JPS5487177A - Component positioning unit - Google Patents

Component positioning unit

Info

Publication number
JPS5487177A
JPS5487177A JP15512477A JP15512477A JPS5487177A JP S5487177 A JPS5487177 A JP S5487177A JP 15512477 A JP15512477 A JP 15512477A JP 15512477 A JP15512477 A JP 15512477A JP S5487177 A JPS5487177 A JP S5487177A
Authority
JP
Japan
Prior art keywords
mirror
reflected
screen
lens
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15512477A
Other languages
Japanese (ja)
Other versions
JPS5754936B2 (en
Inventor
Masao Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15512477A priority Critical patent/JPS5487177A/en
Publication of JPS5487177A publication Critical patent/JPS5487177A/en
Publication of JPS5754936B2 publication Critical patent/JPS5754936B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform positioning with image formation on the screen, by overlapping the incident lights from the components and the circuit board through the use of mirror and half mirror.
CONSTITUTION: The back image of components 2 incident from the lens 12 is reflected at the mirror 8, it is reflected on the half mirror 7 and mirror 10 via the lenses 14 and 16, and is projected on the screen 4 with magnification by the lens 18. The image of the bonding pad 3 on the circuit board 1 is reflected with the mirror 9, further reflected with the mirror 11 via the lenses 15 and 17, passes through the half mirror 7, reflected on the mirror 10 and is projected on the screen via the lens 18. The worker observes the screen 4 and positions component leads at the center on the pad 3 on the circuit board 1. With this method, fatigue by the worker is less and the components can correctly be positioned.
COPYRIGHT: (C)1979,JPO&Japio
JP15512477A 1977-12-23 1977-12-23 Component positioning unit Granted JPS5487177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15512477A JPS5487177A (en) 1977-12-23 1977-12-23 Component positioning unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15512477A JPS5487177A (en) 1977-12-23 1977-12-23 Component positioning unit

Publications (2)

Publication Number Publication Date
JPS5487177A true JPS5487177A (en) 1979-07-11
JPS5754936B2 JPS5754936B2 (en) 1982-11-20

Family

ID=15599074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15512477A Granted JPS5487177A (en) 1977-12-23 1977-12-23 Component positioning unit

Country Status (1)

Country Link
JP (1) JPS5487177A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173950A (en) * 1981-04-17 1982-10-26 Citizen Watch Co Ltd Flip chip bonder
JPS57206037A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Device for positioning of flip chip
US4617306A (en) * 1983-04-22 1986-10-14 Sandoz Ltd. Pharmaceutical preparation comprising co-dergocrine and a calcium antagonist
JPH02244649A (en) * 1988-10-28 1990-09-28 A O Inc Aligument/junction device
JPH0843057A (en) * 1994-07-28 1996-02-16 Copal Co Ltd Apparatus for confirming alignment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3667848A (en) * 1970-02-02 1972-06-06 Ncr Co Semiconductor chip bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3667848A (en) * 1970-02-02 1972-06-06 Ncr Co Semiconductor chip bonding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173950A (en) * 1981-04-17 1982-10-26 Citizen Watch Co Ltd Flip chip bonder
JPS57206037A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Device for positioning of flip chip
US4617306A (en) * 1983-04-22 1986-10-14 Sandoz Ltd. Pharmaceutical preparation comprising co-dergocrine and a calcium antagonist
JPH02244649A (en) * 1988-10-28 1990-09-28 A O Inc Aligument/junction device
JPH0843057A (en) * 1994-07-28 1996-02-16 Copal Co Ltd Apparatus for confirming alignment

Also Published As

Publication number Publication date
JPS5754936B2 (en) 1982-11-20

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