR (1) | FR2826510B1 (fr) |
GB (1) | GB2380857B (fr) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4678760B2 (ja) * | 2002-06-21 | 2011-04-27 | マイクロン テクノロジー, インク. | メモリセルのアレイ、メモリアレイ、メモリデバイス及び多重状態セルを有するメモリアレイを形成する方法 |
KR100474850B1 (ko) * | 2002-11-15 | 2005-03-11 | 삼성전자주식회사 | 수직 채널을 가지는 비휘발성 sonos 메모리 및 그 제조방법 |
JP2004349291A (ja) * | 2003-05-20 | 2004-12-09 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US6963104B2 (en) * | 2003-06-12 | 2005-11-08 | Advanced Micro Devices, Inc. | Non-volatile memory device |
US6849481B1 (en) * | 2003-07-28 | 2005-02-01 | Chartered Semiconductor Manufacturing Ltd. | Thyristor-based SRAM and method for the fabrication thereof |
DE10350751B4 (de) * | 2003-10-30 | 2008-04-24 | Infineon Technologies Ag | Verfahren zum Herstellen eines vertikalen Feldeffekttransistors und Feldeffekt-Speichertransistor, insbesondere FLASH-Speichertransistor |
US6933558B2 (en) * | 2003-12-04 | 2005-08-23 | Advanced Micro Devices, Inc. | Flash memory device |
US7050330B2 (en) * | 2003-12-16 | 2006-05-23 | Micron Technology, Inc. | Multi-state NROM device |
US7269072B2 (en) * | 2003-12-16 | 2007-09-11 | Micron Technology, Inc. | NROM memory cell, memory array, related devices and methods |
US7241654B2 (en) * | 2003-12-17 | 2007-07-10 | Micron Technology, Inc. | Vertical NROM NAND flash memory array |
US20050208769A1 (en) * | 2004-03-19 | 2005-09-22 | Manish Sharma | Semiconductor structure |
US7423310B2 (en) * | 2004-09-29 | 2008-09-09 | Infineon Technologies Ag | Charge-trapping memory cell and charge-trapping memory device |
CN100403550C (zh) * | 2005-08-05 | 2008-07-16 | 西安电子科技大学 | 垂直型宽禁带半导体器件结构及制作方法 |
KR100707217B1 (ko) | 2006-05-26 | 2007-04-13 | 삼성전자주식회사 | 리세스-타입 제어 게이트 전극을 구비하는 반도체 메모리소자 및 그 제조 방법 |
KR20080035211A (ko) | 2006-10-18 | 2008-04-23 | 삼성전자주식회사 | 리세스-타입 제어 게이트 전극을 구비하는 반도체 메모리소자 |
US7851848B2 (en) | 2006-11-01 | 2010-12-14 | Macronix International Co., Ltd. | Cylindrical channel charge trapping devices with effectively high coupling ratios |
US8546863B2 (en) * | 2007-04-19 | 2013-10-01 | Nxp B.V. | Nonvolatile memory cell comprising a nanowire and manufacturing method thereof |
US9449831B2 (en) | 2007-05-25 | 2016-09-20 | Cypress Semiconductor Corporation | Oxide-nitride-oxide stack having multiple oxynitride layers |
US8633537B2 (en) | 2007-05-25 | 2014-01-21 | Cypress Semiconductor Corporation | Memory transistor with multiple charge storing layers and a high work function gate electrode |
JP5460950B2 (ja) * | 2007-06-06 | 2014-04-02 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びその製造方法 |
JP2010010596A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
US8153482B2 (en) * | 2008-09-22 | 2012-04-10 | Sharp Laboratories Of America, Inc. | Well-structure anti-punch-through microwire device |
JP2011066109A (ja) * | 2009-09-16 | 2011-03-31 | Unisantis Electronics Japan Ltd | 半導体記憶装置 |
KR101085155B1 (ko) | 2010-11-16 | 2011-11-18 | 서강대학교산학협력단 | 터널링 전계효과 트랜지스터를 이용한 1t 디램 셀 소자 |
US8916920B2 (en) * | 2011-07-19 | 2014-12-23 | Macronix International Co., Ltd. | Memory structure with planar upper surface |
KR102215973B1 (ko) * | 2012-07-01 | 2021-02-16 | 롱지튜드 플래쉬 메모리 솔루션즈 리미티드 | 다수의 전하 저장 층들을 갖는 메모리 트랜지스터 |
CN102931237B (zh) * | 2012-10-10 | 2015-07-22 | 哈尔滨工程大学 | 垂直非对称环栅mosfet器件的结构及其制造方法 |
US9673209B2 (en) * | 2014-05-16 | 2017-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device and method for fabricating the same |
CN105321885B (zh) * | 2014-07-02 | 2018-04-13 | 旺宏电子股份有限公司 | 内存装置及其制造方法 |
US9799776B2 (en) * | 2015-06-15 | 2017-10-24 | Stmicroelectronics, Inc. | Semi-floating gate FET |
US9805935B2 (en) | 2015-12-31 | 2017-10-31 | International Business Machines Corporation | Bottom source/drain silicidation for vertical field-effect transistor (FET) |
US10002962B2 (en) | 2016-04-27 | 2018-06-19 | International Business Machines Corporation | Vertical FET structure |
US9812567B1 (en) | 2016-05-05 | 2017-11-07 | International Business Machines Corporation | Precise control of vertical transistor gate length |
