DE3668091D1 - Anschlussband fuer die herstellung von elektrischen bauelementen in chipbauweise und verfahren zur herstellung dieser bauelemente. - Google Patents

Anschlussband fuer die herstellung von elektrischen bauelementen in chipbauweise und verfahren zur herstellung dieser bauelemente.

Info

Publication number
DE3668091D1
DE3668091D1 DE8686400920T DE3668091T DE3668091D1 DE 3668091 D1 DE3668091 D1 DE 3668091D1 DE 8686400920 T DE8686400920 T DE 8686400920T DE 3668091 T DE3668091 T DE 3668091T DE 3668091 D1 DE3668091 D1 DE 3668091D1
Authority
DE
Germany
Prior art keywords
production
components
chip design
connection tape
electrical components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686400920T
Other languages
English (en)
Inventor
Gilles Bernard
Francois Delalande
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP COMPOSANTS ELECTRON
Original Assignee
EUROP COMPOSANTS ELECTRON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP COMPOSANTS ELECTRON filed Critical EUROP COMPOSANTS ELECTRON
Application granted granted Critical
Publication of DE3668091D1 publication Critical patent/DE3668091D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
    • Y10T428/12194—For severing perpendicular to longitudinal dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y10T428/12368—Struck-out portion type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Ceramic Capacitors (AREA)
DE8686400920T 1985-05-10 1986-04-25 Anschlussband fuer die herstellung von elektrischen bauelementen in chipbauweise und verfahren zur herstellung dieser bauelemente. Expired - Fee Related DE3668091D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8507148A FR2581827B1 (fr) 1985-05-10 1985-05-10 Bande de connexion pour la fabrication de composants electriques a report direct et procede de fabrication de ces composants

Publications (1)

Publication Number Publication Date
DE3668091D1 true DE3668091D1 (de) 1990-02-08

Family

ID=9319171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686400920T Expired - Fee Related DE3668091D1 (de) 1985-05-10 1986-04-25 Anschlussband fuer die herstellung von elektrischen bauelementen in chipbauweise und verfahren zur herstellung dieser bauelemente.

Country Status (5)

Country Link
US (1) US4715118A (de)
EP (1) EP0205360B1 (de)
JP (1) JPS6230306A (de)
DE (1) DE3668091D1 (de)
FR (1) FR2581827B1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4934048A (en) * 1985-06-07 1990-06-19 American Precision Industries Inc. Method of making surface mountable electronic device
JPS62245583A (ja) * 1986-04-17 1987-10-26 Fuji Photo Film Co Ltd 磁気テ−プカセツト用パツドの製造方法
FR2609207B1 (fr) * 1986-12-30 1989-10-20 Europ Composants Electron Barrette de connexions pour la fabrication de composants electriques
US4819115A (en) * 1988-01-28 1989-04-04 Westinghouse Electric Corp. End connections for wound capacitors and methods of making the same
FR2634414B1 (fr) * 1988-07-22 1990-10-19 Europ Composants Electron Dispositif d'injection de matiere plastique liquide dans un moule, en particulier de matiere thermodurcissable pour l'enrobage de composants electroniques
DE3829934C1 (en) * 1988-09-02 1990-02-22 Roederstein Spezialfabriken Fuer Bauelemente Der Elektronik Und Kondensatoren Der Starkstromtechnik Gmbh, 8300 Landshut, De Device for processing the plastic sheathing of electrical chip components on a carrier strip
FR2641905B1 (fr) * 1988-12-23 1991-03-15 Europ Composants Electron Bande de connexions pour assemblage en ligne de composants cms
FR2645338B1 (fr) * 1989-03-31 1991-06-07 Composants Electro Lcc Cie Eur Procede de fabrication d'anodes fil pour condensateurs electrolytiques et dispositif pour sa mise en oeuvre
US5263241A (en) * 1992-04-06 1993-11-23 Delco Electronics Corporation Apparatus useful in the manufacture of a pressure sensor assembly
DE4446566A1 (de) * 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
US5939955A (en) * 1997-06-10 1999-08-17 Bel Fuse, Inc. Assembly of inductors wound on bobbin of encapsulated electrical components
JP3412521B2 (ja) * 1998-07-10 2003-06-03 株式会社村田製作所 電子部品
EP1950775B1 (de) 1998-12-15 2013-07-03 Murata Manufacturing Co. Ltd. Monolithischer keramischer Kondensator
US6924967B1 (en) * 2004-04-30 2005-08-02 Alan Devoe Noninterdigitated mounting for interdigitated stacked capacitor and method
US7419084B2 (en) * 2004-11-24 2008-09-02 Xerox Corporation Mounting method for surface-mount components on a printed circuit board
US7898818B2 (en) * 2007-03-07 2011-03-01 Dell Products, Lp Variably orientated capacitive elements for printed circuit boards and method of manufacturing same
KR102142516B1 (ko) * 2018-09-04 2020-08-07 삼성전기주식회사 전자 부품

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4158218A (en) * 1977-09-19 1979-06-12 Union Carbide Corporation Ceramic capacitor device
US4333213A (en) * 1979-09-04 1982-06-08 Western Electric Company, Inc. Apparatus for bonding leads to capacitor blanks
GB2141583A (en) * 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors
DE3412492A1 (de) * 1984-04-03 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Elektrischer kondensator als chip-bauelement
US4578736A (en) * 1984-08-28 1986-03-25 At&T Technologies, Inc. Surface mounted electrical components and method of fabrication

Also Published As

Publication number Publication date
US4715118A (en) 1987-12-29
FR2581827A1 (fr) 1986-11-14
EP0205360A1 (de) 1986-12-17
JPS6230306A (ja) 1987-02-09
EP0205360B1 (de) 1990-01-03
FR2581827B1 (fr) 1989-04-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee