FR2638538B1 - Instrument d'alignement et d'interconnexion et son procede d'application - Google Patents

Instrument d'alignement et d'interconnexion et son procede d'application

Info

Publication number
FR2638538B1
FR2638538B1 FR898914177A FR8914177A FR2638538B1 FR 2638538 B1 FR2638538 B1 FR 2638538B1 FR 898914177 A FR898914177 A FR 898914177A FR 8914177 A FR8914177 A FR 8914177A FR 2638538 B1 FR2638538 B1 FR 2638538B1
Authority
FR
France
Prior art keywords
alignment
application method
interconnection instrument
interconnection
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR898914177A
Other languages
English (en)
Other versions
FR2638538A1 (fr
Inventor
Zvi Bendat
David A Leggett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Optical Corp
Original Assignee
American Optical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Optical Corp filed Critical American Optical Corp
Publication of FR2638538A1 publication Critical patent/FR2638538A1/fr
Application granted granted Critical
Publication of FR2638538B1 publication Critical patent/FR2638538B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
FR898914177A 1988-10-28 1989-10-27 Instrument d'alignement et d'interconnexion et son procede d'application Expired - Fee Related FR2638538B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/263,709 US4899921A (en) 1988-10-28 1988-10-28 Aligner bonder

Publications (2)

Publication Number Publication Date
FR2638538A1 FR2638538A1 (fr) 1990-05-04
FR2638538B1 true FR2638538B1 (fr) 1991-12-27

Family

ID=23002932

Family Applications (1)

Application Number Title Priority Date Filing Date
FR898914177A Expired - Fee Related FR2638538B1 (fr) 1988-10-28 1989-10-27 Instrument d'alignement et d'interconnexion et son procede d'application

Country Status (3)

Country Link
US (1) US4899921A (fr)
JP (1) JPH0628272B2 (fr)
FR (1) FR2638538B1 (fr)

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US5861678A (en) * 1997-12-23 1999-01-19 Micron Technology, Inc. Method and system for attaching semiconductor dice to substrates
US6168971B1 (en) * 1998-05-05 2001-01-02 Fujitsu Limited Method of assembling thin film jumper connectors to a substrate
JP3282800B2 (ja) * 1998-05-20 2002-05-20 東京エレクトロン株式会社 アライナー
US6208419B1 (en) * 1998-11-18 2001-03-27 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
JP3504166B2 (ja) * 1998-11-25 2004-03-08 株式会社新川 フリップチップボンディング装置
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US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
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US6426552B1 (en) * 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
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JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5876000B2 (ja) * 2012-06-11 2016-03-02 株式会社新川 ボンディング装置およびボンディング方法
JP6417540B2 (ja) * 2014-10-31 2018-11-07 パナソニックＩｐマネジメント株式会社 部品実装装置
CN107664833B (zh) * 2016-07-29 2020-10-16 上海微电子装备（集团）股份有限公司 一种用于基片对准的机器视觉系统及对准装置
JP7149453B2 (ja) * 2018-05-14 2022-10-07 パナソニックＩｐマネジメント株式会社 ボンディング装置
JP7113170B2 (ja) * 2018-05-14 2022-08-05 パナソニックＩｐマネジメント株式会社 ボンディング装置
JP7113169B2 (ja) * 2018-05-14 2022-08-05 パナソニックＩｐマネジメント株式会社 ボンディング装置
CN108663779A (zh) * 2018-07-27 2018-10-16 广东阿达智能装备有限公司 两路光路的光学镜头

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Also Published As

Publication number Publication date
US4899921A (en) 1990-02-13
FR2638538A1 (fr) 1990-05-04
JPH02244649A (ja) 1990-09-28
JPH0628272B2 (ja) 1994-04-13

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