FR2434485A1 - Configuration de contact enfoui pour circuits integres cmos/sos - Google Patents

Configuration de contact enfoui pour circuits integres cmos/sos

Info

Publication number
FR2434485A1
FR2434485A1 FR7921291A FR7921291A FR2434485A1 FR 2434485 A1 FR2434485 A1 FR 2434485A1 FR 7921291 A FR7921291 A FR 7921291A FR 7921291 A FR7921291 A FR 7921291A FR 2434485 A1 FR2434485 A1 FR 2434485A1
Authority
FR
France
Prior art keywords
buried contact
contact configuration
integrated cmos
semiconductor
sos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7921291A
Other languages
English (en)
Other versions
FR2434485B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2434485A1 publication Critical patent/FR2434485A1/fr
Application granted granted Critical
Publication of FR2434485B1 publication Critical patent/FR2434485B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H01L21/86—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4825—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices, i.e. SOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

L'invention concerné une structure de circuit intégré comprenant au moins un dispositif semi-conducteur formé dans une couche d'un matériau semi-conducteur qui est sur un substrat en matériau isolant, le dispositif semi-conducteur ayant une région vers laquelle un contact électrique doit être fait, le contact étant fait directement par une interconnexion dopée et conductrice en semi-conducteur qui s'étend à travers une ouverture formée dans une couche isolante recouvrant la couche en matériau semi-conducteur. Selon l'invention, l'ouverture 20 a une forme choisie pour avoir au moins un côté qui n'est pas orthogonal ou parallèle à au moins un côté de l'interconnexion conductrice en semi-conducteur 18 qui est traversée par ce côté. L'invention s'applique notamment aux circuits intégrés CMOS/SOS.
FR7921291A 1978-08-25 1979-08-23 Configuration de contact enfoui pour circuits integres cmos/sos Expired FR2434485B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/936,779 US4196443A (en) 1978-08-25 1978-08-25 Buried contact configuration for CMOS/SOS integrated circuits

Publications (2)

Publication Number Publication Date
FR2434485A1 true FR2434485A1 (fr) 1980-03-21
FR2434485B1 FR2434485B1 (fr) 1985-07-19

Family

ID=25469067

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7921291A Expired FR2434485B1 (fr) 1978-08-25 1979-08-23 Configuration de contact enfoui pour circuits integres cmos/sos

Country Status (9)