US9653575B1 (en) | 2016-05-09 | 2017-05-16 | International Business Machines Corporation | Vertical transistor with a body contact for back-biasing |
US9842931B1 (en) | 2016-06-09 | 2017-12-12 | International Business Machines Corporation | Self-aligned shallow trench isolation and doping for vertical fin transistors |
US9853127B1 (en) | 2016-06-22 | 2017-12-26 | International Business Machines Corporation | Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process |
US10217863B2 (en) | 2016-06-28 | 2019-02-26 | International Business Machines Corporation | Fabrication of a vertical fin field effect transistor with an asymmetric gate structure |
US10243073B2 (en) | 2016-08-19 | 2019-03-26 | International Business Machines Corporation | Vertical channel field-effect transistor (FET) process compatible long channel transistors |
US9704990B1 (en) | 2016-09-19 | 2017-07-11 | International Business Machines Corporation | Vertical FET with strained channel |
US10312346B2 (en) | 2016-10-19 | 2019-06-04 | International Business Machines Corporation | Vertical transistor with variable gate length |
DE112017008324T5 (de) * | 2017-12-27 | 2020-09-03 | Intel Corporation | Feldeffekttransistoren und verfahren zum herstellen derselben |
Family Cites Families (16)
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US4774556A (en) * | 1985-07-25 | 1988-09-27 | Nippondenso Co., Ltd. | Non-volatile semiconductor memory device |
US5379255A (en) | 1992-12-14 | 1995-01-03 | Texas Instruments Incorporated | Three dimensional famos memory devices and methods of fabricating |
JP3403231B2 (ja) * | 1993-05-12 | 2003-05-06 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5382540A (en) | 1993-09-20 | 1995-01-17 | Motorola, Inc. | Process for forming an electrically programmable read-only memory cell |
JP3197134B2 (ja) * | 1994-01-18 | 2001-08-13 | 株式会社東芝 | 半導体装置 |
US5460988A (en) | 1994-04-25 | 1995-10-24 | United Microelectronics Corporation | Process for high density flash EPROM cell |
JP3745392B2 (ja) * | 1994-05-26 | 2006-02-15 | 株式会社ルネサステクノロジ | 半導体装置 |
US5432739A (en) * | 1994-06-17 | 1995-07-11 | Philips Electronics North America Corporation | Non-volatile sidewall memory cell method of fabricating same |
DE19600307C1 (de) | 1996-01-05 | 1998-01-08 | Siemens Ag | Hochintegrierter Halbleiterspeicher und Verfahren zur Herstellung des Halbleiterspeichers |
DE19600423C2 (de) * | 1996-01-08 | 2001-07-05 | Siemens Ag | Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung |
JP3371708B2 (ja) * | 1996-08-22 | 2003-01-27 | ソニー株式会社 | 縦型電界効果トランジスタの製造方法 |
KR100331845B1 (ko) * | 1998-01-10 | 2002-05-10 | 박종섭 | 박막트랜지스터제조방법 |
US6348711B1 (en) | 1998-05-20 | 2002-02-19 | Saifun Semiconductors Ltd. | NROM cell with self-aligned programming and erasure areas |
US6555870B1 (en) * | 1999-06-29 | 2003-04-29 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method for producing same |
DE10012112C2 (de) * | 2000-03-13 | 2002-01-10 | Infineon Technologies Ag | Steg-Feldeffekttransistor und Verfahren zum Herstellen eines Steg-Feldeffekttransistors |
EP1312120A1 (fr) | 2000-08-14 | 2003-05-21 | Matrix Semiconductor, Inc. | Reseaux denses, dispositifs de stockage de charges, et procedes de production correspondants |
-
2001
- 2001-06-26 DE DE10130766A patent/DE10130766B4/de not_active Expired - Fee Related
-
2002
- 2002-06-25 CN CNB021315116A patent/CN1265466C/zh not_active Expired - Fee Related
- 2002-06-25 US US10/183,849 patent/US6768166B2/en not_active Expired - Lifetime
- 2002-06-26 GB GB0214803A patent/GB2380857B/en not_active Expired - Fee Related
- 2002-06-26 FR FR0207914A patent/FR2826510B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20030015755A1 (en) | 2003-01-23 |
CN1265466C (zh) | 2006-07-19 |
US6768166B2 (en) | 2004-07-27 |
DE10130766B4 (de) | 2005-08-11 |
GB2380857B (en) | 2005-08-31 |
CN1400669A (zh) | 2003-03-05 |
DE10130766A1 (de) | 2003-01-09 |
FR2826510A1 (fr) | 2002-12-27 |
GB0214803D0 (en) | 2002-08-07 |
GB2380857A (en) | 2003-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |