FR2361745A1 - Procede de fabrications de cabl - Google Patents

Procede de fabrications de cabl

Info

Publication number
FR2361745A1
FR2361745A1 FR7724603A FR7724603A FR2361745A1 FR 2361745 A1 FR2361745 A1 FR 2361745A1 FR 7724603 A FR7724603 A FR 7724603A FR 7724603 A FR7724603 A FR 7724603A FR 2361745 A1 FR2361745 A1 FR 2361745A1
Authority
FR
France
Prior art keywords
intermediate layer
cabl
manufacturing process
conductive level
cables
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7724603A
Other languages
English (en)
Other versions
FR2361745B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2361745A1 publication Critical patent/FR2361745A1/fr
Application granted granted Critical
Publication of FR2361745B1 publication Critical patent/FR2361745B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4821—Bridge structure with air gap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procédé pour la fabrication de câblages qui se croisent et que l'on utilise dans la technique dite << large scale integration >>. Après l'élaboration d'un niveau conducteur inférieur, on élabore sur la surface entière une couche intermédiaire formée par un métal. Ensuite, sur cette couche intermédiaire, on forme un niveau conducteur supérieur, après quoi, par sous-décapage, la couche intermédiaire est éloignée sélectivement, sauf à l'endroit des liaisons entre les deux niveaux conducteurs. Application aux circuits intégrés.
FR7724603A 1976-08-11 1977-08-10 Procede de fabrications de cabl Granted FR2361745A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7608901A NL7608901A (nl) 1976-08-11 1976-08-11 Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze.

Publications (2)

Publication Number Publication Date
FR2361745A1 true FR2361745A1 (fr) 1978-03-10
FR2361745B1 FR2361745B1 (fr) 1983-06-03

Family

ID=19826727

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7724603A Granted FR2361745A1 (fr) 1976-08-11 1977-08-10 Procede de fabrications de cabl

Country Status (15)

Country Link
US (1) US4308090A (fr)
JP (1) JPS5837992B2 (fr)
AU (1) AU509242B2 (fr)
CA (1) CA1090477A (fr)
CH (1) CH617037A5 (fr)
DD (1) DD132091A5 (fr)
DE (1) DE2734176A1 (fr)
FR (1) FR2361745A1 (fr)
GB (1) GB1584756A (fr)
HU (1) HU176861B (fr)
IT (1) IT1086058B (fr)
NL (1) NL7608901A (fr)
PL (1) PL200127A1 (fr)
SE (1) SE7708968L (fr)
SU (1) SU673206A3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2616965A1 (fr) * 1987-06-19 1988-12-23 Mitsubishi Electric Corp Interconnexion par montage en pont exterieur sur un substrat semi-conducteur

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL181611C (nl) * 1978-11-14 1987-09-16 Philips Nv Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem.
NL8303268A (nl) * 1983-09-23 1985-04-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd door toepassing van een dergelijke werkwijze.
US4924287A (en) * 1985-01-20 1990-05-08 Avner Pdahtzur Personalizable CMOS gate array device and technique
GB8518231D0 (en) * 1985-07-19 1985-08-29 Plessey Co Plc Producing layered structures
JPH0110467Y2 (fr) * 1985-10-19 1989-03-24
US4840923A (en) * 1986-04-30 1989-06-20 International Business Machine Corporation Simultaneous multiple level interconnection process
IL82113A (en) * 1987-04-05 1992-08-18 Zvi Orbach Fabrication of customized integrated circuits
US4922323A (en) * 1987-04-09 1990-05-01 Microelectronics And Computer Technology Corporation Hermetically sealed multilayer electrical feedthru
JPS63293860A (ja) * 1987-05-26 1988-11-30 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
JPS6481343A (en) * 1987-09-24 1989-03-27 Nec Corp Manufacture of integrated circuit
JPH01189939A (ja) * 1988-01-26 1989-07-31 Nec Corp 半導体集積回路
US5117276A (en) * 1989-08-14 1992-05-26 Fairchild Camera And Instrument Corp. High performance interconnect system for an integrated circuit
US5198385A (en) * 1991-01-11 1993-03-30 Harris Corporation Photolithographic formation of die-to-package airbridge in a semiconductor device
US5270574A (en) * 1991-08-01 1993-12-14 Texas Instruments Incorporated Vacuum micro-chamber for encapsulating a microelectronics device
JPH0656403U (ja) * 1993-01-18 1994-08-05 株式会社アンカー商事 パイプ材の仮止装置
KR970004922B1 (ko) * 1993-07-27 1997-04-08 삼성전자 주식회사 고집적 반도체 배선구조 및 그 제조방법
JP3156896B2 (ja) * 1994-01-28 2001-04-16 富士通株式会社 半導体装置の製造方法およびかかる製造方法により製造された半導体装置
JP3267049B2 (ja) * 1994-05-25 2002-03-18 株式会社村田製作所 エアブリッジ配線を有するスパイラルインダクタの製造方法
US20090038171A1 (en) * 2007-08-08 2009-02-12 International Business Machines Corporation Alignment tool for assembly of microprocessor board to server chassis
US9082624B2 (en) 2013-01-02 2015-07-14 International Business Machines Corporation Signal path of a multiple-patterned semiconductor device
US8866306B2 (en) 2013-01-02 2014-10-21 International Business Machines Corporation Signal path and method of manufacturing a multiple-patterned semiconductor device
US9099533B2 (en) 2013-07-02 2015-08-04 International Business Machines Corporation Semiconductor device with distinct multiple-patterned conductive tracks on a same level

