FR2598584B1 - Dispositif de fabrication de plaquettes a circuits traces - Google Patents

Dispositif de fabrication de plaquettes a circuits traces

Info

Publication number
FR2598584B1
FR2598584B1 FR868609788A FR8609788A FR2598584B1 FR 2598584 B1 FR2598584 B1 FR 2598584B1 FR 868609788 A FR868609788 A FR 868609788A FR 8609788 A FR8609788 A FR 8609788A FR 2598584 B1 FR2598584 B1 FR 2598584B1
Authority
FR
France
Prior art keywords
conductor
pressure
fixing
engaging
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR868609788A
Other languages
English (en)
French (fr)
Other versions
FR2598584A1 (fr
Inventor
Bryan E Swiggett
Ronald Morino
Raymond J Keogh
Jonathan Clark Crowell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2598584A1 publication Critical patent/FR2598584A1/fr
Application granted granted Critical
Publication of FR2598584B1 publication Critical patent/FR2598584B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1788—Work traversing type and/or means applying work to wall or static structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Dicing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR868609788A 1985-07-19 1986-07-04 Dispositif de fabrication de plaquettes a circuits traces Expired - Fee Related FR2598584B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/756,690 US4693778A (en) 1985-07-19 1985-07-19 Apparatus for making scribed circuit boards and circuit board modifications

Publications (2)

Publication Number Publication Date
FR2598584A1 FR2598584A1 (fr) 1987-11-13
FR2598584B1 true FR2598584B1 (fr) 1991-04-26

Family

ID=25044637

Family Applications (1)

Application Number Title Priority Date Filing Date
FR868609788A Expired - Fee Related FR2598584B1 (fr) 1985-07-19 1986-07-04 Dispositif de fabrication de plaquettes a circuits traces

Country Status (9)

Country Link
US (1) US4693778A (enExample)
EP (1) EP0210520B1 (enExample)
JP (1) JPH0795622B2 (enExample)
AT (1) ATE61707T1 (enExample)
AU (1) AU595519B2 (enExample)
CA (1) CA1251577A (enExample)
DE (2) DE3678058D1 (enExample)
FR (1) FR2598584B1 (enExample)
GB (1) GB2180175B (enExample)

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US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
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US6249234B1 (en) 1994-05-14 2001-06-19 Absolute Sensors Limited Position detector
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AU2003232360A1 (en) 2002-06-05 2003-12-22 Synaptics (Uk) Limited Signal transfer method and apparatus
GB0317370D0 (en) 2003-07-24 2003-08-27 Synaptics Uk Ltd Magnetic calibration array
GB0319945D0 (en) 2003-08-26 2003-09-24 Synaptics Uk Ltd Inductive sensing system
JP3998204B2 (ja) * 2003-09-17 2007-10-24 壽一 久保 光ファイバ配線方法およびその装置
DE602005017602D1 (de) * 2004-02-18 2009-12-24 Hitachi Chemical Co Ltd Mikrofluidische Einheit mit Hohlfaser-Kanal
EP1807239A2 (de) * 2004-11-02 2007-07-18 Imasys AG Verlegevorrichtung, kontaktiervorrichtung, zustellsystem, verlege- und kontaktiereinheit herstellungsanlage, verfahren zur herstellung und eine transpondereinheit
US8480970B2 (en) * 2004-11-30 2013-07-09 Hitachi Chemical Co., Ltd. Analytical pretreatment device
JPWO2006062191A1 (ja) * 2004-12-09 2008-06-12 日立化成工業株式会社 マイクロ流体システム用支持ユニット及びその製造方法
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US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
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US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
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Also Published As

Publication number Publication date
CA1251577A (en) 1989-03-21
FR2598584A1 (fr) 1987-11-13
AU6035186A (en) 1987-01-22
JPS6271292A (ja) 1987-04-01
ATE61707T1 (de) 1991-03-15
US4693778A (en) 1987-09-15
JPH0795622B2 (ja) 1995-10-11
DE3624632C2 (enExample) 1991-04-25
AU595519B2 (en) 1990-04-05
EP0210520A3 (en) 1988-08-03
GB8617365D0 (en) 1986-08-20
EP0210520A2 (en) 1987-02-04
GB2180175B (en) 1989-07-19
GB2180175A (en) 1987-03-25
DE3678058D1 (de) 1991-04-18
DE3624632A1 (de) 1987-02-05
EP0210520B1 (en) 1991-03-13

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ST Notification of lapse