FR2637762B1 - Enroulement pour puce electronique et son procede de fabrication - Google Patents

Enroulement pour puce electronique et son procede de fabrication

Info

Publication number
FR2637762B1
FR2637762B1 FR898911030A FR8911030A FR2637762B1 FR 2637762 B1 FR2637762 B1 FR 2637762B1 FR 898911030 A FR898911030 A FR 898911030A FR 8911030 A FR8911030 A FR 8911030A FR 2637762 B1 FR2637762 B1 FR 2637762B1
Authority
FR
France
Prior art keywords
winding
manufacturing
electronic chip
chip
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR898911030A
Other languages
English (en)
Other versions
FR2637762A1 (fr
Inventor
Osamu Kano
Atsuo Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of FR2637762A1 publication Critical patent/FR2637762A1/fr
Application granted granted Critical
Publication of FR2637762B1 publication Critical patent/FR2637762B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
FR898911030A 1988-08-19 1989-08-18 Enroulement pour puce electronique et son procede de fabrication Expired - Lifetime FR2637762B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63206951A JP2615151B2 (ja) 1988-08-19 1988-08-19 チップ型コイル及びその製造方法

Publications (2)

Publication Number Publication Date
FR2637762A1 FR2637762A1 (fr) 1990-04-13
FR2637762B1 true FR2637762B1 (fr) 1992-11-27

Family

ID=16531722

Family Applications (1)

Application Number Title Priority Date Filing Date
FR898911030A Expired - Lifetime FR2637762B1 (fr) 1988-08-19 1989-08-18 Enroulement pour puce electronique et son procede de fabrication

Country Status (5)

Country Link
US (2) US5071509A (fr)
JP (1) JP2615151B2 (fr)
DE (1) DE3927181C2 (fr)
FR (1) FR2637762B1 (fr)
GB (1) GB2223624B (fr)

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DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
CA2062710C (fr) * 1991-05-31 1996-05-14 Nobuo Shiga Transformateur pour circuit integre hyperfrequence monolithique
JPH05101938A (ja) * 1991-10-03 1993-04-23 Murata Mfg Co Ltd 積層型コイル及びその製造方法
US5300168A (en) * 1991-12-12 1994-04-05 Hitachi Zosen Corporation Apparatus and method for folding sheet-form material
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
FR2688929B1 (fr) * 1992-03-23 1994-05-20 Xeram Procede d'obtention d'inserts ceramiques isolants par empilement multicouches.
JPH06163270A (ja) * 1992-11-19 1994-06-10 Murata Mfg Co Ltd 多層基板
JPH06314622A (ja) * 1993-04-30 1994-11-08 Murata Mfg Co Ltd チップ型回路部品及びその製造方法
US5370766A (en) * 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
DE4431603A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Antennenspule
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
KR100211814B1 (ko) * 1995-11-30 1999-08-02 전주범 플라이백 트랜스포머의 가요성 2차코일 권선구조와 그 제조방법
JPH09213530A (ja) * 1996-01-30 1997-08-15 Alps Electric Co Ltd 平面トランス
DE19608913A1 (de) * 1996-03-07 1997-09-11 Gw Elektronik Gmbh Hochfrequenzübertrager und Verfahren zu seiner Herstellung
JP3029124U (ja) * 1996-03-19 1996-09-27 株式会社フジタ 壁面剥離診断機
DE19629269A1 (de) * 1996-07-19 1998-01-29 Siemens Ag Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauteils, insbesondere zur Herstellung einer Induktionsspule für Chipkarten
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
US5903525A (en) * 1997-04-18 1999-05-11 Read-Rite Corporation Coil for use with magneto-optical head
US6194248B1 (en) * 1997-09-02 2001-02-27 Murata Manufacturing Co., Ltd. Chip electronic part
US5922514A (en) * 1997-09-17 1999-07-13 Dale Electronics, Inc. Thick film low value high frequency inductor, and method of making the same
US5978319A (en) * 1997-11-06 1999-11-02 Read-Rite Corporation Thin electro-magnetic coil assembly for attachment to a slider
US6825748B1 (en) * 1998-03-13 2004-11-30 Matsushita Electric Industrial Co., Ltd. Module and method of manufacture
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6285272B1 (en) 1999-10-28 2001-09-04 Coilcraft, Incorporated Low profile inductive component
US6404615B1 (en) 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors
JP2001244123A (ja) * 2000-02-28 2001-09-07 Kawatetsu Mining Co Ltd 表面実装型平面磁気素子及びその製造方法
US6486530B1 (en) 2000-10-16 2002-11-26 Intarsia Corporation Integration of anodized metal capacitors and high temperature deposition capacitors
JP2005005287A (ja) * 2003-06-09 2005-01-06 Matsushita Electric Ind Co Ltd インダクタンス部品とそれを用いた電子機器
US20050251234A1 (en) 2004-05-07 2005-11-10 John Kanzius Systems and methods for RF-induced hyperthermia using biological cells and nanoparticles as RF enhancer carriers
US7933399B2 (en) * 2005-03-22 2011-04-26 At&T Intellectual Property I, L.P. System and method for utilizing virtual agents in an interactive voice response application
US7511356B2 (en) * 2005-08-31 2009-03-31 Micron Technology, Inc. Voltage-controlled semiconductor inductor and method
US8941457B2 (en) * 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
JP4947637B2 (ja) * 2007-01-09 2012-06-06 ソニーモバイルコミュニケーションズ株式会社 無接点電力伝送コイル、携帯端末及び端末充電装置
JP2009010559A (ja) * 2007-06-27 2009-01-15 Nippon Dempa Kogyo Co Ltd 圧電部品及びその製造方法
JP5195876B2 (ja) * 2010-11-10 2013-05-15 Ｔｄｋ株式会社 コイル部品及びその製造方法
JP2013145869A (ja) * 2011-12-15 2013-07-25 Taiyo Yuden Co Ltd 積層電子部品及びその製造方法
US10236115B2 (en) * 2014-06-16 2019-03-19 Stmicroelectronics S.R.L. Integrated transformer
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
KR20220009212A (ko) * 2020-07-15 2022-01-24 삼성전기주식회사 코일 부품
US20220244638A1 (en) * 2021-01-29 2022-08-04 Texas Instruments Incorporated Conductive patterning using a permanent resist