Country Link
US (1) US4196443A (fr)
JP (1) JPS603780B2 (fr)
DE (1) DE2933694C2 (fr)
FR (1) FR2434485B1 (fr)
GB (1) GB2029097B (fr)
IN (1) IN150616B (fr)
IT (1) IT1122678B (fr)
SE (1) SE430837B (fr)
YU (1) YU41875B (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4289834A (en) * 1977-10-20 1981-09-15 Ibm Corporation Dense dry etched multi-level metallurgy with non-overlapped vias
US4724530A (en) * 1978-10-03 1988-02-09 Rca Corporation Five transistor CMOS memory cell including diodes
JPS5721838A (en) * 1980-07-15 1982-02-04 Toshiba Corp Semiconductor device
US4370669A (en) * 1980-07-16 1983-01-25 General Motors Corporation Reduced source capacitance ring-shaped IGFET load transistor in mesa-type integrated circuit
JPS57112027A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Manufacture of semiconductor device
US4373254A (en) * 1981-04-06 1983-02-15 Rca Corporation Method of fabricating buried contacts
US4353159A (en) * 1981-05-11 1982-10-12 Rca Corporation Method of forming self-aligned contact in semiconductor devices
US4463273A (en) * 1981-10-26 1984-07-31 Rca Corporation Electronic circuits and structures employing enhancement and depletion type IGFETs
US4547959A (en) * 1983-02-22 1985-10-22 General Motors Corporation Uses for buried contacts in integrated circuits
US4673965A (en) * 1983-02-22 1987-06-16 General Motors Corporation Uses for buried contacts in integrated circuits
GB2140203B (en) * 1983-03-15 1987-01-14 Canon Kk Thin film transistor with wiring layer continuous with the source and drain
US4512073A (en) * 1984-02-23 1985-04-23 Rca Corporation Method of forming self-aligned contact openings
JPS61166486A (ja) * 1985-01-17 1986-07-28 株式会社日立ビルシステムサービス エレベ−タ−の乗りかご
JPH03154341A (ja) * 1989-11-10 1991-07-02 Toshiba Corp 半導体装置
US5412239A (en) * 1993-05-14 1995-05-02 Siliconix Incorporated Contact geometry for improved lateral MOSFET
ES1024282Y (es) * 1993-05-20 1994-04-01 Rotoquim S L Maquina centrifugadora perfeccionada.
KR100276387B1 (ko) * 1998-01-08 2000-12-15 윤종용 반도체 장치의 자기정렬 콘택 형성 방법
US6166441A (en) * 1998-11-12 2000-12-26 Intel Corporation Method of forming a via overlap
US6396368B1 (en) 1999-11-10 2002-05-28 Hrl Laboratories, Llc CMOS-compatible MEM switches and method of making
US7217977B2 (en) * 2004-04-19 2007-05-15 Hrl Laboratories, Llc Covert transformation of transistor properties as a circuit protection method
US6815816B1 (en) 2000-10-25 2004-11-09 Hrl Laboratories, Llc Implanted hidden interconnections in a semiconductor device for preventing reverse engineering
US6791191B2 (en) 2001-01-24 2004-09-14 Hrl Laboratories, Llc Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations
US7294935B2 (en) * 2001-01-24 2007-11-13 Hrl Laboratories, Llc Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide
US6740942B2 (en) 2001-06-15 2004-05-25 Hrl Laboratories, Llc. Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact
US6774413B2 (en) * 2001-06-15 2004-08-10 Hrl Laboratories, Llc Integrated circuit structure with programmable connector/isolator
US6897535B2 (en) * 2002-05-14 2005-05-24 Hrl Laboratories, Llc Integrated circuit with reverse engineering protection
US7049667B2 (en) 2002-09-27 2006-05-23 Hrl Laboratories, Llc Conductive channel pseudo block process and circuit to inhibit reverse engineering
US6979606B2 (en) * 2002-11-22 2005-12-27 Hrl Laboratories, Llc Use of silicon block process step to camouflage a false transistor
AU2003293540A1 (en) * 2002-12-13 2004-07-09 Raytheon Company Integrated circuit modification using well implants
US7242063B1 (en) 2004-06-29 2007-07-10 Hrl Laboratories, Llc Symmetric non-intrusive and covert technique to render a transistor permanently non-operable
US8168487B2 (en) * 2006-09-28 2012-05-01 Hrl Laboratories, Llc Programmable connection and isolation of active regions in an integrated circuit using ambiguous features to confuse a reverse engineer
KR101371087B1 (ko) * 2011-06-29 2014-03-07 이형구 가압 또는 감압용기의 도어 자동실링장치
US20130320522A1 (en) * 2012-05-30 2013-12-05 Taiwan Semiconductor Manufacturing Company, Ltd. Re-distribution Layer Via Structure and Method of Making Same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2140007A1 (fr) * 1971-05-28 1973-01-12 Fujitsu Ltd
US3742315A (en) * 1971-10-18 1973-06-26 Matsushita Electronics Corp Schottky barrier type semiconductor device with improved backward breakdown voltage characteristic
FR2268361A1 (fr) * 1974-04-19 1975-11-14 Rca Corp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844830B1 (fr) * 1969-08-21 1973-12-27 Tokyo Shibaura Electric Co
CA1010158A (en) * 1973-01-05 1977-05-10 Westinghouse Electric Corporation Epitaxially grown silicon layers with relatively long minority carrier lifetimes
US4125854A (en) * 1976-12-02 1978-11-14 Mostek Corporation Symmetrical cell layout for static RAM

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2140007A1 (fr) * 1971-05-28 1973-01-12 Fujitsu Ltd
US3742315A (en) * 1971-10-18 1973-06-26 Matsushita Electronics Corp Schottky barrier type semiconductor device with improved backward breakdown voltage characteristic
FR2268361A1 (fr) * 1974-04-19 1975-11-14 Rca Corp

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/69 *
EXBK/70 *

Also Published As

Publication number Publication date
SE430837B (sv) 1983-12-12
JPS603780B2 (ja) 1985-01-30
GB2029097A (en) 1980-03-12
GB2029097B (en) 1983-01-12
IT7924855A0 (it) 1979-08-01
JPS5530894A (en) 1980-03-04
IN150616B (fr) 1982-11-13
YU41875B (en) 1988-02-29
YU192179A (en) 1982-06-30
SE7906085L (fr) 1980-02-26
DE2933694A1 (de) 1980-03-06
FR2434485B1 (fr) 1985-07-19
US4196443A (en) 1980-04-01
IT1122678B (it) 1986-04-23
DE2933694C2 (de) 1982-05-27

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