FR2476913B1 - Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit - Google Patents
Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuitInfo
- Publication number
- FR2476913B1 FR2476913B1 FR8103559A FR8103559A FR2476913B1 FR 2476913 B1 FR2476913 B1 FR 2476913B1 FR 8103559 A FR8103559 A FR 8103559A FR 8103559 A FR8103559 A FR 8103559A FR 2476913 B1 FR2476913 B1 FR 2476913B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- same
- scale integration
- layered circuit
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/016—Thin-film circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2247180A JPS56118396A (en) | 1980-02-25 | 1980-02-25 | Method of forming conductive layer of circuit board |
JP2247280A JPS56118397A (en) | 1980-02-25 | 1980-02-25 | Method of forming conductive layer of circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2476913A1 FR2476913A1 (fr) | 1981-08-28 |
FR2476913B1 true FR2476913B1 (fr) | 1985-09-13 |
Family
ID=26359700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8103559A Expired FR2476913B1 (fr) | 1980-02-25 | 1981-02-23 | Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit |
Country Status (2)
Country | Link |
---|---|
US (1) | US4434544A (fr) |
FR (1) | FR2476913B1 (fr) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494131A (en) * | 1980-10-31 | 1985-01-15 | Rikagaku Kenkyusho | Josephson junction element and method of making the same |
GB2111312A (en) * | 1981-11-04 | 1983-06-29 | Philips Electronic Associated | Substrates for electrical circuits |
US4628149A (en) * | 1981-11-30 | 1986-12-09 | Nippon Electric Co., Ltd. | Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals |
JPS5975695A (ja) * | 1982-10-23 | 1984-04-28 | 日本碍子株式会社 | セラミツク厚膜回路基板 |
DE3314879A1 (de) * | 1983-04-25 | 1984-10-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von stabilen, niederohmigen kontakten in integrierten halbleiterschaltungen |
US4657778A (en) * | 1984-08-01 | 1987-04-14 | Moran Peter L | Multilayer systems and their method of production |
US4772935A (en) * | 1984-12-19 | 1988-09-20 | Fairchild Semiconductor Corporation | Die bonding process |
US4866008A (en) * | 1987-12-11 | 1989-09-12 | Texas Instruments Incorporated | Methods for forming self-aligned conductive pillars on interconnects |
KR920005459B1 (ko) * | 1988-08-30 | 1992-07-04 | 가부시기가이샤 히다찌세이사꾸쇼 | 금속의 균질화방법 및 회로기판 |
GB2233494A (en) * | 1989-06-26 | 1991-01-09 | Philips Nv | Providing an electrode on a semiconductor device |
US5358902A (en) * | 1989-06-26 | 1994-10-25 | U.S. Philips Corporation | Method of producing conductive pillars in semiconductor device |
GB2233820A (en) * | 1989-06-26 | 1991-01-16 | Philips Nv | Providing an electrode on a semiconductor device |
US5127998A (en) * | 1990-01-02 | 1992-07-07 | General Electric Company | Area-selective metallization process |
JP2551224B2 (ja) * | 1990-10-17 | 1996-11-06 | 日本電気株式会社 | 多層配線基板および多層配線基板の製造方法 |
US5143867A (en) * | 1991-02-13 | 1992-09-01 | International Business Machines Corporation | Method for depositing interconnection metallurgy using low temperature alloy processes |
JP3271272B2 (ja) * | 1991-11-12 | 2002-04-02 | 日本電気株式会社 | 半導体装置の製造方法 |
US5361967A (en) * | 1993-11-10 | 1994-11-08 | Motorola, Inc. | Monolithic circuit fabrication method |
US6586683B2 (en) * | 2001-04-27 | 2003-07-01 | International Business Machines Corporation | Printed circuit board with mixed metallurgy pads and method of fabrication |
CN102962639B (zh) * | 2012-11-10 | 2015-01-28 | 华中科技大学 | 一种真空扩散焊制备多层非晶合金微小零件的方法 |
US9147662B1 (en) * | 2013-12-20 | 2015-09-29 | Stats Chippac Ltd. | Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof |
JP6904094B2 (ja) * | 2016-06-23 | 2021-07-14 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
CN115537722B (zh) * | 2022-09-27 | 2023-08-11 | 深圳市黄金屋真空科技有限公司 | 同表面层导电黑和绝缘黑的制备工艺和产品 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3808049A (en) * | 1972-06-02 | 1974-04-30 | Microsystems Int Ltd | Multi-layer thin-film circuits |
DE2554691C2 (de) * | 1974-12-10 | 1982-11-18 | Western Electric Co., Inc., 10038 New York, N.Y. | Verfahren zum Herstellen elektrischer Leiter auf einem isolierenden Substrat und danach hergestellte Dünnschichtschaltung |
-
1981
- 1981-02-23 FR FR8103559A patent/FR2476913B1/fr not_active Expired
-
1982
- 1982-09-30 US US06/429,636 patent/US4434544A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4434544A (en) | 1984-03-06 |
FR2476913A1 (fr) | 1981-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |