FR2513476B1 - Plaquette a circuit a plusieurs couches et son procede de fabrication - Google Patents

Plaquette a circuit a plusieurs couches et son procede de fabrication

Info

Publication number
FR2513476B1
FR2513476B1 FR8214598A FR8214598A FR2513476B1 FR 2513476 B1 FR2513476 B1 FR 2513476B1 FR 8214598 A FR8214598 A FR 8214598A FR 8214598 A FR8214598 A FR 8214598A FR 2513476 B1 FR2513476 B1 FR 2513476B1
Authority
FR
France
Prior art keywords
manufacturing
circuit board
layered circuit
layered
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8214598A
Other languages
English (en)
Other versions
FR2513476A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wilhelm Ruf KG
Original Assignee
Wilhelm Ruf KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wilhelm Ruf KG filed Critical Wilhelm Ruf KG
Publication of FR2513476A1 publication Critical patent/FR2513476A1/fr
Application granted granted Critical
Publication of FR2513476B1 publication Critical patent/FR2513476B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4685Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR8214598A 1981-09-18 1982-08-25 Plaquette a circuit a plusieurs couches et son procede de fabrication Expired FR2513476B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3137279A DE3137279C2 (de) 1981-09-18 1981-09-18 Verfahren zur Herstellung von Mehrlagen-Leiterplatten sowie nach dem Verfahren hergestellte mehrlagige Leiterplatte

Publications (2)

Publication Number Publication Date
FR2513476A1 FR2513476A1 (fr) 1983-03-25
FR2513476B1 true FR2513476B1 (fr) 1985-06-14

Family

ID=6142102

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8214598A Expired FR2513476B1 (fr) 1981-09-18 1982-08-25 Plaquette a circuit a plusieurs couches et son procede de fabrication

Country Status (3)

Country Link
US (1) US4520228A (fr)
DE (1) DE3137279C2 (fr)
FR (1) FR2513476B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586105A (en) * 1985-08-02 1986-04-29 General Motors Corporation High voltage protection device with a tape covered spark gap
US4783578A (en) * 1986-08-22 1988-11-08 Flexwatt Corporation Multi-conductor cables
DE3719219A1 (de) * 1987-06-09 1988-12-22 Grundig Emv Verfahren zur herstellung einer leiterplatte
US6059983A (en) * 1997-09-23 2000-05-09 Hewlett-Packard Company Method for fabricating an overcoated printed circuit board with contaminant-free areas
US5969924A (en) * 1997-09-23 1999-10-19 Hewlett Packard Company Spark gap for overcoated printed circuit boards
US7282647B2 (en) * 2002-12-23 2007-10-16 Intel Corporation Apparatus for improving coupling across plane discontinuities on circuit boards
GB0316351D0 (en) * 2003-07-12 2003-08-13 Hewlett Packard Development Co A cross-over of conductive interconnects and a method of crossing conductive interconnects
US20130161083A1 (en) * 2011-12-22 2013-06-27 Tyco Electronics Corporation Printed circuit boards and methods of manufacturing printed circuit boards
CN204480832U (zh) 2014-03-10 2015-07-15 台湾艾华电子工业股份有限公司 触控式可变电阻结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB635947A (en) * 1947-10-30 1950-04-19 Alfred Gordon Clarke Improvements in or relating to methods of making electrical conducting patterns suchas wiring circuits for radio receivers
US3167490A (en) * 1957-07-17 1965-01-26 Friedman Abraham Printed circuit
US3560256A (en) * 1966-10-06 1971-02-02 Western Electric Co Combined thick and thin film circuits
DE1924775B2 (de) * 1969-05-14 1971-06-09 Verfahren zur herstellung einer leiterplatte
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing
US3998677A (en) * 1974-11-21 1976-12-21 Western Electric Company, Inc. Technique for using solder etch resist in generation of patterns on printed wiring boards
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
DE3013667C2 (de) * 1980-04-09 1983-01-20 Wilhelm Ruf KG, 8000 München Leiterplatte und Verfahren zu deren Herstellung
DE3014041C2 (de) * 1980-04-11 1982-04-08 Braun Ag, 6000 Frankfurt Verfahren zur Aufbringung von elektrisch leitenden Bahnen auf einen Träger aus Isolierstoff

Also Published As

Publication number Publication date
US4520228A (en) 1985-05-28
DE3137279A1 (de) 1983-04-14
DE3137279C2 (de) 1986-12-11
FR2513476A1 (fr) 1983-03-25

Similar Documents

Publication Publication Date Title
FR2482818B1 (fr) Circuit integre ceramique multicouche et son procede de fabrication
BE895124A (fr) Pochemedicale et son procede de fabrication
BE890506A (fr) Procede electronique de reperage et son procede de fabrication
FR2595000B1 (fr) Resistance du type en puce et son procede de fabrication
FR2525007B1 (fr) Carte d'identification a plusieurs couches et son procede de fabrication
FR2531010B1 (fr) Stratifie decoratif et son procede de fabrication
FR2520352B1 (fr) Structure composite de type refractaire-refractaire et son procede de fabrication
FR2614168B1 (fr) Dispositif a circuits electroniques multicouches et son procede de fabrication
FR2555408B2 (fr) Collier insecticide et son procede de fabrication
FR2572214B1 (fr) Element inductif et son procede de fabrication
FR2504957B1 (fr) Element de construction et son procede de fabrication
KR860005568A (ko) 전자장치 및 그의 제조방법
FR2476913B1 (fr) Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
FR2430165B1 (fr) Plaquette a circuit et son procede de fabrication
FR2542372B1 (fr) Culbuteur et son procede de fabrication
FR2531009B1 (fr) Stratifie decoratif et son procede de fabrication
FR2611402B1 (fr) Resistance composite et son procede de fabrication
FR2513476B1 (fr) Plaquette a circuit a plusieurs couches et son procede de fabrication
FR2498125B1 (fr) Stratifie revetu de cuivre et procede de fabrication
FR2552596B1 (fr) Circuit multiplicateur de tension et son procede de fabrication
FR2529374B1 (fr) Element de circuit resistif et son procede de fabrication
BE890272A (fr) Circuit imprime et son procede de fabrication
FR2545269B1 (fr) Ecran electroluminescent et son procede de fabrication
DE3269431D1 (en) Thin layered electronic circuit and manufacturing method thereof
FR2541513B1 (fr) Thyristor auto-protege et son procede de fabrication

Legal Events

Date Code Title Description
ST Notification of lapse
AR Application made for restoration
BR Restoration of rights
ST Notification of lapse