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US2884571A (en) * 1952-07-12 1959-04-28 Sylvania Electric Prod Printed circuit
US3247314A (en) * 1962-12-31 1966-04-19 Engelhard Ind Inc Composite electric circuit
US3413716A (en) * 1965-04-30 1968-12-03 Xerox Corp Thin-film inductor elements
US3584376A (en) * 1968-10-25 1971-06-15 Sprague Electric Co Microstrip delay line and a method of manufacturing same
BE785747A (fr) * 1971-07-02 1973-01-02 Philips Nv Dispositif semiconducteur
JPS4978159A (fr) * 1972-12-05 1974-07-27
US3913219A (en) * 1974-05-24 1975-10-21 Lichtblau G J Planar circuit fabrication process
US4016519A (en) * 1976-05-14 1977-04-05 Blaupunkt-Werke Gmbh Printed circuit coils
US4285001A (en) * 1978-12-26 1981-08-18 Board Of Trustees Of Leland Stanford Jr. University Monolithic distributed resistor-capacitor device and circuit utilizing polycrystalline semiconductor material
JPS55110009A (en) * 1979-02-16 1980-08-25 Tohoku Metal Ind Ltd Inductance element
JPS5935165B2 (ja) * 1979-11-24 1984-08-27 ヤマハ株式会社 多層薄膜コイルの製法
JPS5691406A (en) * 1979-12-26 1981-07-24 Hitachi Ltd Thin film coil
US4392013A (en) * 1979-12-27 1983-07-05 Asahi Kasei Kogyo Kabushiki Kaisha Fine-patterned thick film conductor structure and manufacturing method thereof
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
DE3169754D1 (en) * 1980-12-09 1985-05-09 Matsushita Electric Ind Co Ltd Lamination-wound chip coil and method for manufacturing the same
JPS59210658A (ja) * 1983-05-16 1984-11-29 Nec Corp 半導体装置の製造方法
JPS6015905A (ja) * 1983-07-07 1985-01-26 Murata Mfg Co Ltd 誘導性部品
US4696100A (en) * 1985-02-21 1987-09-29 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chip coil
JPS60246605A (ja) * 1985-02-26 1985-12-06 Nippon Gakki Seizo Kk コイル体
JPS6261305A (ja) * 1985-09-11 1987-03-18 Murata Mfg Co Ltd 積層チツプコイル
US4873757A (en) * 1987-07-08 1989-10-17 The Foxboro Company Method of making a multilayer electrical coil
JP2982193B2 (ja) * 1989-12-28 1999-11-22 株式会社村田製作所 高周波コイルの製造方法
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor

Also Published As

Publication number Publication date
FR2637762A1 (fr) 1990-04-13
JP2615151B2 (ja) 1997-05-28
US5071509A (en) 1991-12-10
JPH0254903A (ja) 1990-02-23
US5598136A (en) 1997-01-28
DE3927181A1 (de) 1990-03-01
GB8918716D0 (en) 1989-09-27
GB2223624B (en) 1993-03-24
DE3927181C2 (de) 1993-11-11
GB2223624A (en) 1990-04-11

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