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2009775A1 (fr) * 1968-05-31 1970-02-06 Westinghouse Electric Corp
NL7009522A (fr) * 1970-06-27 1971-12-29
FR2189869A1 (fr) * 1972-06-20 1974-01-25 Western Electric Co
US3890636A (en) * 1971-09-09 1975-06-17 Hitachi Ltd Multilayer wiring structure of integrated circuit and method of producing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647585A (en) * 1969-05-23 1972-03-07 Bell Telephone Labor Inc Method of eliminating pinhole shorts in an air-isolated crossover
US3715785A (en) * 1971-04-29 1973-02-13 Ibm Technique for fabricating integrated incandescent displays
JPS5146904B2 (fr) * 1971-09-30 1976-12-11

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2009775A1 (fr) * 1968-05-31 1970-02-06 Westinghouse Electric Corp
NL7009522A (fr) * 1970-06-27 1971-12-29
US3890636A (en) * 1971-09-09 1975-06-17 Hitachi Ltd Multilayer wiring structure of integrated circuit and method of producing the same
FR2189869A1 (fr) * 1972-06-20 1974-01-25 Western Electric Co

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2616965A1 (fr) * 1987-06-19 1988-12-23 Mitsubishi Electric Corp Interconnexion par montage en pont exterieur sur un substrat semi-conducteur
US4924289A (en) * 1987-06-19 1990-05-08 Mitsubishi Denki Kabushiki Kaisha Air bridge wiring for semiconductor devices

Also Published As

Publication number Publication date
SU673206A3 (ru) 1979-07-05
CH617037A5 (fr) 1980-04-30
HU176861B (en) 1981-05-28
PL200127A1 (pl) 1978-04-24
GB1584756A (en) 1981-02-18
JPS5321587A (en) 1978-02-28
AU509242B2 (en) 1980-05-01
DE2734176A1 (de) 1978-02-16
DD132091A5 (de) 1978-08-23
FR2361745B1 (fr) 1983-06-03
JPS5837992B2 (ja) 1983-08-19
NL7608901A (nl) 1978-02-14
IT1086058B (it) 1985-05-28
US4308090A (en) 1981-12-29
AU2769877A (en) 1979-02-15
SE7708968L (sv) 1978-02-12
CA1090477A (fr) 1980-11-25

Similar Documents

Publication Publication Date Title
FR2361745A1 (fr) Procede de fabrications de cabl
BE855162A (fr) Procede pour former des connexions au travers d&#39;une couche isolante dans la fabrication de circuits integres
DE19619921B4 (de) Verfahren zum Herstellen einer Halbleitervorrichtung mit Funktionselement und Schutzkappe
FR2404302A1 (fr) Procede pour fabriquer des contacts en relief sur des circuits micro-electroniques
DE10245179A1 (de) Leitungen auf mehreren Ebenen mit reduziertem Rasterabstand
FR2375336A1 (fr) Procede pour la realisation par voie chimique de couches de metaux
FR2396286A1 (fr) Procede et systeme interferometriques pour la mesure de la vitesse de decapage de surfaces opaques
KR900017172A (ko) 집적회로의 상호 접속배치 제조방법
FR2435819A1 (fr) Procede de production de circuits integres
FR2354577A1 (fr) Materiau et procede pour former un motif grave par irradiation notamment en vue de la fabrication d&#39;elements semi-conducteurs et de circuits integres
FR2427689A1 (fr) Procede de fabrication de transistors a effet de champ
FR2356739A1 (fr) Procede de decapage a l&#39;aide d&#39;un plasma et dispositif obtenu
FR2371778A1 (fr) Dispositif semi-conducteur
KR910003783A (ko) 반도체장치 및 그 제조방법
FR2335950A1 (fr) Procede pour realiser la diffusion d&#39;une impurete dans un corps semi-conducteur
JPS6283481A (ja) マイクロメカニクスにおけるパタ−ン作成方法
JPS57109373A (en) Semiconductor device
JPS57103364A (en) Preparation of field-effect trasistor
DE19928291A1 (de) Sensorstruktur und Verfahren zur Verbindung von isolierten Strukturen
JPS60124941A (ja) 集積回路の製造法
JPS53125778A (en) Semiconductor device
DE102017119114B4 (de) Verfahren zur Haftungsvermeidung durch strukturierte Antihaftschicht
FR2380370A1 (fr) Procede et dispositif pour la mise en place d&#39;une couche de fils sur un produit allonge tel qu&#39;un cable et produit obtenu
DE10106715A1 (de) Mikromechanisches Bauelement und Verfahren zu seiner Herstellung
JPS533081A (en) Integrated circuit wiring method

Legal Events

Date Code Title Description
ST Notification of lapse