ATE61707T1 - Vorrichtung zur herstellung von ''geschriebenen'' leiterplatten und leiterplatten-modifikationen. - Google Patents

Vorrichtung zur herstellung von ''geschriebenen'' leiterplatten und leiterplatten-modifikationen.

Info

Publication number
ATE61707T1
ATE61707T1 AT86109607T AT86109607T ATE61707T1 AT E61707 T1 ATE61707 T1 AT E61707T1 AT 86109607 T AT86109607 T AT 86109607T AT 86109607 T AT86109607 T AT 86109607T AT E61707 T1 ATE61707 T1 AT E61707T1
Authority
AT
Austria
Prior art keywords
conductor
written
manufacture
pressure
fixing
Prior art date
Application number
AT86109607T
Other languages
English (en)
Inventor
Brian Edward Swiggett
Ronald Morino
Raymond J Keogh
Jonathan C Crowell
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Application granted granted Critical
Publication of ATE61707T1 publication Critical patent/ATE61707T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1788—Work traversing type and/or means applying work to wall or static structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Dicing (AREA)
AT86109607T 1985-07-19 1986-07-14 Vorrichtung zur herstellung von ''geschriebenen'' leiterplatten und leiterplatten-modifikationen. ATE61707T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/756,690 US4693778A (en) 1985-07-19 1985-07-19 Apparatus for making scribed circuit boards and circuit board modifications
EP86109607A EP0210520B1 (de) 1985-07-19 1986-07-14 Vorrichtung zur Herstellung von "geschriebenen" Leiterplatten und Leiterplatten-Modifikationen

Publications (1)

Publication Number Publication Date
ATE61707T1 true ATE61707T1 (de) 1991-03-15

Family

ID=25044637

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86109607T ATE61707T1 (de) 1985-07-19 1986-07-14 Vorrichtung zur herstellung von ''geschriebenen'' leiterplatten und leiterplatten-modifikationen.

Country Status (9)

Country Link
US (1) US4693778A (de)
EP (1) EP0210520B1 (de)
JP (1) JPH0795622B2 (de)
AT (1) ATE61707T1 (de)
AU (1) AU595519B2 (de)
CA (1) CA1251577A (de)
DE (2) DE3678058D1 (de)
FR (1) FR2598584B1 (de)
GB (1) GB2180175B (de)

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FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
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US6249234B1 (en) 1994-05-14 2001-06-19 Absolute Sensors Limited Position detector
US20030062889A1 (en) * 1996-12-12 2003-04-03 Synaptics (Uk) Limited Position detector
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JP3998204B2 (ja) * 2003-09-17 2007-10-24 壽一 久保 光ファイバ配線方法およびその装置
CN101722065A (zh) * 2004-02-18 2010-06-09 日立化成工业株式会社 微型流体系统用支撑单元
WO2006050691A2 (de) * 2004-11-02 2006-05-18 Imasys Ag Verlegevorrichtung, kontaktiervorrichtung, zustellsystem, verlege- und kontaktiereinheit herstellungsanlage, verfahren zur herstellung und eine transpondereinheit
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CN102172508A (zh) * 2004-12-09 2011-09-07 日立化成工业株式会社 微流体系统用支持单元及其制造方法
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US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
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DE102006053696A1 (de) * 2006-11-13 2008-05-29 Häusermann GmbH Anlage zur Herstellung einer Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen
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JP5353539B2 (ja) * 2009-08-05 2013-11-27 住友電装株式会社 電線布線用ヘッド装置及び電線布線装置
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DE102012107896A1 (de) * 2012-08-28 2014-03-06 Reinhausen Plasma Gmbh Verfahren und Vorrichtung zum Verbinden von Leitern mit Substraten
ITUA20161945A1 (it) * 2016-03-23 2017-09-23 Automation 4 Industiral Solutions S R L Procedimento ed apparato per applicare antenne per dispositivi rfid su un supporto laminare
DE102018214778A1 (de) * 2018-08-30 2020-03-05 Siemens Aktiengesellschaft Verfahren zur Fertigung von Leiterbahnen und Elektronikmodul
CN113102871A (zh) * 2021-04-09 2021-07-13 商志全 一种板材等离子切割机床

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Also Published As

Publication number Publication date
DE3678058D1 (de) 1991-04-18
EP0210520B1 (de) 1991-03-13
EP0210520A2 (de) 1987-02-04
DE3624632A1 (de) 1987-02-05
US4693778A (en) 1987-09-15
JPS6271292A (ja) 1987-04-01
JPH0795622B2 (ja) 1995-10-11
FR2598584A1 (fr) 1987-11-13
EP0210520A3 (en) 1988-08-03
GB2180175A (en) 1987-03-25
AU595519B2 (en) 1990-04-05
GB2180175B (en) 1989-07-19
FR2598584B1 (fr) 1991-04-26
DE3624632C2 (de) 1991-04-25
CA1251577A (en) 1989-03-21
GB8617365D0 (en) 1986-08-20
AU6035186A (en) 1987-01-22

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Legal Events

Date Code Title Description
EEIH Change in the person of patent owner
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties