FR2396418A1 - Dispositif a semi-conducteurs integre dont les caracteristiques ne sont pas alterees par l'encapsulage - Google Patents

Dispositif a semi-conducteurs integre dont les caracteristiques ne sont pas alterees par l'encapsulage

Info

Publication number
FR2396418A1
FR2396418A1 FR7819525A FR7819525A FR2396418A1 FR 2396418 A1 FR2396418 A1 FR 2396418A1 FR 7819525 A FR7819525 A FR 7819525A FR 7819525 A FR7819525 A FR 7819525A FR 2396418 A1 FR2396418 A1 FR 2396418A1
Authority
FR
France
Prior art keywords
encapsulation
semiconductor device
affected
device whose
integrated semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7819525A
Other languages
English (en)
French (fr)
Other versions
FR2396418B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7662177A external-priority patent/JPS5412576A/ja
Priority claimed from JP8359277A external-priority patent/JPS5419379A/ja
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of FR2396418A1 publication Critical patent/FR2396418A1/fr
Application granted granted Critical
Publication of FR2396418B1 publication Critical patent/FR2396418B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/43—Resistors having PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR7819525A 1977-06-29 1978-06-29 Dispositif a semi-conducteurs integre dont les caracteristiques ne sont pas alterees par l'encapsulage Granted FR2396418A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7662177A JPS5412576A (en) 1977-06-29 1977-06-29 Semiconductor device
JP8359277A JPS5419379A (en) 1977-07-14 1977-07-14 Semiconductor device

Publications (2)

Publication Number Publication Date
FR2396418A1 true FR2396418A1 (fr) 1979-01-26
FR2396418B1 FR2396418B1 (enrdf_load_stackoverflow) 1985-02-15

Family

ID=26417758

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7819525A Granted FR2396418A1 (fr) 1977-06-29 1978-06-29 Dispositif a semi-conducteurs integre dont les caracteristiques ne sont pas alterees par l'encapsulage

Country Status (3)

Country Link
DE (1) DE2828607C3 (enrdf_load_stackoverflow)
FR (1) FR2396418A1 (enrdf_load_stackoverflow)
GB (1) GB2000638B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122134A (en) * 1980-02-29 1981-09-25 Toshiba Corp Resin-sealed type semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1951986A1 (de) * 1968-10-15 1970-04-16 Tokyo Shibaura Electric Co Halbleiter-Anordnung
FR2230083A1 (enrdf_load_stackoverflow) * 1973-05-18 1974-12-13 Philips Nv
FR2396417A1 (fr) * 1977-06-29 1979-01-26 Tokyo Shibaura Electric Co Composant semi-conducteur comprenant une resistance

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1465112A1 (de) * 1963-10-04 1969-01-23 Anritsu Electric Company Ltd Im Vakuum niedergeschlagene Halbleiterschichten fuer Elasto-Widerstandselemente
NL154867B (nl) * 1964-02-13 1977-10-17 Hitachi Ltd Werkwijze voor de vervaardiging van een halfgeleiderinrichting, alsmede volgens deze werkwijze vervaardigde veldeffect-transistor en planaire transistor.
GB1249317A (en) * 1968-11-19 1971-10-13 Mullard Ltd Semiconductor devices
US3965453A (en) * 1974-12-27 1976-06-22 Bell Telephone Laboratories, Incorporated Piezoresistor effects in semiconductor resistors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1951986A1 (de) * 1968-10-15 1970-04-16 Tokyo Shibaura Electric Co Halbleiter-Anordnung
FR2230083A1 (enrdf_load_stackoverflow) * 1973-05-18 1974-12-13 Philips Nv
FR2396417A1 (fr) * 1977-06-29 1979-01-26 Tokyo Shibaura Electric Co Composant semi-conducteur comprenant une resistance

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *
EXBK/77 *

Also Published As

Publication number Publication date
DE2828607C3 (de) 1982-08-12
FR2396418B1 (enrdf_load_stackoverflow) 1985-02-15
DE2828607A1 (de) 1979-01-04
DE2828607B2 (de) 1981-02-05
GB2000638B (en) 1982-01-20
GB2000638A (en) 1979-01-10

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Legal Events

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ST Notification of lapse